Acoustic wave device and electronic component

Patent metadata

Field	Value
Publication number	US-9548437-B2
Application number	US-201214239768-A
Country	US
Kind code	B2
Filing date	Aug 22, 2012
Priority date	Aug 22, 2011
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.

First claim

The invention claimed is:

1. An acoustic wave device comprising:
an element substrate;
excitation electrodes disposed on a main surface of the element substrate; and
a cover comprising:
a frame member disposed on the main surface of the element substrate, surrounding the excitation electrodes, and comprising an inner wall, a top surface and an outer wall; and
a lid member that is disposed on the top surface of the frame member, and that comprises a first surface, a second surface, and a descending part on the second surface, the first surface opposite to the second surface and the second surface facing the main surface, wherein
the descending part extends downward from the second surface of the lid member, and covers at least a part of the inner wall, wherein the descending part includes a third surface that contacts at least part of the inner wall, and a fourth surface that extends upwardly and obliquely toward the second surface and away from the inner wall.

2. The acoustic wave device according to claim 1 , wherein the descending part contacts the main surface of the element substrate.

3. The acoustic wave device according to claim 1 , further comprising a reinforcing layer composed of metal and disposed on the first surface of the lid member, the outer periphery thereof being disposed on the frame member.

4. The acoustic wave device according to claim 1 , wherein the outer wall of the frame member is inclined so as to spread progressively outward toward the main surface of the element substrate.

5. The acoustic wave device according to claim 4 , further comprising a sealing film that covers at least from the outer wall of the frame member to a side wall of the lid member.

6. The acoustic wave device according to claim 1 , wherein a side wall of the lid member is positioned further to the inside than the outer wall of the frame member.

7. The acoustic wave device according to claim 3 , further comprising:
pads disposed at a part of the main surface of the element substrate at which the lid member overlaps with the frame member, and electrically coupled to the excitation electrodes; and,
terminals extending from the pads and passing through the frame member and the lid member, and exposed at the first surface of the lid member on a side opposite from the element substrate, wherein
the lid member comprises a groove on a part of the first surface, wherein the part is located between the terminals and the inner wall of the frame member when seen in plan view, and
a part of the reinforcing layer is fit into the groove.

8. The acoustic wave device according to claim 1 , wherein the element substrate comprises a recessed part on the main surface in a region of the main surface outside the lower edge of the inner wall such that either a part thereof is disposed below the frame member or the entirety thereof is disposed outside the frame member when seen in plan view.

9. The acoustic wave device according to claim 1 , wherein the element substrate comprises a cutout disposed on the main surface between the vicinity of the lower edge of the outer wall of the frame member and side wall thereof.

10. The acoustic wave device according to claim 1 , wherein the frame member further comprises at least one of:
a first extending part extending inward from the inner wall along the main surface; and
a second extending part extending outward from the outer wall along the main surface of the element substrate.

11. An electronic component comprising:
a mounting substrate comprising a principal surface;
an electrically conductive bonding member on the principal surface;
an acoustic wave device according to claim 1 , on the electrically conductive bonding member, wherein the main surface of the element substrate faces the principal surface of the mounting substrate; and
molding resin covering the acoustic wave device.

12. The acoustic wave device according to claim 1 , wherein the lid member and the frame member form an enclosed oscillation space that contains the first and second electrodes, and wherein the lid member is integrally formed such that no path of infiltration into the oscillation space is formed in the lid.

13. An acoustic wave device comprising:
an element substrate;
excitation electrodes disposed on a main surface of the element substrate; and
a cover comprising:
a frame member disposed on the main surface of the element substrate, surrounding the excitation electrodes, and comprising an inner wall, a top surface and an outer wall; and
a lid member that is disposed on the top surface of the frame member, and that comprises a connection part on a bottom surface thereof, the bottom surface facing the main surface of the element substrate, wherein the lid member further comprises a descending part extending downwardly from the bottom surface, the descending part including a first surface that contacts at least part of the inner wall, and a second surface that extends upwardly and obliquely toward the bottom surface from the inner wall, and wherein

the frame member further comprises at least one of a first protrusion and a first recess on the top surface thereof,
the connection part comprises at least one of a second protrusion and a second recess on a lower surface thereof, and
the first protrusion fits in the second recess and the second protrusion fits in the first recess.

14. An electronic component comprising:
a mounting substrate comprising a principal surface;
an electrically conductive bonding member on the principal surface;
an acoustic wave device according to claim 13 on the electrically conductive bonding member, wherein the main surface faces the principal surface; and
molding resin covering the acoustic wave device.

15. An acoustic wave device comprising:
an element substrate;
excitation electrodes; and
a cover on a main surface of the element substrate, the cover covering the excitation electrodes: wherein
the cover comprising:
a frame member disposed on the main surface, surrounding the excitation electrodes, and comprising an inner wall, a top surface and an outer wall; and
a lid member that is disposed on the top surface, and that comprises a connection part on a bottom surface thereof, the bottom surface facing the main surface of the element substrate, wherein the lid member further comprises a descending part extending downwardly from the bottom surface, the descending part including a first surface that contacts at least part of the inner wall, and a second surface that extends upwardly and obliquely toward the bottom surface and away from the inner wall.

16. The acoustic wave device according to claim 15 , further comprising a reinforcing layer composed of metal and disposed on a top surface of the lid member, the outer periphery thereof being disposed on the frame member.

17. The acoustic wave device according to claim 15 , wherein the outer wall is inclined so as to spread progressively outward toward the main surface.

18. The acoustic wave device according to claim 17 , further comprising a sealing film that covers at least from the outer wall to a side wall of the lid member.

19. The acoustic wave device according to claim 15 , wherein the element substrate comprises a cutout disposed on the main surface between the vicinity of a lower edge of the outer wall of the frame member and a side wall thereof.

20. The acoustic wave device according to claim 15 , further comprising:
pads disposed at a part of the main surface of the element substrate at which

Assignees

• Ohashi Yasutaka
• Asai Satoshi
• Nagata Masaru
• Kyocera Corp

Inventors

• Ohashi Yasutaka
• Asai Satoshi
• Nagata Masaru

Classifications

• H03H9/1092 Primary

  the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's · CPC title

• H03H9/171

  implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type · CPC title

• H03H9/105

  the enclosure being defined by a cover cap mounted on an element forming part of the BAW device · CPC title

• H03H9/02992

  Details of bus bars, contact pads or other electrical connections for finger electrodes · CPC title

• H01L41/047 Primary

  Electricity · mapped topic