Capacitor component and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10658115-B1
Application number	US-201916277454-A
Country	US
Kind code	B1
Filing date	Feb 15, 2019
Priority date	Nov 22, 2018
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.

First claim

What is claimed is:

1. A capacitor component comprising:
a body including a dielectric layer and first and second internal electrodes opposing each other with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; and
first and second external electrodes disposed on an outer side of the body and electrically connected to the first and second internal electrodes, respectively,
wherein the body includes a capacitance forming portion including the first and second internal electrodes opposing each other with the dielectric layer interposed therebetween to form capacitance, cover portions disposed in upper and lower surfaces of the capacitance forming portion and including a plurality of pores, and margin portions disposed on side surfaces of the capacitance forming portion, and
80% or higher of the plurality of pores are filled with glass, wherein a diameter of each of the plurality of pores is in the range of 1-2 μm.

2. The capacitor component of claim 1 , wherein the glass includes at least one selected from silicon oxide, aluminum oxide, and complex oxides thereof.

3. The capacitor component of claim 1 , wherein the cover portions have a hardness of 1,000 kgf/mm 2 or more.

4. The capacitor component of claim 1 , wherein a thickness of each of the first and second internal electrodes is less than 1 μm, and a thickness of the dielectric layer is less than 2.8 μm.

5. The capacitor component of claim 1 , wherein the relationship of td>2*te is satisfied, where “te” is a thickness of each of the first and second internal electrodes, and “td” is a thickness of the dielectric layer.

6. The capacitor component of claim 1 , wherein each of the first and second external electrodes includes an electrode layer and a conductive resin layer disposed on the electrode layer.

7. The capacitor component of claim 6 , wherein the electrode layer includes glass and at least one conductive metal selected from a group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

8. The capacitor component of claim 6 , wherein the conductive resin layer includes a base resin and at least one conductive metal selected from a group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

9. The capacitor component of claim 6 , wherein the first external electrode is disposed on the third surface and includes a band portion extending to portions of the first and second surfaces, and a distance from the third surface to an end of a band portion of the electrode layer is smaller than a distance from the third surface to an end of a band portion of the conductive resin layer.

10. The capacitor component of claim 6 , wherein each of the first and second external electrodes further includes a Ni-plated layer disposed on the conductive resin layer, and a Sn-plated layer disposed on the Ni-plated layer.

11. The capacitor component of claim 1 , wherein 90% or higher of the plurality of pores are filled with the glass.

Assignees

• Samsung Electro Mech

Inventors

• Ryoo Hye Won
• Jo Ji Hong
• Jun Ho In
• Ahn Seok Keun
• Yu Ji Hye
• Jun A Reum
• Jeong Gi Seok
• Yoo Seon Young

Classifications

• H01G4/224 Primary

  Housing; Encapsulation · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title