Thermal management assembly

Patent metadata

Field	Value
Publication number	US-10579115-B2
Application number	US-201816139109-A
Country	US
Kind code	B2
Filing date	Sep 24, 2018
Priority date	Apr 30, 2014
Publication date	Mar 3, 2020
Grant date	Mar 3, 2020

Abstract

A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

First claim

What is claimed is:

1. A memory module cooling device, comprising: two thermal members, each having: a first side to couple to a memory module: and a second side opposite from the first side, the second side having a flat surface, and a first recess that is recessed from the flat surface; and a connection member that is to clamp the thermal members together by engaging the thermal members in theft respective first recesses; wherein, one of the thermal members includes a tab extending from its first side and one of the thermal members includes a through hole, and when the memory module cooling device is installed on the memory module, the tab engages a notch in a short edge of the memory module, and the tab engages the through hole, and wherein when the memory module cooling device is installed on the memory module, a highest point of the memory module cooling device is substantially level with a top surface of the memory module.

2. The memory module cooling device of claim 1 ,
wherein the connection member is to clamp the thermal members together by extending around the short edge of the memory module to engage the thermal members in their respective first recesses.

3. The memory module cooling device of claim 1 , wherein when the connection member is engaging the thermal members in their respective first recesses, the connection member covers the tab and the through hole.

4. The memory module cooling device of claim 1 ,
wherein, for each of the thermal members, the flat surface of the second side of the thermal member extends continuously across the entirety of the second side except for in the first recess.

5. The memory module cooling device of claim 1 ,
wherein, for each of the thermal members, the second side includes a second recess that is recessed from the flat surface at an opposite end of the thermal member from the first recess.

6. The memory module cooling device of claim 5 ,
wherein, for each of the thermal members, the flat surface of the second side of the thermal member extends continuously across the entirety of the second side except for in the first recess and the second recess.

7. The memory module cooling device of claim 1 , wherein the through hole located within the first recess of one of the thermal members.

8. The memory module cooling device of claim 1 , wherein the tab is under the first recess of one of the thermal members when the thermal member is viewed from a perspective facing the second side of the thermal member.

9. The memory module cooling device of claim 1 ,
wherein the thermal members include top surfaces that are flat and continuous, and
when the memory module cooling device is installed on the memory module, no part of the memory module cooling device is higher than the respective top surfaces of the thermal members.

10. A computing system, comprising:
the memory module cooling device of claim 1 ;
the memory module installed in a socket of a circuit board with the memory module cooling device installed on the memory module; and
a cold plate thermally coupled with the thermal members.

11. A memory module cooling device, comprising: two thermal members, each having: a first side to couple to a memory module; and a second side opposite from the first side, the second side having a flat surface, a first recess that is recessed from the flat surface, and a second recess that is recessed from the flat surface; a first connection member that is to clamp the thermal members together by extending around a first short edge of the memory module and engaging the thermal members in their respective first recesses; and a second connection member that is to clamp the thermal members together by extending around a second short edge of the memory module and engaging the thermal members in their respective second recesses; wherein for each of the thermal members, the flat surface of the second side of the thermal member extends continuously across the entirety of the second side except for in the first recess and the second recess.

12. The memory module cooling device of claim 11 ,
wherein, when the memory module cooling device is installed on the memory module, a highest point of the memory module cooling device is substantially level with a top surface of the memory module.

13. A computing system, comprising:
the memory module cooling device of claim 11 ;
the memory module installed in a socket of a circuit board with the memory module cooling device installed on the memory module; and
a cold plate thermally coupled with the thermal members,
wherein no connection members extend around the respective top surfaces of the thermal members.

14. The computing system of claim 13 ,
wherein the cold plate extends across, and is in contact with, an entire length of the respective top surfaces of the thermal members.

15. The computing system of claim 13 , wherein each of the thermal members includes a tab extending from its first side and each of the thermal members includes a through hole, and each et the tabs engages a notch in one of the first and second short edges of the memory module and one of the through holes.

16. The memory module cooling device of claim 11 ,
wherein for each of the thermal members, the entirety of the second side, except for the first recess and the second recess, is coplanar with the flat surface.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Bowden Thomas Robert
• Doerr Alan B
• Franz John
• Benedict Melvin K
• Allen Joseph
• Norton John
• Nguyen Binh

Classifications

• G06F13/42

  Bus transfer protocol, e.g. handshake; Synchronisation · CPC title

• G06F1/206 Primary

  comprising thermal management · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• G06F1/185

  Mounting of expansion boards · CPC title

• H01L2924/0002

  Electricity · mapped topic