Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board
US-10818585-B2 · Oct 27, 2020 · US
characterised by the interlayer used (C04B37/028 takes precedence)
characterised by the interlayer used (C04B37/028 takes precedence) · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B37/023 |
| Official title | {characterised by the interlayer used (C04B37/028 takes precedence)} |
| Display label | characterised by the interlayer used (C04B37/028 takes precedence) |
| Total patents | 174 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 13 |
| 2017 | 9 |
| 2018 | 11 |
| 2019 | 20 |
| 2020 | 22 |
| 2021 | 19 |
| 2022 | 22 |
| 2023 | 17 |
| 2024 | 23 |
| 2025 | 13 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Target material for sputtering and method for manufacturing same
US-10612127-B2 · Apr 7, 2020 · US
Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board
US-2020006213-A1 · Jan 2, 2020 · US
Cutting elements, and related earth-boring tools, supporting substrates, and methods
US-2019368278-A1 · Dec 5, 2019 · US
Light-emitting ceramic and light-emitting device
US-2019363507-A1 · Nov 28, 2019 · US
Ceramic component and three-dimensional manufacturing method of ceramic component
US-2019351576-A1 · Nov 21, 2019 · US
Ceramic circuit substrate and method for producing ceramic circuit substrate
US-10485112-B2 · Nov 19, 2019 · US
Joined body and method for producing the same
US-10421691-B2 · Sep 24, 2019 · US
Active metal braze joint with stress relieving layer
US-10363624-B2 · Jul 30, 2019 · US
Brazed joint and semiconductor processing chamber component having the same
US-2019226512-A1 · Jul 25, 2019 · US
Multilayer Component and Process for Producing a Multilayer Component
US-2019214168-A1 · Jul 11, 2019 · US
Ceramic circuit substrate and method for producing ceramic circuit substrate
US-2019150298-A1 · May 16, 2019 · US
Ceramic circuit board and semiconductor module
US-2019150278-A1 · May 16, 2019 · US
Ceramic-metal structure
US-2019126373-A1 · May 2, 2019 · US
Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate
US-2019131123-A1 · May 2, 2019 · US
Module
US-2019116687-A1 · Apr 18, 2019 · US
Multilayer component and process for producing a multilayer component
US-10262778-B2 · Apr 16, 2019 · US
Methods for repairing composite cylinders
US-2019084894-A1 · Mar 21, 2019 · US
Composition and method of producing bonded body
US-2019047046-A1 · Feb 14, 2019 · US
Metal-ceramic base material, metal-ceramic joint structure, method for producing metal-ceramic joint structure, and mixed powder material
US-2019003059-A1 · Jan 3, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B37/023?
- CPC C04B37/023 is the Cooperative Patent Classification code for “characterised by the interlayer used (C04B37/028 takes precedence).”
- How many patents are filed under CPC C04B37/023 (characterised by the interlayer used (C04B37/028 takes precedence))?
- Our database includes 174 publications tagged with this CPC code.
- Is patent activity under CPC C04B37/023 growing?
- Publication counts under this code: 23 in 2024 vs 13 in 2025 (latest complete years).