Method of manufacturing display apparatus

Patent metadata

Field	Value
Publication number	US-10646954-B2
Application number	US-201715593794-A
Country	US
Kind code	B2
Filing date	May 12, 2017
Priority date	May 13, 2016
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

A method of manufacturing a display apparatus includes: providing a substrate having a first surface and a second surface and arranging the substrate on a carrier such that the second surface of the substrate contacts the carrier; forming a display device on the first surface of the substrate; arranging a first protective film on the display device; cutting a substrate by irradiating a first short pulse laser beam onto the second surface of the substrate through the carrier; and cutting the first protective film by irradiating a laser beam of an infrared wavelength range onto an area of the first protective film that overlaps a cut area of the substrate.

First claim

What is claimed is:

1. A method of manufacturing a display apparatus, the method comprising:
providing a substrate having a first surface and a second surface and arranging the substrate on a carrier such that the second surface of the substrate contacts the carrier;
forming a display device on the first surface of the substrate;
arranging a first protective film on the display device;
cutting the substrate by irradiating a first short pulse laser beam onto the second surface of the substrate through the carrier; and
cutting the first protective film by irradiating a laser beam of an infrared wavelength range onto an area of the first protective film that overlaps a cut area of the substrate.

2. The method of claim 1 , wherein the first short pulse laser beam is a femtosecond laser beam or a picosecond laser beam.

3. The method of claim 1 , wherein the laser beam of the infrared wavelength range is a carbon dioxide laser beam.

4. The method of claim 1 , further comprising:
separating the carrier from the substrate;
arranging a second protective film on the substrate such that the second surface of the substrate contacts the second protective film; and
cutting the second protective film by irradiating a second short pulse laser beam onto an area of the second protective film that overlaps the cut area of the substrate.

5. The method of claim 4 , wherein the cutting of the first protective film is performed after arranging the second protective film on the substrate.

6. The method of claim 4 , wherein the cutting of the second protective film is performed after the cutting of the first protective film.

7. The method of claim 4 , wherein the cutting of the second protective film comprises cutting the second protective film by irradiating a femtosecond laser beam or a picosecond laser beam.

8. The method of claim 4 , wherein the cutting of the second protective film comprises cutting the second protective film by irradiating the first short pulse laser beam used for cutting the substrate.

9. The method of claim 4 , wherein the second protective film comprises polyethyleneterephthalate.

10. The method of claim 1 , wherein the carrier comprises a light-transmissive material.

11. The method of claim 1 , wherein the carrier comprises a glass material.

12. The method of claim 1 , wherein the substrate comprises polyimide.

13. The method of claim 1 , wherein the first protective film comprises polyethyleneterephthalate.

14. The method of claim 1 , wherein the forming of the display device comprises forming the display device on a plurality of display areas of the substrate, and
the cutting of the substrate comprises cutting the substrate by irradiating the first short pulse laser beam onto portions between the plurality of display areas of the substrate.

Assignees

• Samsung Display Co Ltd

Inventors

• Park Daejin

Classifications

• B32B2379/08

  Polyimides · CPC title

• B32B2457/20

  Displays, e.g. liquid crystal displays, plasma displays · CPC title

• B23K2103/172

  wherein at least one of the layers is non-metallic · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

• B23K26/57

  the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming · CPC title