Resin composition and method of forming resist pattern

US10534263B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10534263-B2
Application numberUS-201715848404-A
CountryUS
Kind codeB2
Filing dateDec 20, 2017
Priority dateDec 22, 2016
Publication dateJan 14, 2020
Grant dateJan 14, 2020

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution by the action of acid, which includes a polymeric compound having at least two specific structural units.

First claim

Opening claim text (preview).

What is claimed is: 1. A resist composition comprising: a component (A) which exhibits changed solubility in a developing solution under action of acid, and an acid-generator component (B) which generates acid upon exposure, the component (A) comprising a polymeric compound having a structural unit represented by formula (1) shown below and a structural unit represented by general formula (2) shown below, wherein the acid-generator component (B) has an anion represented by formula (3) shown below: wherein in formula (1), R represents a hydrogen atom, an alkyl group or a halogenated alkyl group; La is selected from formula (1-1) or (1-2) shown below: wherein “*” represents a valence bond; each A1 independently represents a hydrogen atom, an alkyl group, an alkoxy group, a halogenated alkyl group, a hydroxy group, —COOR′, —OC(═O)R′, a hydroxyalkyl group or a cyano group; A2 represents an oxygen atom (—O—), a sulfur atom (—S—) or an alkylene group containing an oxygen atom or a sulfur atom; B1, B2 and B3 each independently represents a hydrogen atom, an alkyl group, an alkoxy group, a halogenated alkyl group, a hydroxy group, —COOR′, —OC(═O)R′, a hydroxyalkyl group or a cyano group; R′ represents a hydrogen atom or an alkyl group: Wherein in formula (2), R represents a hydrogen atom, an alkyl group or a halogenated alkyl group; Z represents a single bond or an alkyl group; and C p is a group represented by general formula (Cp-1) shown below: wherein R 2 represents a tertiary alkyl group, n p represents a positive integer, and * indicates the bonding position with Z; Y—COO—(CH 2 ) n —CHF—CF 2 —SO 3 −   (3) wherein Y represents a monocyclic or polycyclic group of 5 to 30 carbon atoms which may have a substituent, an alkyl group which may have a substituent, or an alkenyl group which may have a substituent; and n represents an integer of 1 to 5. 2. The resist composition according to claim 1 , wherein n p is 1, and R 2 is a tert-butyl group. 3. The resist composition according to claim 1 , wherein A1 is a hydrogen atom and A2 is a methylene group. 4. The resist composition according to claim 1 , wherein each of B1, B2 and B3 is a hydrogen atom. 5. The resist composition according to claim 1 , wherein Y is a polycyclic hydrocarbon group which may be substituted with a hydroxy group, or a polycyclic group which may have at least one carbon atom substituted with a carbonyl group. 6. The resist composition according to claim 1 , wherein the component (A) is a base component which exhibits increased solubility in a developing solution by the action of acid. 7. A method of forming a resist pattern, comprising: forming a resist film using the resist composition of claim 1 ; exposing the resist film; and developing the resist film to form a resist pattern.

Assignees

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Classifications

  • Aqueous alkaline compositions · CPC title

  • Non-aqueous compositions · CPC title

  • Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

  • G03F7/0397Primary

    the macromolecular compound having an alicyclic moiety in a side chain · CPC title

  • having no condensed rings · CPC title

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What does patent US10534263B2 cover?
A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution by the action of acid, which includes a polymeric compound having at least two specific structural units.
Who is the assignee on this patent?
Tokyo Ohka Kogyo Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/0397. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).