Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer

Patent metadata

Field	Value
Publication number	US-10643884-B2
Application number	US-201615751043-A
Country	US
Kind code	B2
Filing date	Aug 8, 2016
Priority date	Aug 12, 2015
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

A method for manufacturing a semiconductor structure, including: direct bonding a substrate to be handled with a handle substrate via a bonding layer covering the handle substrate, to form a temporary structure capable of withstanding technological steps; disassembling the temporary structure at the bonding layer to separate the substrate to be handled from the handle substrate; and a prior depositing the bonding layer onto the handle substrate and/or onto the substrate to be handled, the bonding layer including a porous material including, an inorganic matrix and organic compounds connected or not to the matrix, and the disassembling is carried out by providing a thermal budget for disassembly to the intermediate structure, the providing resulting in a spontaneous disassembly of the temporary structure occurring at the bonding layer.

First claim

The invention claimed is:

1. A method for manufacturing a semiconductor structure, comprising:
depositing a bonding layer onto a handle substrate and/or onto a substrate to be handled, the bonding layer including a porous material including an inorganic matrix and organic compounds;
direct bonding the substrate to be handled with the handle substrate via the bonding layer, to form a temporary structure capable of withstanding technological steps; and
disassembling the temporary structure at the bonding layer to separate the substrate to be handled from the handle substrate, wherein the disassembling is carried out by providing a thermal budget for disassembly to the intermediate structure, the providing resulting in a spontaneous disassembly of the temporary structure occurring by splitting within the bonding layer.

2. The method according to claim 1 , wherein the disassembling takes place under a controlled atmosphere.

3. The method according to claim 1 , wherein the providing the thermal budget for disassembly comprises annealing the temporary structure at a temperature exceeding 600° C. for a duration of more than 10 minutes.

4. The method according to claim 1 , further comprising strengthening the bonding implemented by providing a thermal budget for reinforcement to the temporary structure.

5. The method according to claim 1 , further comprising, before the disassembling, assembling a free rear side of the substrate to be handled with a receiving substrate.

6. The method according to claim 1 , further comprising recycling the handle substrate after the disassembling, the recycling comprising removal of residues of the bonding layer present at a surface of the handle substrate by selective etching.

7. The method according to claim 1 , wherein the bonding layer has a porosity in a range of 10% to 80%.

8. The method according to claim 1 , wherein the bonding layer is a layer of organosilicon material.

9. The method according to claim 1 , wherein the bonding layer is a layer whose porosity is self-generated.

10. The method according to claim 1 , wherein depositing the bonding layer comprises depositing a matrix precursor on the handle substrate and incorporating a porogenic agent in the deposited matrix precursor.

11. The method according to claim 1 , further comprising, after depositing the bonding layer, modifying the porous material by thermal, chemical, UV, electron beam, or plasma post-treatment.

12. The method according to claim 1 , further comprising, after the direct bonding, forming at least one cut in the handle substrate to isolate regions of the handle substrate from each other, the disassembling of the temporary structure resulting in a partial separation of the handle substrate located at one or more of the isolated regions of the handle substrate.

13. The method according to claim 12 , further comprising forming a cut in the handle substrate separating a central portion of the handle substrate from a peripheral portion of the handle substrate, the disassembling of the temporary structure resulting in a partial separation of the handle substrate located at the central portion of the handle substrate, whereby the substrate to be handled rests on the peripheral portion of the handle substrate.

14. The method according to claim 13 , further comprising thinning the substrate to be handled resting on the peripheral portion of the handle substrate.

15. The method according to claim 1 , further comprising, after the direct bonding, forming one or more cuts in the substrate to be handled to isolate regions of the substrate to be handled from each other, the disassembling of the temporary structure resulting in a partial separation of the substrate to be handled located at one or more of the isolated regions of the substrate to be handled.

16. The method according to claim 1 , wherein the depositing of the bonding layer is performed by at least one of physical vapor deposition; sol-gel deposition; chemical vapor deposition; or plasma enhanced chemical vapor deposition.

17. The method according to claim 1 , wherein the porous material includes at least one of carbonate cycles or carbonate chains.

18. The method according to claim 1 , wherein the direct bonding is performed by molecular adhesion without any glue and is performed at ambient temperature and at atmospheric pressure.

19. The method according to claim 1 , wherein the disassembling takes place under one of a nitrogen atmosphere and mixed N 2 —O 2 atmosphere.

Assignees

• Commissariat Energie Atomique

Inventors

• Beche Elodie
• Fournel Frank
• Larrey Vincent

Classifications

• H10P90/1924 Primary

  with separation/delamination along a porous layer · CPC title

• H10P50/28

  of insulating materials · CPC title

• H10W10/181

  Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers · CPC title

• H10P90/1914 Primary

  using bonding · CPC title

• C09J5/06

  involving heating of the applied adhesive · CPC title