Electronic component

Patent metadata

Field	Value
Publication number	US-10575404-B2
Application number	US-201816134733-A
Country	US
Kind code	B2
Filing date	Sep 18, 2018
Priority date	Sep 28, 2017
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

First claim

What is claimed is:

1. An electronic component comprising:
an element body having a pair of end surfaces which face each other and four side surfaces which connect the pair of end surfaces and formed of a semiconductor ceramic;
a thin film layer disposed to cover the pair of end surfaces and the four side surfaces and having an electrical insulation property;
a first external electrode and a second external electrode disposed on a side of each of the pair of end surfaces; and
an internal conductor disposed in the element body,
wherein the thin film layer is formed along a surface shape of each of the pair of end surfaces and the four side surfaces,
each of the first external electrode and the second external electrode has a first electrode layer disposed on the thin film layer and electrically connected to the internal conductor, a second electrode layer disposed to cover the first electrode layer, a first plating layer disposed to cover the second electrode layer, and a second plating layer disposed to cover the first plating layer,
a thermal conductivity of the second electrode layer is lower than a thermal conductivity of the first electrode layer; and
a thermal conductivity of the first plating layer and the second plating layer is lower than the thermal conductivity of the first electrode layer.

2. The electronic component according to claim 1 ,
wherein a thickness of the thin film layer disposed on the four side surfaces is greater than a thickness of the thin film layer disposed on the pair of end surfaces.

3. The electronic component according to claim 1 ,
wherein the thin film layer has a thickness of 50 nm or more and 300 nm or less.

Assignees

• Tdk Corp

Inventors

• Yoshida Naoyoshi
• Yamada Kouki
• Aiba Hisashi
• Takeya Kazuto
• Nakamura Hiroya

Classifications

• H01C7/008

  Thermistors (H01C7/02 - H01C7/06 take precedence) · CPC title

• H01C7/041 Primary

  formed with two or more layers · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C7/18

  comprising a plurality of layers stacked between terminals · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title