Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer
US-8999817-B2 · Apr 7, 2015 · US
US10599038B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10599038-B2 |
| Application number | US-201715849689-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 21, 2017 |
| Priority date | Jun 23, 2015 |
| Publication date | Mar 24, 2020 |
| Grant date | Mar 24, 2020 |
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Provided are a rinsing liquid which is used for rinsing a resist film obtained from an actinic ray-sensitive or radiation-sensitive composition and includes a hydrocarbon-based solvent having a branched alkyl group. The hydrocarbon-based solvent having a branched alkyl group contains at least one of isodecane or isododecane.
Opening claim text (preview).
What is claimed is: 1. A pattern forming method comprising the successive steps of: a resist film forming step of forming a resist film using an actinic ray-sensitive or radiation-sensitive composition, an exposure step of exposing the resist film, a step of developing the exposed resist film using a developer containing an organic solvent, and a step of rinsing the developed resist film using a rinsing liquid comprising hydrocarbon-based solvent having a branched alkyl group, wherein the hydrocarbon-based solvent having a branched alkyl group comprises a mixture of compounds having a same number of carbon atoms and different structures, and at least one of the compounds is isodecane or isododecane, wherein the number of carbon atoms in each of the compounds is 10 or more. 2. The pattern forming method according to claim 1 , wherein the organic solvent contained in the developer is an ester-based solvent. 3. The pattern forming method according to claim 1 , wherein the organic solvent contained in the developer contains one or more selected from the group consisting of butyl acetate, pentyl acetate, and isoamyl acetate. 4. The pattern forming method according to claim 1 , wherein the actinic ray-sensitive or radiation-sensitive composition contains a resin containing a repeating unit represented by General Formula (1): in General Formula (1), A represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or a cyano group, R represents a halogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, an aralkyl group, an alkoxy group, an alkylcarbonyloxy group, an alkylsulfonyloxy group, an alkyloxycarbonyl group, or an aryloxycarbonyl group; in the case where there are a plurality of R's, they may be the same or different; and in the case of having a plurality of R's, they may form a ring in cooperation with each other, a represents an integer of 1 to 3, and b represents an integer of 0 to (3-a). 5. The pattern forming method according to claim 1 , wherein the exposure is carried out using electron beams or extreme ultraviolet rays. 6. An electronic device manufacturing method, comprising: the pattern forming method according to claim 1 . 7. A rinsing liquid for use in rinsing a resist film obtained from an actinic ray-sensitive or radiation-sensitive composition, comprising: a hydrocarbon-based solvent having a branched alkyl group; and an antioxidant comprising an amine-based antioxidant or a phenol-based antioxidant, wherein the hydrocarbon-based solvent having a branched alkyl group contains at least one of isodecane or isododecane. 8. A pattern forming method comprising the successive steps of: a resist film forming step of forming a resist film using an actinic ray-sensitive or radiation-sensitive composition, an exposure step of exposing the resist film, a step of developing the exposed resist film using a developer selected from a group consisting of butyl acetate, isopentyl acetate, butyl butanoate, isobutyl isobutanoate, 2-heptanone, butyl propionate, diisobutyl ketone, diisopropyl ether, and a mixture of butyl acetate/isopentyl acetate with a mass ratio of 70/30, and a step of rinsing the developed resist film using a rinsing liquid selected from a group consisting of isodecane, isododecane, 2,2,3-trimethyl hexane, isoundecane, isohexadecane, a mixture of isodecane/isododecane with a mass ratio of 20/80, 4-methyl-2-pentanol, n-octane, and 1-hexanol, wherein the actinic ray-sensitive or radiation-sensitive composition contains a resin (A), and the resin (A) contains: a repeating unit represented by General Formula (1): ;and a repeating unit having a group that decomposes by action of an acid to generate a carboxyl group, wherein a content of the repeating unit having the group that decomposes by the action of the acid to generate the carboxyl group is 60 to 90 mol% With respect to all repeating units in the resin (A).
Phenols or alcohols · CPC title
Oxygen · CPC title
Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title
Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title
Non-aqueous compositions · CPC title
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