Plating apparatus, plating method, and recording medium

Patent metadata

Field	Value
Publication number	US-10633757-B2
Application number	US-201716307908-A
Country	US
Kind code	B2
Filing date	Apr 14, 2017
Priority date	Jun 7, 2016
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

There are provided a plating apparatus and a plating method that allow determining an appropriate replacement timing of a diaphragm. The plating apparatus includes an anode bath, a cathode bath, a diaphragm, an analyzer, and a control device. The anode bath holds a plating solution and an insoluble anode. The cathode bath holds a plating solution containing an additive and a substrate. The diaphragm separates the plating solution held in the anode bath from the plating solution held in the cathode bath. The analyzer is configured to analyze a concentration of the additive in the plating solution in the cathode bath at every predetermined time interval. The control device is configured to calculate an actual consumption of the additive during the predetermined period based on the concentration of the additive analyzed at the every predetermined time interval. The control device includes a memory that stores an expected consumption of the additive during the predetermined period. The control device is configured to determine whether a difference between the actual consumption and the expected consumption is equal to or more than a predetermined value or not.

First claim

The invention claimed is:

1. A plating method that plates a substrate by a plating apparatus, the plating apparatus separating a plating solution in an anode unit housing an anode from a plating solution containing an additive in a cathode unit housing the substrate with a diaphragm, the plating method comprising:
a step of analyzing a concentration of the additive in the plating solution in the cathode unit at every predetermined time interval;
a step of calculating an actual consumption of the additive during the predetermined period based on the concentration of the additive analyzed at the every predetermined time interval;
a step of determining whether a difference between an expected consumption and the actual consumption of the additive during the predetermined period is equal to or more than a predetermined value or not;
a step of sensing a liquid surface level of the plating solution in the anode unit when the difference between the expected consumption and the actual consumption is determined as equal to or more than the predetermined value;
a step of determining whether the liquid surface level is equal to or less than a predetermined level or not;
a step of determining whether the substrate is present in the cathode unit or not; and
a step of replacing the diaphragm when the substrate is determined as absent in the cathode unit and the liquid surface level is determined as equal to or less than the predetermined level.

2. A plating method that plates a substrate by a plating apparatus, the plating apparatus separating a plating solution in an anode unit housing an anode from a plating solution containing an additive in a cathode unit housing the substrate with a diaphragm, the plating method comprising:
a step of measuring a current value and a voltage value during the plating on the substrate;
a step of analyzing a concentration of the additive in the plating solution in the cathode unit at every predetermined time interval;
a step of calculating an actual consumption of the additive during the predetermined period based on the concentration of the additive analyzed at the every predetermined time interval;
a step of determining whether a difference between an expected consumption and the actual consumption of the additive during the predetermined period is equal to or more than a predetermined value or not;
a step of determining whether a difference between a ratio of the voltage value to a current density value calculated based on the current value and a reference value is equal to or more than a predetermined value or not when the difference between the expected consumption and the actual consumption is determined as equal to or more than the predetermined value; and
a step of replacing the diaphragm when the difference between the ratio and the reference value is determined as equal to or more than the predetermined value.

3. A plating method that plates a substrate by a plating apparatus, the plating apparatus separating a plating solution in an anode unit housing an insoluble anode from a plating solution containing an additive in a cathode unit housing the substrate with a diaphragm, the plating method comprising:
a step of measuring a current value and a voltage value during the plating on the substrate;
a step of determining whether a difference between a ratio of the voltage value to a current density value calculated based on the current value and a reference value is equal to or more than a predetermined value or not;
a step of sensing a liquid surface level of the plating solution in the anode unit when the difference is determined as equal to or more than the predetermined value;
a step of determining whether the liquid surface level is equal to or less than a predetermined level or not;
a step of determining whether the substrate is present in the cathode unit or not; and
a step of replacing the diaphragm when the substrate is determined as absent in the cathode unit and the liquid surface level is determined as equal to or less than the predetermined level.

4. A plating method that plates a substrate by a plating apparatus, the plating apparatus separating a plating solution in an anode unit housing an insoluble anode from a plating solution containing an additive in a cathode unit housing the substrate with a diaphragm, the plating method comprising:
a step of measuring a current value and a voltage value during the plating on the substrate;
a step of analyzing a concentration of the additive in the plating solution in the cathode unit at every predetermined time interval;
a step of determining whether a difference between a ratio of the voltage value to a current density value calculated based on the current value and a reference value is equal to or more than a predetermined value or not;
a step of calculating an actual consumption of the additive during the predetermined period based on the concentration of the additive analyzed at the every predetermined time interval when the difference is determined as equal to or more than the predetermined value;
a step of determining whether a difference between an expected consumption and the actual consumption of the additive during the predetermined period is equal to or more than a predetermined value or not; and
a step of replacing the diaphragm when the difference between the expected consumption and the actual consumption is determined as equal to or more than the predetermined value.

5. The plating method according to claim 2 , comprising
a step of setting a value of the ratio of the voltage value to the current density value immediately after the diaphragm is replaced as the reference value.

6. The plating method according to claim 2 , wherein
the step of replacing the diaphragm includes a step of replacing the diaphragm together with the anode unit.

7. The plating method according to claim 2 , further comprising:
a step of determining a replacement timing of the diaphragm based on a plurality of data, the plurality of data indicating a time interval from when the diaphragm is mounted to the plating apparatus until the diaphragm is replaced; and
a step of replacing the diaphragm based on the replacement timing.

8. A recording medium storing a computer program, the computer program causing a plating apparatus to perform the plating method according to claim 2 , wherein
the plating method further includes:
a step of determining a replacement timing of the diaphragm based on a plurality of data, the plurality of data indicating a time interval from when the diaphragm is mounted to the plating apparatus until the diaphragm is replaced; and
a step of replacing the diaphragm based on the replacement timing.

Assignees

• Ebara Corp

Inventors

• Shimoyama Masashi
• Araki Yuji
• Nagai Mizuki
• Fujikata Jumpei

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• C25D21/12 Primary

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title

• C25D17/008

  Current shielding devices · CPC title

• C25D3/38

  of copper · CPC title