Polyamide compounds containing pitch carbon fiber

Patent metadata

Field	Value
Publication number	US-9243178-B2
Application number	US-201214232864-A
Country	US
Kind code	B2
Filing date	Jul 12, 2012
Priority date	Jul 15, 2011
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix with pitch-based carbon fiber, boron nitride, and organophosphinate flame regardant dispersed in the matrix. The compound can be extruded or molded into a heat dissipating article.

First claim

What is claimed is:

1. A thermally conductive polymer compound, comprising:
(a) polyamide,
(b) pitch-based carbon fiber,
(c) boron nitride, and
(d) a non-halogenated organic phosphinate,
wherein the compound has an in-plane thermal conductivity of more than 8 W/mK as measured using ASTM E1461.

2. The compound of claim 1 , wherein the polyamide is polyamide 6.

3. The compound of claim 1 , wherein the boron nitride is hexagonal boron nitride.

4. The compound of claim 1 , further comprising an additive selected from the group consisting of adhesion promoters; biocides; anti-fogging agents; anti-static agents; bonding, blowing and foaming agents; dispersants; fillers and extenders; smoke suppressants; impact modifiers; initiators; lubricants; micas; pigments, colorants and dyes; plasticizers; processing aids; release agents; silanes, titanates and zirconates; slip and anti-blocking agents; stabilizers; stearates; ultraviolet light absorbers; viscosity regulators; waxes; catalyst deactivators, and combinations of them.

5. The compound of claim 1 , wherein the compound has ingredients in amounts expressed in weight percent:

Polyamide Matrix
20-45

Boron Nitride
15-45

Pitch-based Carbon
10-30

Fiber

Non-halogenated Flame
10-35

Retardant

Optional Other
 0-20

Additives.

6. The compound of claim 1 , wherein the compound has ingredients in amounts expressed in weight percent:

Polyamide Matrix
25-40

Boron Nitride
20-40

Pitch-based Carbon
15-25

Fiber

Non-halogenated Flame
15-25

Retardant

Optional Other
0.2-15 

Additives.

7. The compound of claim 1 , wherein the compound has ingredients in amounts expressed in weight percent:

Polyamide Matrix
27-37

Boron Nitride
25-35

Pitch-based Carbon
18-22

Fiber

Non-halogenated Flame
15-20

Retardant

Optional Other
0.2-10 

Additives.

8. A molded article made from the compound of claim 1 .

9. An extruded article made from the compound of claim 1 .

10. A method of using the compound of claim 1 , wherein the compound is extruded or molded into an article designed to contact a headed object and conduct that heat away from that object or contact a heated object and conduct that heat toward a second object that needs heat also.

11. The method of claim 10 , wherein the polyamide of the compound is polyamide 6.

12. The method of claim 10 , wherein the boron nitride of the compound is hexagonal boron nitride.

Assignees

• Chen Haiyan
• Lim Ching Lee Joseph
• Fong Lai Chang
• Polyone Corp

Inventors

• Chen Haiyan
• Lim Ching Lee Joseph
• Fong Lai Chang

Classifications

• C08K3/38 Primary

  Boron-containing compounds · CPC title

• C08K5/5313

  Phosphinic compounds, e.g. R2=P(:O)OR' · CPC title

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title

• C08L77/00

  Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers · CPC title

• C08K7/06 Primary

  Elements · CPC title