Multi-zone pedestal heater having a routing layer
US-2019159291-A1 · May 23, 2019 · US
Connections between laminated heater and heater voltage inputs
US10667379B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10667379-B2 |
| Application number | US-201715586203-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 3, 2017 |
| Priority date | May 10, 2016 |
| Publication date | May 26, 2020 |
| Grant date | May 26, 2020 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, a heating layer arranged on the baseplate, a ceramic layer arranged on the heating layer, and wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone, across the ceramic layer to a second zone of the plurality of heating zones, and to a heating element in the heating layer in the second zone.
First claim
Opening claim text (preview).
What is claimed is: 1. A substrate support for a substrate processing system, the substrate support comprising: a plurality of heating zones; a baseplate; a heating layer arranged on the baseplate; a ceramic layer arranged on the heating layer; wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones; an electrical connection routed from the wiring in the first zone, across the ceramic layer to a second zone of the plurality of heating zones, and to a heating element in the heating layer in the second zone. 2. The substrate support of claim 1 , wherein the electrical connection corresponds to an electrical trace. 3. The substrate support of claim 1 , wherein the electrical connection corresponds to second wiring different from the wiring provided through the baseplate. 4. The substrate support of claim 1 , wherein the second zone is located radially outward of the first zone. 5. The substrate support of claim 1 , further comprising a via provided through the baseplate, the heating layer, and the ceramic layer in the first zone, wherein the wiring is routed through the via. 6. The substrate support of claim 1 , wherein the electrical connection has a lower electrical resistance than the heating element. 7. The substrate support of claim 1 , wherein the electrical connection is coupled to a connection point of the heating element using at least one of a solder connection and conductive epoxy. 8. The substrate support of claim 1 , further comprising a via provided through the ceramic layer and the heating layer in the second zone. 9. The substrate support of claim 8 , wherein the via is filled with a conductive material coupling the electrical connection to a connection point of the heating element. 10. The substrate support of claim 8 , further comprising a contact pad arranged between the electrical connection and the heating element. 11. The substrate support of claim 10 , wherein the contact pad includes a first portion arranged in the ceramic layer and a second portion arranged in the heating layer. 12. The substrate support of claim 11 , wherein the via is filled with a conductive material. 13. The substrate support of claim 12 , wherein the conductive material is provided between the first portion of the contact pad and the second portion of the contact pad.
Assignees
Inventors
Classifications
Heaters with zones of different power density · CPC title
Via provided in pad; Pad over filled via · CPC title
directly combined with via connections · CPC title
- H05K1/0212Primary
Printed circuits or mounted components having integral heating means · CPC title
the insulating material being an inorganic material, e.g. ceramic · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10667379B2 cover?
- A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, a heating layer arranged on the baseplate, a ceramic layer arranged on the heating layer, and wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the fir…
- Who is the assignee on this patent?
- Lam Res Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0212. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 26 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).