Spin logic with spin hall electrodes and charge interconnects
US-2018240583-A1 · Aug 23, 2018 · US
US10608167B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10608167-B2 |
| Application number | US-201515751102-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2015 |
| Priority date | Sep 10, 2015 |
| Publication date | Mar 31, 2020 |
| Grant date | Mar 31, 2020 |
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Described is an apparatus which comprises: a first non-magnetic conductor; a first spin orbit coupling (SOC) layer coupled to the first non-magnetic conductor; a first ferromagnet (FM) coupled to the SOC layer; a second FM; and an insulating FM sandwiched between the first and second FMs.
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We claim: 1. An apparatus comprising: a conductor comprising a non-magnetic material; a first layer comprising spin orbit (SOC) material, wherein the first layer is coupled to the conductor; a first magnet coupled to the first layer; a second magnet; and a second layer comprising a magnetic insulative material, wherein the second layer is between the first and second magnets such that magnetic insulative material is in direct contact with the first and second magnets; wherein the first layer comprises: a third layer coupled to the first magnet, wherein the first layer includes one or more of: Bi and Ag; Bi and Cu; or Pb and Ag; and a fourth layer coupled to the third layer and another non-magnetic metal, wherein the fourth layer includes one of: Ag, Cu, or Au. 2. The apparatus of claim 1 , wherein the first and second magnets includes one or more of: a Heusler alloy, Co, Fe, Ge, Ga, or a combination of them. 3. The apparatus of claim 1 , wherein the magnetic insulative material comprises one of: Y, Fe, Ni, Tb, or Cr. 4. The apparatus of claim 1 , wherein the first layer includes one or more of: β-Ta, β-W, W, Pt, Cu doped with Iridium, Cu doped with Bismuth, or Cu doped an element of 3d, 4d, 5d, 4f, or 5f of periodic table groups. 5. The apparatus of claim 1 , wherein the conductor is a first conductor, wherein the apparatus comprises a second conductor including a non-magnetic material, wherein the second conductor is coupled to the first layer, and wherein the second conductor is coupled to ground. 6. The apparatus of claim 5 comprises a third conductor which includes a non-magnetic material, wherein the third conductor is coupled to a portion of the second magnet and to a power supply. 7. The apparatus of claim 6 comprises: a fifth layer comprising SOC material; a fourth conductor including a non-magnetic material, wherein the fourth conductor is coupled to a portion of the second magnet and to the fifth layer; and a fifth conductor including a non-magnetic material, the fifth conductor is coupled to a portion of the fifth layer and to ground. 8. The apparatus of claim 7 , wherein at least one of the first, second, third, fourth, or fifth conductors include Cu. 9. The apparatus of claim 1 comprises an interconnect, which includes a non-magnetic material, wherein the interconnect is coupled to the second magnet at one end and coupled to a ground node at another end. 10. The apparatus of claim 1 comprises: a first stack including an insulator, a magnet with fixed magnetization, and a conductor with a non-magnetic material, wherein the conductor is coupled to a positive power supply; and a second stack including an insulator, a magnet with fixed magnetization, and a conductor with non-magnetic material, wherein the conductor is coupled to a negative power supply, wherein the first and second stacks are separated by a distance and coupled to portions of the second magnet. 11. The apparatus of claim 10 , wherein the insulators of the first and second stacks comprise MgO. 12. The apparatus of claim 1 , wherein the first and second magnets comprise magnets with free or unfixed magnetizations. 13. The apparatus of claim 12 , wherein the first layer is to convert charge current to a spin current which is to switch the first magnet. 14. The apparatus of claim 1 , wherein the first layer is to exhibit spin Hall effect when a charge current is received from the first conductor. 15. A system comprising: a memory; a processor coupled to the memory, the processor having an apparatus which comprises: a first conductor comprising a non-magnetic material; a first layer comprising spin orbit (SOC) material, wherein the first layer is coupled to the first conductor; a first magnet coupled to the first layer; a second magnet; and a second layer comprising a magnetic insulative material, wherein the second layer is between the first and second magnets such that magnetic insulative material is in direct contact with the first and second magnets; a second conductor including a non-magnetic material, wherein the second conductor is coupled to the first layer, wherein the second conductor is coupled to a ground node; a third conductor which includes a non-magnetic material, wherein the third conductor is coupled to a portion of the second magnet and to a power supply node; a fifth layer comprising SOC material; a fourth conductor including a non-magnetic material, wherein the fourth conductor is coupled to a portion of the second magnet and to the fifth layer; and a fifth conductor including a non-magnetic material, the fifth conductor is coupled to a portion of the fifth layer and to ground; and a wireless interface to allow the processor to communicate with another device. 16. The system of claim 15 , wherein the apparatus is cascadable with another apparatus. 17. The system of claim 15 , wherein the apparatus is a majority gate, or a minority gate. 18. A method comprising: transmitting a first charge current through a first non-magnetic conductor; receiving the first charge current by a first spin orbit coupling (SOC) layer, wherein the first SOC layer is to convert the first charge current to a first spin current; switching a first ferromagnet (FM) by the first spin current; switching an insulating FM coupled to the first FM; switching a second FM by the first spin current, wherein the insulating FM is directly coupled to the first and second FMs; receiving the first spin current via the second FM; providing the received first spin current to a second SOC layer; and converting the received first spin current to a second charge current by the second SOC layer.
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