Decoupling systems

Patent metadata

Field	Value
Publication number	US-10529600-B2
Application number	US-201715474171-A
Country	US
Kind code	B2
Filing date	Mar 30, 2017
Priority date	Mar 30, 2017
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

A decoupling system includes a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber. The deflection plate includes one or more vacuum pores extending through the deflection plate. A peeling flange is coupled with a remainder of the deflection plate at a compliant joint. A die profile opening extends from the compliant joint around the peeling flange in the shape of a die profile. The die profile opening separates the peeling flange from the remainder of the deflection plate. The peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media. In the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate. In the peeling configuration the peeling flange is deflected, and at least a portion of the flange is spaced from the remainder of the deflection plate.

First claim

The claimed invention is:

1. A decoupling system comprising:
a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber, the deflection plate includes:
one or more vacuum pores extending through the deflection plate;
a peeling flange coupled with a remainder of the deflection plate at a compliant joint, and the peeling flange extends from the compliant joint to a flange end; and
a die profile opening extending from the compliant joint around the peeling flange in the shape of a die profile, the die profile opening separates the peeling flange from the remainder of the deflection plate; and

wherein the peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media:
in the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate; and
in the peeling configuration the peeling flange is deflected relative to the remainder of the deflection plate at the compliant joint and the flange end is spaced from the remainder of the deflection plate.

2. The decoupling system of claim 1 , wherein in the relaxed configuration the die media is fastened along the peeling flange and the remainder of the deflection plate; and
in the peeling configuration the die media remains fastened along the peeling flange and the remainder of the deflection plate, and a linear separation gap is between the die media and the die according to the deflection of the peeling flange.

3. The decoupling system of claim 1 , wherein the linear separation gap includes a shape corresponding to a shape of one or more of a portion of the die profile opening or the flange end.

4. The decoupling system of claim 2 , wherein the peeling flange includes a decoupled configuration, and in the decoupled configuration:
the peeling flange is further deflected relative to the peeling configuration; and
the linear separation gap moves toward the compliant hinge according to the further deflection.

5. The decoupling system of claim 1 , wherein the deflection plate; the compliant joint and the peeling flange are constructed with the same material.

6. The decoupling system of claim 1 , wherein the compliant joint includes a living hinge.

7. The decoupling system of claim 1 , wherein the peeling flange is a cantilever flange.

8. The decoupling system of claim 1 , wherein the peeling flange includes a peeling lug near the flange end, and the peeling lug is configured for coupling with a movable stage of a decoupler assembly.

9. The decoupling system of claim 1 , wherein the remainder of the deflection plate includes a plate perimeter extending around at least a portion of the peeling flange, and the die profile opening separates the plate perimeter from at least the flange end of the peeling flange.

10. The decoupling system of claim 1 comprising:
a decoupler housing including the low pressure orifice and the low pressure chamber;
a movable stage within the low pressure chamber, the movable stage is coupled with the peeling flange;
the die adhered along the die media; and
a picking assembly configured to selectively fasten with the die along a die interface.

11. A decoupling system comprising:
a decoupler assembly configured to decouple a die from a die media, the decoupler assembly includes:
a decoupler housing including a low pressure chamber;
a movable stage within the decoupler housing; and
a deflection plate coupled with the decoupler housing, the deflection plate includes:
one or more vacuum pores in communication with the low pressure chamber;
a compliant joint;
a die profile opening extending from the compliant joint; and
a peeling flange extending from the compliant joint to a flange end, the peeling flange within the die profile opening, and the peeling flange is coupled with the movable stage near the flange end.

12. The decoupling system of claim 11 , wherein the peeling flange is configured for deflection between relaxed and peeling configurations:
in the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate; and
in the peeling configuration the peeling flange is curved relative to the relaxed configuration with the movable stage, and a linear separation gap is initiated between the die and the die media according to the curve.

13. The decoupling system of claim 12 , wherein the peeling flange includes a decoupled configuration, and in the decoupled configuration:
the peeling flange is further curved relative to the peeling configuration; and
the linear separation gap moves toward the compliant hinge according to the further deflection.

14. The decoupling system of claim 11 , wherein the linear separation gap includes a shape corresponding to a shape of one or more of a portion of the die profile opening or the flange end.

15. The decoupling system of claim 11 , wherein the vacuum pores and the low pressure chamber are configured to fasten the media with the peeling flange in each of the relaxed and the peeling configurations.

16. The decoupling system of claim 11 comprising a picking assembly above the peeling flange, the picking assembly includes a die interface configured to hold the die static in each of the relaxed and peeling configurations.

17. The decoupling system of claim 11 , wherein the decoupler assembly includes a transmission coupled between the peeling flange and the movable stage, the transmission is configured to translate a first motion of the movable stage into a second motion of the peeling flange, the second motion different than the first motion.

18. The decoupling system of claim 11 , wherein the decoupler assembly includes a transmission coupled between the peeling flange and the movable stage, the transmission includes:
a roller bearing engaged with the movable stage;
a lever coupled with the roller bearing on a drive end of the lever, the lever including a driven end opposed to the drive end;
an axle extending through the lever, and the lever is configured to rotate around the axle, and a peeling lug coupling the driven end with the peeling flange.

19. The decoupling system of claim 11 , wherein the deflection plate, the compliant joint and the peeling flange are unitary.

Assignees

• Intel Corp

Inventors

• Ziadeh Bassam M
• Heckathorne Nathan P
• Heymann Douglas

Classifications

• H01L21/67132 Primary

  Electricity · mapped topic

• H01L21/6838

  Electricity · mapped topic

• H01L2221/68386

  Electricity · mapped topic

• H01L2221/68318

  Electricity · mapped topic

• H01L24/799

  Electricity · mapped topic