Substrate processing system

Patent metadata

Field	Value
Publication number	US-10518382-B2
Application number	US-201615373703-A
Country	US
Kind code	B2
Filing date	Dec 9, 2016
Priority date	May 3, 2016
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.

First claim

What is claimed is:

1. A substrate processing system comprising:
a polishing part for performing a Chemical Mechanical Polishing process on a substrate;
a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein;
an inverting unit disposed in the pre-cleaning region and gripping the substrate in the pre-cleaning region to invert the substrate; and
a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region.

2. The substrate processing system of claim 1 , wherein the substrate having undergone the polishing process is unloaded to the pre-cleaning region, and the pre-cleaning is performed on the substrate that is unloaded.

3. The substrate processing system of claim 1 , comprising a cleaning fluid spraying part that is disposed in the pre-cleaning region and sprays a cleaning fluid onto the surface of the substrate.

4. The substrate processing system of claim 3 , wherein the cleaning fluid comprises at least one of the following: Standard Clean-1 ammonia hydroxide-hydrogen peroxide-water mixture, ammonia, sulfuric acid, hydrogen peroxide, and pure water.

5. The substrate processing system of claim 3 , wherein the cleaning fluid spraying part comprises a steam spraying part that sprays steam onto the surface of the substrate.

6. The substrate processing system of claim 3 , wherein:
the cleaning fluid spraying part comprises a heterogeneity fluid spraying part that sprays different heterogeneity fluids onto the surface of the substrate;
the heterogeneity fluid spraying part comprises:
a dry ice supply unit for supplying dry ice particles; and
a fluid spraying unit for vertically spraying a fluid onto the surface of the substrate; and

the dry ice particles and the fluid are sprayed onto the surface of the substrate while being mixed with each other.

7. The substrate processing system of claim 1 , comprising a megasonic generator that is disposed in the pre-cleaning region and supplies vibration energy to the surface of the substrate.

8. The substrate processing system of claim 1 , comprising a cleaning brush that is disposed in the pre-cleaning region and makes rotational contact with the surface of the substrate.

9. The substrate processing system of claim 1 , comprising a substrate mounting part disposed in the pre-cleaning region and allowing the substrate to be placed thereon,
wherein the substrate is pre-cleaned while being unloaded to the substrate mounting part.

10. The substrate processing system of claim 1 , wherein the polishing part comprises:
a first polishing region allowing a plurality of first polishing surface plates to be disposed therein;
a second polishing region facing the first polishing region and allowing a plurality of second polishing surface plates to be disposed therein; and
a substrate transfer line disposed between the first polishing region and the second polishing region, and transferring the substrate loaded to a loading region prepared in the polishing part, and
the substrate loaded to the loading region is transferred along the substrate transfer line to be polished in the first polishing region or the second polishing region, and then is unloaded to the pre-cleaning region.

11. The substrate processing system of claim 1 , wherein the inverting unit is disposed to be movable from a loading region, to which the substrate prepared in the polishing part is loaded, to the pre-cleaning region, receiving the substrate from the loading region, and transferring the substrate to the pre-cleaning region to invert the substrate,
wherein the substrate is pre-cleaned in the pre-cleaning region while being supported by the inverting unit.

12. The substrate processing system of claim 11 , wherein the inverting unit comprises:
an operation assembly moving the loading region to the pre-cleaning region; and
a rotation assembly invertibly connected to the operation assembly, and
the rotation assembly allows the substrate to be vertically disposed while the pre-cleaning is being performed.

13. A substrate processing system comprising:
a polishing part for performing a Chemical Mechanical Polishing process on a substrate;
a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein;
a blocking unit for blocking a pre-cleaning processing space of the pre-cleaning region from other spaces while the pre-cleaning is being performed in the pre-cleaning region; and
a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region.

14. The substrate processing system of claim 13 , wherein the blocking unit comprises:
a casing provided to surround the substrate and providing the independent pre-cleaning processing space; and
a shutter for opening or closing an inlet of the casing.

15. A substrate processing system comprising:
a polishing part for performing a Chemical Mechanical Polishing process on a substrate;
a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein;
a first buffer module prepared in the polishing part so as to receive the substrate having undergone the polishing process in the polishing part when the pre-cleaning process is being performed on the substrate in the pre-cleaning region, wherein the first buffer module comprises a plurality of cradles to receive a plurality of substrates, which are placed on the plurality of cradles; and
a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region.

16. The substrate processing system of claim 15 , wherein the plurality of cradles circulate in a component of upward and downward directions.

17. The substrate processing system of claim 15 , wherein the polishing part is configured to perform the polishing process on a polishing surface plate when the carrier head moves while gripping the substrate, and
the first buffer module moves between a moving path of the carrier head and the pre-cleaning region.

18. The substrate processing system of claim 10 , wherein the polishing part is configured to perform the polishing process on a polishing surface plate when the carrier head moves while gripping the substrate, and
the first buffer module is disposed between a moving path of the carrier head and the pre-cleaning region.

19. A substrate processing system comprising:
a polishing part performing a Chemical Mechanical Polishing process on a substrate;
a pre-cleaning region prepared in the polishing part and allowing pre-cleaning to be performed on the substrate having undergone the polishing process therein; and
a cleaning part for cleaning the substrate pre-cleaned in the pre-cleaning region, wherein the cleaning part comprises:
a plurality of cleaning units stacked in a vertical direction and individually performing cleaning on the substrate; and
a transfer unit transferring the substrate from one of the plurality of cleaning units to another of the plurality of cleaning units,
wherein the substrate is cleaned along a cleaning path that passes through at least one of the plurality of cleaning units in the cleaning part.

20. The substrate processing system of claim 19 , further comprising a cleaning buffer module disposed in the cleaning part and providing a space for the substrate to stand by until the cleaning process performed by one of the plurality

Assignees

• K C Tech Co Ltd
• Kctech Co Ltd

Inventors

• Kweon Young Kyu
• Son Byoung Chaul
• Cho Moon Gi
• An Joon Ho

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7621

  characterised by supporting two or more semiconductor substrates · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3304

  characterised by movements or sequence of movements of transfer devices · CPC title