Method of forming a plurality of electro-optical module assemblies

Patent metadata

Field	Value
Publication number	US-10638613-B2
Application number	US-201715821432-A
Country	US
Kind code	B2
Filing date	Nov 22, 2017
Priority date	May 9, 2016
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

First claim

What is claimed is:

1. A method of forming a plurality of electro-optical module assemblies, the method comprising:
providing a flexible substrate containing a first surface and a second surface opposite the first surface, the first surface including a plurality of electronic components located thereon;
bringing a frame containing openings therein in direct contact with the first surface of the flexible substrate, wherein each opening of the frame physically exposes at least one of the electric components and an electro-optical module assembly area of the flexible substrate;
forming an opening in an inner portion of each electro-optical module assembly area of the flexible substrate utilizing the frame as a mask;
affixing an optical component to the second surface of the flexible substrate and within each electro-optical module assembly area of the flexible substrate, wherein each opening in the electro-optical module assembly area of the flexible substrate exposes a portion of one of the optical components;
cutting outermost portions of each electro-optical module assembly area of the flexible substrate exposed by each opening in the frame to provide a plurality of pre-electro-optical module assemblies having the first and second surfaces; and
forming at least one micro-energy source to the first surface of each pre-electro-optical module assembly.

2. The method of claim 1 , wherein the providing the flexible substrate comprises:
placing the flexible substrate on a surface of a vacuum chunk;
applying a vacuum to hold the flexible substrate on the surface of the vacuum chuck; and
forming the plurality of electronic components on the first surface of the flexible substrate.

3. The method of claim 1 , wherein the forming the opening in each electro-optical module assembly area of the flexible substrate comprises a first laser cutting process.

4. The method of claim 3 , wherein the cutting outermost portions of each electro-optical module assembly area of the flexible substrate comprises a second laser cutting process.

5. The method of claim 1 , wherein the electronic components comprise a first set of electrical components located in a first direction and on a first portion of the first surface of the flexible substrate and a second set of electrical components located in a second direction, which is different from the first direction, and on a second portion of the first surface of the flexible substrate.

6. The method of claim 5 , wherein the first and second sets of electrical components are formed using a pick and place method.

7. The method of claim 5 , wherein each electrical component of the first set of electrical components comprises a same electrical component as each electrical component of the second set of electrical components.

8. The method of claim 5 , wherein each electrical component of the first set of electrical components comprises a different electrical component than each electrical component of the second set of electrical components.

9. The method of claim 1 , wherein the optical component comprises a mirror.

10. The method of claim 1 , wherein the optical component comprises a lens including a camera.

11. The method of claim 1 , wherein the optical component comprises a contact lens.

12. The method of claim 1 , wherein the optical components comprises a prism.

13. The method of claim 1 , wherein the optical component comprises an optical filter.

14. The method of claim 1 , wherein the optical component comprises a light emitting diode.

15. The method of claim 1 , wherein the forming the at least one micro-energy source comprise a pick and place method, followed by affixing the at least one micro-energy source.

16. The method of claim 1 , wherein the at least one micro-energy source comprises a capacitor or a micro-battery.

Assignees

• IBM

Inventors

• Andry Paul S
• Chen Qianwen
• Dang Bing
• Knickerbocker John U
• Lu Minhua
• Polastre Robert J
• Webb Bucknell C

Classifications

• H05K2201/09072

  Hole or recess under component or special relationship between hole and component · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K3/0026

  by laser ablation · CPC title

• H05K2201/10522

  Adjacent components · CPC title