Methods for fabricating magnetic writer structures using post-deposition tilting

Patent metadata

Field	Value
Publication number	US-10614835-B2
Application number	US-201715788672-A
Country	US
Kind code	B2
Filing date	Oct 19, 2017
Priority date	Aug 25, 2009
Publication date	Apr 7, 2020
Grant date	Apr 7, 2020

Abstract

A method according to one embodiment includes forming a first portion of a thin film writer structure on a substrate, forming a portion of a write gap at an initial position, a plane of deposition of the portion of the write gap being at an angle of greater than 0° and less than 90° relative to an upper surface of the first portion in the initial position, moving the writer structure to orient the plane of deposition of the portion of the write gap more toward perpendicular to a plane corresponding to a final media-facing surface of the writer structure than the orientation of the plane of deposition of the portion of the write gap in the initial position, and fixing the writer structure in place after the moving.

First claim

What is claimed is:

1. A method, comprising:
forming a first portion of a thin film writer structure on a substrate;
forming a portion of a write gap at an initial position, a plane of deposition of the portion of the write gap being at an angle of greater than 0° and less than 90° relative to an upper surface of the first portion in the initial position;
moving the writer structure to orient the plane of deposition of the portion of the write gap more toward perpendicular to a plane corresponding to a final media-facing surface of the writer structure than the orientation of the plane of deposition of the portion of the write gap in the initial position; and
fixing the writer structure in place after the moving.

2. A method as recited in claim 1 , wherein the substrate comprises silicon.

3. A method as recited in claim 1 , further comprising planarizing the writer structure along a plane substantially parallel to the plane of the substrate.

4. A method as recited in claim 1 , wherein the writer structure is formed on a rigid platform that tilts with the writer structure.

5. A method as recited in claim 1 , wherein an axis of the tilting is about parallel to the plane of the substrate.

6. A method as recited in claim 1 , further comprising forming a magnetic sensor, wherein the sensor and the writer structure tilt together.

7. A method as recited in claim 1 , further comprising removing a sacrificial portion of the substrate for creating a pivot point about which the writer structure pivots.

8. A method as recited in claim 7 , wherein the pivot point is under and off-center from the writer structure.

9. A method as recited in claim 7 , wherein the pivot point is spaced apart from the writer structure such that the writer structure pivots along an arc.

10. A method as recited in claim 9 , wherein capillary action operatively causes the writer structure to tilt at the angle.

11. A method as recited in claim 9 , wherein removing the sacrificial portion of the substrate causes another portion of the substrate to form a cantilever supporting the writer structure, wherein a local stress operatively causes the cantilever to bend, thereby causing the writer structure to tilt at the angle.

12. A method as recited in claim 7 , wherein removing the portion of the substrate allows built-in stresses to cause the writer structure to tilt at the angle.

13. A method as recited in claim 1 , wherein portions of two poles are formed at an angle of greater than 0° relative to a substantially planar portion of the substrate.

14. A method as recited in claim 1 , and further comprising, after causing the writer structure to tilt, fixing the writer structure in place on the substrate at the angle.

Assignees

• IBM

Inventors

• Herget Philipp
• Jubert Pierre-Olivier

Classifications

• G11B5/3906

  Details related to the use of magnetic thin film layers or to their effects · CPC title

• G11B5/00821 Primary

  using stationary heads · CPC title

• G11B5/3163

  Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers · CPC title