Substrate treatment method and substrate treatment apparatus

Patent metadata

Field	Value
Publication number	US-10529588-B2
Application number	US-201816012866-A
Country	US
Kind code	B2
Filing date	Jun 20, 2018
Priority date	Jun 1, 2015
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

In accordance with an embodiment, a substrate treatment method includes bringing a first metallic film on a substrate into contact with a first liquid, mixing a second liquid into the first liquid, and bringing the first metallic film or a second metallic film different from the first metallic film into contact with a liquid in which the first liquid and the second liquid are mixed together to etch the first or second metallic film. The first liquid includes an oxidizing agent, a complexing agent, and water (H2O) of a first content rate to etch the first metallic film. The second liquid includes water (H2O) at a second content rate higher than the first content rate after the etching has started.

First claim

The invention claimed is:

1. A substrate treatment apparatus comprising:
a chemical bath containing a first liquid comprising an oxidizing agent, a complexing agent, and water (H 2 O), the water in the first liquid being at a first content rate to etch a metallic film on a substrate immersed in the first liquid in the chemical bath;
a chemical tank containing a second liquid comprising the oxidizing agent, the complexing agent, and water (H 2 O), the water in the second liquid being at a second content rate higher than the first content rate; and
a liquid supply path provided between the chemical bath and the chemical tank to supply the second liquid in the chemical tank to the chemical bath to mix the second liquid with the first liquid in the chemical bath,
wherein the chemical tank is configured to supply the second liquid to the chemical bath at the point where an etching rate of the first liquid has become less than or equal to a predetermined value.

2. The apparatus of claim 1 ,
wherein the chemical bath is configured to contain the substrate to be etched.

3. The apparatus of claim 1 ,
wherein the oxidizing agent comprises at least one of a nitric acid (HNO 3 ), hydrogen peroxide water (H 2 O 2 ), and ozone (O 3 ).

4. The apparatus of claim 1 ,
wherein the complexing agent comprises a phosphoric acid (H 3 PO 4 ).

5. A substrate treatment apparatus comprising:
a first chemical tank containing a first liquid comprising an oxidizing agent, a complexing agent, and water (H 2 O), the water in the first liquid being at a first content rate to etch a metallic film on a substrate;
a second chemical tank containing a second liquid comprising the oxidizing agent, the complexing agent, and water (H 2 O), the water in the second liquid being at a second content rate higher than the first content rate;
a first liquid supply path provided between the first and second chemical tanks to supply the second liquid in the second chemical tank to the first chemical tank to mix the second liquid with and the first liquid in the first chemical tank;
an etching chamber configured to contain the substrate to be etched;
a second liquid supply path configured to supply the first liquid or a liquid in which the first liquid and the second liquid are mixed together to the etching chamber from the first chemical tank; and
a nozzle configured to supply the substrate with the first liquid or the first liquid mixed with the second liquid which has been supplied through the second liquid supply path,
wherein the second chemical tank is configured to supply the second liquid to the first chemical tank at the point where an etching rate of the first liquid has become less than or equal to a predetermined value.

6. The apparatus of claim 5 ,
wherein the oxidizing agent comprises at least one of a nitric acid (HNO 3 ), hydrogen peroxide water (H 2 O 2 ), and ozone (O 3 ).

7. The apparatus of claim 5 ,
wherein the complexing agent comprises a phosphoric acid (H 3 PO 4 ).

Assignees

• Toshiba Memory Corp

Inventors

• Akeboshi Yuya
• Tomita Hiroshi
• Okuchi Hisashi
• Yoshimizu Yasuhito
• Yamada Hiroaki

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0422

  for wet etching · CPC title

• H10P50/667 Primary

  by liquid etching only · CPC title

• C23F1/40

  for etching other metallic material · CPC title