High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window by reflection additives
US-2017002193-A1 · Jan 5, 2017 · US
Thermally conductive polyamide compounds containing laser direct structuring additives
US10519356B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10519356-B2 |
| Application number | US-201515120690-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2015 |
| Priority date | Feb 25, 2014 |
| Publication date | Dec 31, 2019 |
| Grant date | Dec 31, 2019 |
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- Title
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Abstract
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A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix, boron nitride, and a laser direct structuring additive dispersed in the matrix. The compound can be extruded, molded, calendered, thermoformed, or 3D-printed into a heat dissipating and laser direct structured article.
First claim
Opening claim text (preview).
What is claimed is: 1. A thermally conductive polymer compound, comprising: (a) from about 40 to about 50 weight percent of the polymer compound of polyamide 6, (b) from about 20 to about 30 weight percent of hexagonal boron nitride, (c) from about 20 to about 30 weight percent of talc, (d) from about 2 to about 10 weight percent of a laser direct structuring additive, (e) from about 7 to about 20 weight percent of glass fiber reinforcing agent, (f) from about 0.2 to about 2 weight percent of calcium stearate lubricant, (g) from about 0.1 to about 0.4 weight percent of phenolic anti-oxidant, and (h) from about 0.1 to about 0.4 tri-aryl phosphite processing stabilizer, wherein the compound has an in-plane thermal conductivity of more than 2.5 W/mK as measured using ASTM E1461, a plating index greater than 0.7 as measured according to ASTM B568 (using Pocan 7102 at DOW Circuposit 4500 as a plating reference), and an adhesion strength greater than 0.7 N/mm as measured using IPC-TM-650. 2. The compound of claim 1 , wherein the laser direct structuring additive is selected from the group consisting of spinel based metal oxides, organic metal complexes, copper complexes, metal oxides, metal oxide-coated fillers or a combination of them. 3. The compound of claim 1 , further comprising an additive selected from the group consisting of adhesion promoters; biocides; anti-fogging agents; anti-static agents; bonding, blowing and foaming agents; dispersants; fillers and extenders; flame retardants; glass fibers; smoke suppressants; impact modifiers; initiators; micas; pigments, colorants and dyes; plasticizers; release agents; silanes, titanates and zirconates; slip and anti-blocking agents; ultraviolet light absorbers; viscosity regulators; waxes; catalyst deactivators, and combinations of them. 4. The compound of claim 1 , wherein the hexagonal boron nitride comprises about 20 weight percent of the compound.
Assignees
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Classifications
Binary compounds of nitrogen with boron · CPC title
Boron-containing compounds · CPC title
of metals · CPC title
Products made by additive manufacturing · CPC title
Conductive additives · CPC title
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Frequently asked questions
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- What does patent US10519356B2 cover?
- A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix, boron nitride, and a laser direct structuring additive dispersed in the matrix. The compound can be extruded, molded, calendered, thermoformed, or 3D-printed into a heat dissipating and laser direct structured article.
- Who is the assignee on this patent?
- Polyone Corp
- What technology area does this patent fall under?
- Primary CPC classification C09K5/14. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 31 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).