Manufacturing method for deposition mask, metal plate used for producing deposition mask, and manufacturing method for said metal sheet

Patent metadata

Field	Value
Publication number	US-10612124-B2
Application number	US-201916250246-A
Country	US
Kind code	B2
Filing date	Jan 17, 2019
Priority date	Feb 10, 2015
Publication date	Apr 7, 2020
Grant date	Apr 7, 2020

Abstract

The present invention provides a metal sheet, on a first surface of which a resist pattern having a narrow width can be stably provided. This manufacturing method for a metal sheet includes a preparation step of preparing a sheet material comprising an iron alloy that contains nickel. When a composition analysis of the first surface of the metal sheet obtained from the sheet material is performed using X-ray photoelectron spectroscopy, the ratio A1/A2 obtained by the result of the X-ray photoelectron spectroscopy does not exceed 0.4, where A1 is the sum of the peak area value of nickel oxide and the peak area value of nickel hydroxide, and A2 is the sum of the peak area value of iron oxide and the peak area value of iron hydroxide.

First claim

The invention claimed is:

1. A metal plate used for manufacturing a deposition mask having a plurality of through-holes formed therein,
wherein:
when a composition analysis of a first surface of the metal plate is performed by using an X-ray photoelectron spectroscopy, a ratio A1/A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is a sum of a peak planar dimension value of nickel oxide and a peak planar dimension value of nickel hydroxide, and A2 is a sum of a peak planar dimension value of iron oxide and a peak planar dimension value of iron hydroxide; and
in the composition analysis of the first surface of the metal plate by means of the X-ray photoelectron spectroscopy, an incident angle of an X-ray emitted to the metal plate on the first surface is 45 degrees, and an acceptance angle of photoelectrons discharged from the metal plate is 90 degrees.

2. The metal plate according to claim 1 , wherein a thickness of the metal plate is 85 μm or less.

3. The metal plate according to claim 1 , wherein a thickness of the metal plate is 20 μm or less.

4. The metal plate according to claim 1 , wherein
the metal plate is for manufacturing the deposition mask by exposing and developing a dry film attached to the first surface of the metal plate to form a first resist pattern, and by etching an area of the first surface of the metal plate to form the plurality of through-holes, the area being not covered with the first resist pattern.

5. The metal plate according to claim 1 , wherein the ratio A1/A2 is 0.3 or less.

6. A manufacturing method for a deposition mask having a plurality of through-holes formed therein, the method comprising:
a step of preparing a metal plate;
a first resist pattern forming step of forming a first resist pattern on a first surface of the metal plate; and
an etching step of etching an area of the first surface of the meal plate, the area being not covered with the first resist pattern, so that first recesses to define the through-holes are formed in the first surface of the metal plate;
wherein:
when a composition analysis of a first surface of the metal plate is performed by using an X-ray photoelectron spectroscopy, a ratio A1/A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is a sum of a peak planar dimension value of nickel oxide and a peak planar dimension value of nickel hydroxide, and A2 is a sum of a peak planar dimension value of iron oxide and a peak planar dimension value of iron hydroxide; and
in the composition analysis of the first surface of the metal plate by means of the X-ray photoelectron spectroscopy, an incident angle of an X-ray emitted to the metal plate on the first surface is 45 degrees, and an acceptance angle of photoelectrons discharged from the metal plate is 90 degrees.

7. The manufacturing method for a deposition mask according to claim 6 , wherein a thickness of the metal plate is 85 μm or less.

8. The manufacturing method for a deposition mask according to claim 6 , wherein a thickness of the metal plate is 20 μm or less.

9. The manufacturing method for a deposition mask according to claim 6 , wherein
the first resist pattern forming step includes a step of attaching a dry film to the first surface of the metal plate, and a step of exposing and developing the dry film to form the first resist pattern.

10. The manufacturing method for a deposition mask according to claim 6 , wherein the ratio A1/A2 is 0.3 or less.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Ikenaga Chikao
• Nakayama Hiroaki
• Ikeda Kazunari
• Hatsuta Chiaki
• OOUCHI Utako

Classifications

• C21D6/001

  containing Ni (C21D6/004 takes precedence) · CPC title

• C23C14/58

  After-treatment · CPC title

• C21D1/74

  Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material · CPC title

• C23F1/04

  Chemical milling · CPC title

• C22C38/08

  containing nickel {(C22C38/105 takes precedence)} · CPC title