Sensor packages and manufacturing mehtods thereof

Patent metadata

Field	Value
Publication number	US-10157807-B2
Application number	US-201615235106-A
Country	US
Kind code	B2
Filing date	Aug 12, 2016
Priority date	May 26, 2016
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

First claim

What is claimed is:

1. A sensor package, comprising:
a semiconductor chip having a sensing surface;
a redistribution layer structure arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip; and
a polymer layer on the redistribution layer structure, covering the antenna transmitter structure and the antenna receiver structure,
wherein the antenna transmitter structure surrounds the antenna receiver structure.

2. The sensor package of claim 1 , wherein the transmitter structure has a ring shape, a bar shape, a spiral shape, a wave shape, a meandering shape or a combination thereof.

3. The sensor package of claim 1 , wherein the antenna receiver structure has a plurality of first patterns over the sensing surface of the semiconductor chip.

4. The sensor package of claim 3 , wherein each of the plurality of first patterns has an island shape, a snake shape, a bar shape, a fishbone shape, a fence shape, a grid shape, a ring shape or a combination thereof.

5. The sensor package of claim 3 , wherein the antenna receiver structure further has a plurality of second patterns over the plurality of first patterns.

6. The sensor package of claim 5 , wherein the plurality of second patterns are aligned with the plurality of first patterns.

7. The sensor package of claim 5 , wherein the antenna receiver structure further has a plurality of third patterns over the plurality of second patterns, the plurality of third patterns are aligned with the plurality of second patterns, and the plurality of second patterns are not aligned with the plurality of first patterns.

8. The sensor package of claim 5 , wherein the plurality of second patterns are not aligned with the plurality of first patterns.

9. The sensor package of claim 1 , wherein the sensor package is a fingerprint sensor package.

10. A sensor package, comprising:
a semiconductor chip having a sensing surface; and
a redistribution layer structure arranged to form a plurality of sensing patterns over the sensing surface of the semiconductor chip and to form an antenna transmitter structure and an antenna receiver structure aside the plurality of sensing patterns,
wherein the antenna transmitter structure and the antenna receiver structure are laterally aside a redistribution layer of the redistribution layer structure.

11. The sensor package of claim 10 , wherein the sensor package further comprises a polymer layer covering the antenna transmitter structure and the antenna receiver structure while exposing top surfaces of the sensing patterns.

12. The sensor package of claim 11 , further comprising molecular linkers respectively covering the exposed top surfaces of the sensing patterns.

13. The sensor package of claim 10 , wherein the antenna receiver structure is electrically connected to a through-via aside the semiconductor chip.

14. The sensor package of claim 10 , wherein each of the antenna transmitter structure and the antenna receiver structure has a bar shape, a spiral shape, a wave shape, a meandering shape or a combination thereof.

15. The sensor package of claim 10 , wherein each of the sensing patterns has a split-ring shape.

16. The sensor package of claim 10 , wherein the sensor package is a molecular-based sensor package.

17. A method of forming a sensor package, comprising:
providing a semiconductor chip having a sensing surface;
forming a redistribution layer structure over the sensing surface, wherein the formation of the redistribution layer structure comprises forming an antenna transmitter structure and an antenna receiver structure; and
forming a polymer layer over the redistribution layer structure,
wherein the antenna transmitter structure surrounds the antenna receiver structure.

18. The method of claim 17 , wherein the antenna receiver structure comprises a plurality of first patterns over the sensing surface of the semiconductor chip.

19. The method of claim 17 , wherein the formation of the redistribution layer structure further comprises forming a redistribution layer laterally aside the antenna transmitter structure and the antenna receiver structure.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chiang Yung-Ping
• Shih Chao-Wen
• Chang Shou-Zen
• Wan Albert
• Hsieh Yu-Sheng

Classifications

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/244

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W44/248

  for antennas · CPC title