Indium target and method for manufacturing same
US-9490108-B2 · Nov 8, 2016 · US
High entropy alloy having composite microstructure
US10570491B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10570491-B2 |
| Application number | US-201715455649-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 10, 2017 |
| Priority date | Mar 11, 2016 |
| Publication date | Feb 25, 2020 |
| Grant date | Feb 25, 2020 |
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Abstract
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A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.
First claim
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What is claimed is: 1. A high-entropy alloy having a composite structure, comprising: by weight %, iron (Fe) greater than 5% to 35% or less, manganese (Mn) greater than 5% to 35% or less, nickel (Ni) greater than 5% to 35% or less, and cobalt (Co) greater than 5% to 35% or less, and comprising, by weight %, at least one of copper (Cu) greater than 3% to 40% or less and silver (Ag) greater than 3% to 40% or less, wherein a ductile second phase is distributed in a matrix of the high-entropy alloy and the ductile second phase has a filament structure formed by deformation processing. 2. The high-entropy alloy having a composite structure of claim 1 , wherein the ductile second phase is one or more of a Cu-rich phase, an Ag-rich phase, a single phase dendrite, a phase separation region, and a particle. 3. The high-entropy alloy having a composite structure of claim 1 , wherein the ductile second phase has a width of 5 μm to 20 μm and a length of 30 μm to 300 μm. 4. The high-entropy alloy having a composite structure of claim 1 , wherein the filament structure has a thickness of 0.05 μm to 2 μm and a length of 10 μm to 1000 μm.
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Frequently asked questions
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- What does patent US10570491B2 cover?
- A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.
- Who is the assignee on this patent?
- Iac In Nat Univ Chungnam
- What technology area does this patent fall under?
- Primary CPC classification C22F1/16. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Feb 25 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).