Compound imaging metrology targets

Patent metadata

Field	Value
Publication number	US-10527951-B2
Application number	US-201615057723-A
Country	US
Kind code	B2
Filing date	Mar 1, 2016
Priority date	Jun 21, 2014
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

Imaging metrology targets and methods are provided, which combine one-dimensional (1D) elements designed to provide 1D imaging metrology signals along at least two measurement directions and two-dimensional (2D) elements designed to provide at least one 2D imaging metrology overlay signal. The target area of the 1D elements may enclose the 2D elements or the target areas of the 1D and 2D elements may be partially or fully congruent. The compound targets are small, possibly multilayered, and may be designed to be process compatible (e.g., by segmentation of the elements, interspaces between elements and element backgrounds) and possibly be produced in die. Two dimensional elements may be designed to be periodic to provide additional one dimensional metrology signals.

First claim

What is claimed is:

1. An imaging metrology target comprising:
a first plurality of elements designed to provide a plurality of one-dimensional imaging metrology signals along at least two measurement directions; and
a second plurality of elements designed to provide at least one two-dimensional imaging metrology overlay signal, wherein the second plurality of elements includes at least two pairs of elements, wherein a first element of at least one pair of the at least two pairs of elements is disposed on a first portion of the imaging metrology target, wherein a second element of the at least one pair of the at least two pairs of elements is disposed on a second portion of the imaging metrology target opposite the first portion of the imaging metrology target, wherein a periphery of the imaging metrology target includes the first plurality of elements and the second plurality of elements interspaced on the periphery of the imaging metrology target.

2. The imaging metrology target of claim 1 , wherein the first plurality of elements comprise at least two pairs of elements, wherein one pair of the at least two pairs of elements of the first plurality of elements are positioned along each measurement direction of the at least two measurement directions and elements of each pair of the at least two pairs of elements of the first plurality of elements are located at different target layers.

3. The imaging metrology target of claim 1 , wherein each pair of the at least two pairs of elements of the second plurality of elements are located at different target layers.

4. The imaging metrology target of claim 1 , wherein each of the elements in the first plurality of elements are gratings.

5. The imaging metrology target of claim 1 , wherein each of the elements in the second plurality of elements are symmetric with relation to a 180° rotation.

6. The imaging metrology target of claim 1 , wherein each of the elements in the second plurality of elements are fourfold rotationally symmetric.

7. The imaging metrology target of claim 1 , wherein each of the elements in the second plurality of elements are perpendicular gratings.

8. The imaging metrology target of claim 1 , wherein a background of at least one of the first plurality of elements is segmented.

9. The imaging metrology target of claim 1 , wherein a background of at least one of the second plurality of elements is segmented.

10. The imaging metrology target of claim 1 , wherein at least one of the first plurality of elements is segmented.

11. The imaging metrology target of claim 1 , wherein at least one of the second plurality of elements is segmented.

12. The imaging metrology target of claim 1 , wherein the imaging metrology target is at most 15 μm×15 μm.

13. The imaging metrology target of claim 1 , wherein the imaging metrology target is at most 10 μm×10 μm.

14. An apparatus comprising:
a metrology tool configured to acquire one or more metrology signals from an imaging metrology target, wherein the metrology tool is configured to derive a one-dimensional metrology signal in two measurement directions of the imaging metrology target and one two-dimensional metrology signal from the imaging metrology target, wherein the imaging metrology target comprises a first plurality of elements designed to provide a plurality of one dimensional imaging metrology signals along at least two measurement directions; and a second plurality of elements designed to provide at least one two dimensional imaging metrology overlay signal, wherein the second plurality of elements includes at least two pairs of elements, wherein a first element of at least one pair of the at least two pairs of elements is disposed on a first portion of the imaging metrology target, wherein a second element of the at least one pair of the at least two pairs of elements is disposed on a second portion of the imaging metrology target opposite the first portion of the imaging metrology target, wherein a periphery of the imaging metrology target includes the first plurality of elements and the second plurality of elements interspaced on the periphery of the imaging metrology target.

15. The apparatus of claim 14 , wherein each side of the imaging metrology target is equal to or less than 15 μm.

16. The apparatus of claim 14 , wherein the first plurality of elements comprise at least two pairs of elements, wherein one pair of the at least two pairs of elements of the first plurality of elements are positioned along each measurement direction of the at least two measurement directions and elements of each pair of the at least two pairs of elements of the first plurality of elements are located at different target layers.

17. The apparatus of claim 14 , wherein each pair of the at least two pairs of elements of the second plurality of elements are located at different target layers.

18. An imaging metrology target comprising:
a first plurality of elements designed to provide a plurality of one-dimensional imaging metrology signals along at least two measurement directions; and
a second plurality of elements designed to provide at least one two-dimensional imaging metrology overlay signal, wherein the second plurality of elements includes a plurality of intercrossing gratings, wherein the first plurality of elements enclose the second plurality of elements.

19. An apparatus comprising:
a metrology tool configured to acquire one or more metrology signals from an imaging metrology target, wherein the metrology tool is configured to derive a one-dimensional metrology signal in two measurement directions of the imaging metrology target and one two-dimensional metrology signal from the imaging metrology target, wherein the imaging metrology target comprises a first plurality of elements designed to provide a plurality of one dimensional imaging metrology signals along at least two measurement directions; and a second plurality of elements designed to provide at least one two dimensional imaging metrology overlay signal, wherein the second plurality of elements includes a plurality of intercrossing gratings, wherein the first plurality of elements enclose the second plurality of elements.

20. The apparatus of claim 19 , wherein the second plurality of elements comprise at least two pairs of elements, wherein elements of each pair of the at least two pairs of elements are located at different target layers.

21. The apparatus of claim 19 , wherein each side of the imaging metrology target is equal to or less than 15 μm.

Assignees

• Kla Tencor Corp

Inventors

• Yohanan Raviv
• Amit Eran
• Ghinovker Mark
• Itzkovich Tal
• Amir Nuriel

Classifications

• G03F7/70633 Primary

  Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching · CPC title

• G03F7/70625

  Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness · CPC title

• G03F7/70683 Primary

  Mark designs · CPC title

• G06F30/392

  Floor-planning or layout, e.g. partitioning or placement · CPC title

• G02B27/4222

  in projection exposure systems, e.g. photolithographic systems · CPC title