Method and apparatus for image analysis

Patent metadata

Field	Value
Publication number	US-10607334-B2
Application number	US-201515533614-A
Country	US
Kind code	B2
Filing date	Nov 13, 2015
Priority date	Dec 9, 2014
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

A method and apparatus of detection, registration and quantification of an image. The method may include obtaining an image of a lithographically created structure, and applying a level set method to an object, representing the structure, of the image to create a mathematical representation of the structure. The method may include obtaining a first dataset representative of a reference image object of a structure at a nominal condition of a parameter, and obtaining second dataset representative of a template image object of the structure at a non-nominal condition of the parameter. The method may further include obtaining a deformation field representative of changes between the first dataset and the second dataset. The deformation field may be generated by transforming the second dataset to project the template image object onto the reference image object. A dependence relationship between the deformation field and change in the parameter may be obtained.

First claim

What is claimed is:

1. A method comprising:
obtaining a first dataset representing a reference image object, the reference image object representing a lithographic structure at a nominal condition of a parameter;
obtaining a second dataset representing a template image object, the template image object representing the lithographic structure at a non-nominal condition of the parameter; and
generating, by a hardware computer processor system, a deformation field by transforming the second dataset to project the template image object onto the reference image object.

2. The method of claim 1 , further comprising determining a measure of difference between the template image object and the reference image object based on the deformation field.

3. The method of claim 2 , wherein the measure of difference between the template image object and the reference image object comprises a determinant of a deformation matrix representing the deformation field.

4. The method of claim 3 , further comprising classifying the object obtained at the non-nominal condition as unacceptable if the measure of difference between the template image object and the reference image object is greater than a given threshold.

5. The method according to claim 1 , wherein the deformation field is representative of a difference between the first dataset and the second dataset; and
obtaining a dependence relationship between the deformation field and the parameter through variation of the parameter to obtain a plurality of deformation fields corresponding to a plurality of non-nominal conditions, wherein the dependence relationship is evaluating a change in the deformation fields to the plurality of non-nominal conditions of the parameter.

6. The method of claim 5 , further comprising determining an optimal value for the parameter based on the dependence relationship.

7. The method of claim 5 , further comprising predicting, using the dependence relationship, an effect of a variation in the parameter on a further image of the structure, to enable differentiation between a change in the further image because of a defect in the structure and a change in the further image because of variation in the parameter.

8. The method of claim 1 , wherein obtaining the deformation field comprises determining a transformation matrix describing a transformation of the second dataset into the first dataset.

9. The method of claim 1 , wherein the deformation field is quantified as a material strain of the structure.

10. The method of claim 1 , wherein the parameter comprises one or more selected from: focus, exposure dose, numerical aperture, a film stack property, lens aberration, coherence, and/or illumination intensity distribution.

11. A method of manufacturing devices wherein a device pattern is applied to a series of substrates using a lithographic process, the method including evaluating a lithographic structure imaged using the lithographic process using the method of claim 1 and controlling the lithographic process for one or more of the substrates in accordance with the result of the method.

12. The method of claim 11 , wherein the lithographic structure is imaged on at least one of the substrates and controlling the lithographic process for later substrates in accordance with the result of the method.

13. A non-transitory computer program product comprising a computer-readable medium storing machine-readable instructions configured to cause a processor to:
obtain a first dataset representing a reference image object, the reference image object representing a lithographic structure at a nominal condition of a parameter;
obtain a second dataset representing a template image object, the template image object representing the lithographic structure at a non-nominal condition of the parameter; and
generate a deformation field by transforming the second dataset to project the template image object onto the reference image object.

14. A system comprising:
a scanning electron microscope configured to provide an image of a lithographically created structure; and
an image analysis engine comprising the non-transitory computer program product of claim 13 .

15. The system of claim 14 , further comprising a lithographic apparatus comprising a support structure configured to hold a patterning device to modulate a radiation beam and a projection optical system arranged to project the modulated onto a radiation-sensitive substrate.

16. The non-transitory computer program product of claim 13 , wherein the instructions are further configured to cause determination of a measure of difference between the template image object and the reference image object based on the deformation field.

17. The method of claim 1 , wherein the first dataset and/or the second dataset is a binarized function representing the reference image object and/or the template image object respectively.

18. The method of claim 1 , further comprising determining a cost function based on a magnitude of the deformation field, wherein the cost function is representative of a degree of difference between the reference image object and the template image object.

19. The method of claim 1 , wherein the lithographic structure comprises a circuit feature of an integrated circuit.

20. The method of claim 1 , wherein the reference image and the template image are obtained with a low-dose scanning electron microscope.

Assignees

• Asml Netherlands Bv

Inventors

• Middlebrooks Scott Anderson
• Van Kraaij Markus Gerardus Martinus Maria
• Pisarenco Maxim
• Koopman Adrianus Cornelis Matheus
• Hunsche Stefan
• Coene Willem Marie Julia Marcel

Classifications

• G06T7/001 Primary

  using an image reference approach · CPC title

• G03F7/705

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

• G06T2207/10061

  from scanning electron microscope · CPC title

• G06T2207/30148

  Semiconductor; IC; Wafer · CPC title

• G06T2207/20068

  Projection on vertical or horizontal image axis · CPC title