Electrolytic copper plating solution analyzer, and electrolytic copper plating solution analysis method

Patent metadata

Field	Value
Publication number	US-10557819-B2
Application number	US-201615259734-A
Country	US
Kind code	B2
Filing date	Sep 8, 2016
Priority date	Mar 11, 2014
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

An electrolytic copper plating solution analyzer comprises an analysis container for accommodating a part of an electrolytic copper plating solution containing additives including a promoter, an inhibitor and a leveler, a working electrode immersed in the electrolytic copper plating solution accommodated in the analysis container, a reference electrode immersed in the electrolytic copper plating solution and used as a reference when a potential of the working electrode is determined, a counter electrode immersed in the electrolytic copper plating solution, a rotation drive unit for rotating the working electrode at a given speed, a current generation unit passing an electric current with a given current density between the working electrode and the counter electrode, a potential measurement unit for measuring the potential between the working electrode and the reference electrode, and an analysis unit for analyzing the relationship between an elapsed time after the current passage and the potential.

First claim

What is claimed is:

1. An electrolytic copper plating solution analyzer, comprising:
an analysis container for accommodating, as an analysis sample, a part of an electrolytic copper plating solution containing additives serving as a promoter and an inhibitor;
a working electrode immersed in the electrolytic copper plating solution accommodated in the analysis container, the working electrode being capable of receiving and transferring electrons;
a reference electrode immersed in the electrolytic copper plating solution accommodated in the analysis container and used as a reference when a potential of the working electrode is determined;
a counter electrode immersed in the electrolytic copper plating solution accommodated in the analysis container;
a rotation drive unit capable of rotating the working electrode at a given speed;
a current generation unit capable of passing an electric current with a given current density between the working electrode and the counter electrode;
a potential meter for measuring a potential between the working electrode and the reference electrode; and
a computer programmed to
analyze a relation between an elapsed time after passage of the current and the potential,
when the relation between the elapsed time and the potential is analyzed, calculate parameters indicating a condition of the electrolytic copper plating solution based on a reaction mechanism when a Cu(I) species, the Cu(I) species being generated on a surface of the working electrode during a deposition reaction of a copper plated film and that is formed from a component of the promoter and a Cu(I) ion, is substituted for the inhibitor, the inhibitor being located on the surface of the working electrode, and when the Cu(I) species forms a complex at least with the promoter; and
identify the condition of the electrolytic copper plating solution from the calculated parameters,

wherein the computer is programmed to analyze the relation between the elapsed time and the potential, measured with the potential meter, based on the following equations (41) and (61) to (63) to calculate, as the parameters, i i , i a , and C a */T i

η
=

A
·

T
⁡

[

ln
⁢

{

i
i

I

⁢

exp
⁡

(

-
B

·
I

⁢

C
a
*

T
i

⁢
t

)

+

i
a

I

⁢

{

1
-

exp
⁡

(

-
B

·
I

⁢

C
a
*

T
i

⁢
t

)

}

}

]

(
41
)

A
=

R

α
⁢

⁢
F

(
61
)

B
=

1
nFd

Assignees

• Toppan Printing Co Ltd

Inventors

• Kosugi Masahiro
• Okubo Toshikazu

Classifications

• G01N27/4161

  measuring the voltage and using a constant current supply, e.g. chronopotentiometry · CPC title

• C25D3/12

  of nickel or cobalt · CPC title

• C25D3/58

  containing more than 50% by weight of copper · CPC title

• G01N27/423 Primary

  Coulometry · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title