Wire saw apparatus

US10589446B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10589446-B2
Application numberUS-201615558833-A
CountryUS
Kind codeB2
Filing dateMar 3, 2016
Priority dateMay 1, 2015
Publication dateMar 17, 2020
Grant dateMar 17, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wire saw apparatus including: a wire row formed of a wire wound around a plurality of wire guides and reciprocatively travels in an axial direction; a nozzle from a coolant or slurry is supplied to the wire; and a workpiece feed mechanism presses a held workpiece against the wire row, the wire saw apparatus slice the workpiece into a wafer shape by pressing the workpiece held by the workpiece feed mechanism against the wire row and feeding it for slicing while supplying the coolant or the slurry from the nozzle to the wire, the wire saw apparatus nozzle is arranged above the wire row to be orthogonal to the wire row, and windbreak plates are arranged on both left and right sides of the arranged nozzle seen from an axial direction.

First claim

Opening claim text (preview).

The invention claimed is: 1. A wire saw apparatus comprising: a wire row formed of a wire that is wound around a plurality of wire guides and reciprocatively travels in an axial direction of the wire; a nozzle from which a coolant or slurry is supplied to the wire; and a workpiece feed mechanism that presses a held workpiece against the wire row, the wire saw apparatus being configured to slice the workpiece into a wafer shape by pressing the workpiece held by the workpiece feed mechanism against the wire row and feeding it for slicing while supplying the coolant or the slurry from the nozzle to the wire, wherein the nozzle is arranged above the wire row to be orthogonal to the wire row, and windbreak plates are arranged on both left and right sides of the arranged nozzle seen from an axial direction of the nozzle, each windbreak plate is arranged in such a manner that a distance between a lower surface of the windbreak plate and the wire row is 1 mm or more and 10 mm or less, the nozzle comprises an opening through which the coolant or slurry is supplied to the wire, wherein the opening of the nozzle faces the wire of the wire row, which causes the coolant or the slurry to flow downward from the nozzle to the wire, and wherein the lower surface of the windbreak plate is closer to the wire than the opening of the nozzle. 2. The wire saw apparatus according to claim 1 , wherein each windbreak plate is arranged in such a manner that a distance from a center of a slit provided in a lower surface of the nozzle to the each windbreak plate is 5 mm or more and 40 mm or less.

Assignees

Inventors

Classifications

  • for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

  • B28D5/0076Primary

    for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work · CPC title

  • Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D) · CPC title

  • B24B27/06Primary

    Grinders for cutting-off · CPC title

  • using a cutting wire · CPC title

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Frequently asked questions

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What does patent US10589446B2 cover?
A wire saw apparatus including: a wire row formed of a wire wound around a plurality of wire guides and reciprocatively travels in an axial direction; a nozzle from a coolant or slurry is supplied to the wire; and a workpiece feed mechanism presses a held workpiece against the wire row, the wire saw apparatus slice the workpiece into a wafer shape by pressing the workpiece held by the workpiece…
Who is the assignee on this patent?
Shinetsu Handotai Kk
What technology area does this patent fall under?
Primary CPC classification B28D5/0076. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 17 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).