Manufacturing method for deposition mask, metal plate used for producing deposition mask, and manufacturing method for said metal sheet

Patent metadata

Field	Value
Publication number	US-10570498-B2
Application number	US-201615548897-A
Country	US
Kind code	B2
Filing date	Feb 5, 2016
Priority date	Feb 10, 2015
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

The present invention provides a metal sheet, on a first surface of which a resist pattern having a narrow width can be stably provided. This manufacturing method for a metal sheet includes a preparation step of preparing a sheet material comprising an iron alloy that contains nickel. When a composition analysis of the first surface of the metal sheet obtained from the sheet material is performed using X-ray photoelectron spectroscopy, the ratio A1/A2 obtained by the result of the X-ray photoelectron spectroscopy does not exceed 0.4, where A1 is the sum of the peak area value of nickel oxide and the peak area value of nickel hydroxide, and A2 is the sum of the peak area value of iron oxide and the peak area value of iron hydroxide.

First claim

The invention claimed is:

1. A manufacturing method for a metal plate used for manufacturing a deposition mask having a plurality of through-holes formed therein, the method comprising a preparation step of preparing a plate member made of an iron alloy containing nickel,
wherein:
when a composition analysis of a first surface of the metal plate obtained from the plate member is performed by using an X-ray photoelectron spectroscopy, a ratio A1/A2 obtained by the result of the X-ray photoelectron spectroscopy is 0.4 or less, where A1 is a sum of a peak planar dimension value of nickel oxide and a peak planar dimension value of nickel hydroxide, and A2 is a sum of a peak planar dimension value of iron oxide and a peak planar dimension value of iron hydroxide; and
in the composition analysis of the first surface of the metal plate by means of the X-ray photoelectron spectroscopy, an incident angle of an X-ray emitted to the metal plate on the first surface is 45 degrees, and an acceptance angle of photoelectrons discharged from the metal plate is 90 degrees.

2. The manufacturing method for a metal plate according to claim 1 , further comprising an annealing step of annealing the plate member to obtain the metal plate.

3. The manufacturing method for a metal plate according to claim 2 , the plate member is annealed in the annealing step so that the ratio A1/A2 is 0.4 or less.

4. The manufacturing method for a metal plate according to claim 2 , wherein
the annealing step is performed in an irreducible atmosphere or an inert gas atmosphere.

5. The manufacturing method for a metal plate according to claim 2 , wherein
the annealing step is performed in an inert gas atmosphere including nitrogen gas.

6. The manufacturing method for a metal plate according to claim 1 , wherein
the preparation step includes a rolling step of rolling a base metal made of an iron alloy containing nickel.

7. The manufacturing method for a metal plate according to claim 1 , wherein
the preparation step includes a foil creating step of creating a plating film by using a plating liquid including a solution containing a nickel compound and a solution containing an iron compound.

8. The manufacturing method for a metal plate according to claim 1 , wherein
a thickness of the metal plate is 85 μm or less.

9. The manufacturing method for a metal plate according to claim 1 , wherein
a thickness of the metal plate is 20 μm or less.

10. The manufacturing method for a metal plate according to claim 1 , wherein
the ratio A1/A2 is 0.3 or less.

11. The manufacturing method for a metal plate according to claim 1 , wherein
the metal plate obtained by the plate member is for manufacturing the deposition mask by exposing and developing a dry film attached to the first surface of the metal plate to form a first resist pattern, and by etching an area of the first surface of the metal plate to form the plurality of through-holes, the area being not covered with the first resist pattern.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Ikenaga Chikao
• Nakayama Hiroaki
• Ikeda Kazunari
• Hatsuta Chiaki
• OOUCHI Utako

Classifications

• C23F1/04

  Chemical milling · CPC title

• C23F1/02

  Local etching · CPC title

• H05B33/10

  Apparatus or processes specially adapted to the manufacture of electroluminescent light sources · CPC title

• C23C14/042 Primary

  using masks · CPC title

• C22C38/40

  with nickel · CPC title