Workpiece dividing method

Patent metadata

Field	Value
Publication number	US-10535565-B2
Application number	US-201816053137-A
Country	US
Kind code	B2
Filing date	Aug 2, 2018
Priority date	Aug 9, 2017
Publication date	Jan 14, 2020
Grant date	Jan 14, 2020

Abstract

A workpiece dividing method includes: a laser processing step of forming along each street a plurality of minute holes extending in a pulsed laser beam application direction; and a dividing step of pressing the streets by a pressing member to divide a wafer along the streets. The minute hole has one end opening at least one of a front surface and a back surface of the wafer and is decreased in diameter from the one end toward the other end. In the dividing step, the pressing member is pressed against that surface of the front surface and the back surface of the wafer at which the one end of the minute hole is not opening.

First claim

What is claimed is:

1. A workpiece dividing method for dividing a workpiece along streets set on the workpiece, comprising:
a laser processing step of applying a pulsed laser beam to the workpiece along the street to form along the street a plurality of minute holes extending in a pulsed laser beam application direction, wherein each of the plurality of minute holes has a first end with an opening at least at one of a front surface and a back surface of the workpiece and is decreased in diameter from the first end toward an opposing, second end;
an aligning step of aligning the opening between two support members; and
a dividing step of pressing the streets by a pressing member to divide the workpiece along the streets, after the laser processing step is conducted,
wherein
in the dividing step, the pressing member is pressed against that surface of the front surface and the back surface of the workpiece at which the minute hole is not open.

2. The workpiece dividing method according to claim 1 , further comprising:
a checking step of checking at which one of the front surface and the back surface of the workpiece the first end or the second end of the minute hole is formed, before carrying out the dividing step.

3. The workpiece dividing method according to claim 2 , wherein the checking step includes checking at which one of the front surface and the back surface of the workpiece the first end or the second end of the minute hole is formed using a microscope.

4. The workpiece dividing method according to claim 1 , wherein the aligning step includes detecting the alignment of the opening between the two support members using an alignment camera.

5. The workpiece dividing method according to claim 1 , further comprising positioning focal points of the pulsed laser beam to extend from the back surface to the front surface of the workpiece.

6. The workpiece dividing method according to claim 1 , wherein the laser processing step includes forming modified regions along the plurality of minute holes.

7. A workpiece dividing method for dividing a workpiece along streets set on the workpiece, comprising:
a laser processing step of applying a pulsed laser beam to the workpiece along the street to form along the street a plurality of minute holes extending in a pulsed laser beam application direction, wherein each of the plurality of minute holes has a first end with a first opening at a front surface of the workpiece and a second, opposing end with a second opening at a back surface of the workpiece, wherein each of the plurality of holes decreases in diameter from the second end toward the first end; and
a dividing step of pressing the streets by a pressing member to divide the workpiece along the streets, after the laser processing step is conducted, wherein in the dividing step, the pressing member is pressed against the front surface of the workpiece at the first opening at the first end of each of the plurality of minute holes.

8. The workpiece dividing method according to claim 7 , further comprising:
a checking step of checking the front surface and the back surface of the workpiece for the first opening at the first end and the second opening at the second end of each of the plurality of the minute holes formed in the workpiece, before carrying out the dividing step.

9. The workpiece dividing method according to claim 8 , wherein the checking step includes checking the front surface and the back surface of the workpiece for the first opening at the first end and the second opening at the second end of each of the plurality of the minute holes formed in the workpiece, using a microscope.

10. The workpiece dividing method according to claim 7 , further comprising positioning focal points of the pulsed laser beam to extend from the back surface to the front surface of the workpiece.

11. The workpiece dividing method according to claim 7 , wherein the laser processing step includes forming modified regions along the plurality of minute holes.

12. A workpiece dividing method for dividing a workpiece along streets set on the workpiece, comprising:
a step of setting a position of a focal point of a pulsed laser beam relative to the workpiece by setting a value A for a laser applying unit in the range of from 0.05 to 0.20, where A is obtained by dividing numerical aperture of a focusing lens by refractive index of the workpiece;
a laser processing step of applying the pulsed laser beam through the focusing lens to the workpiece based on the value of A, along the street to form, along the street, a plurality of minute holes extending in a pulsed laser beam application direction, wherein each of the plurality of minute holes has a first end with an opening at least at one of a front surface and a back surface of the workpiece and is decreased in diameter from the first end toward an opposing, second end; and
a dividing step of pressing the streets by a pressing member to divide the workpiece along the streets, after the laser processing step is conducted,
wherein in the dividing step, the pressing member is pressed against that surface of the front surface and the back surface of the workpiece at which the minute hole is not open.

Assignees

• Disco Corp

Inventors

• Hattori Nao

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B23K2103/52

  Ceramics · CPC title