Low permeability electrical feed-through

Patent metadata

Field	Value
Publication number	US-10515668-B2
Application number	US-201916449310-A
Country	US
Kind code	B2
Filing date	Jun 21, 2019
Priority date	Aug 9, 2017
Publication date	Dec 24, 2019
Grant date	Dec 24, 2019

Abstract

A low permeability electrical feed-through involves a laminate structure having alternating conductive and insulating layers with a conductive through-hole positioned therethrough, by which a lower connector pad is electrically connected with an upper connector pad. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment. An insulating layer is positioned and configured such that an associated horizontal leak path can meet an allowable feed-through leak rate, while the collection of layers is configured such that an associated vertical leak path can meet the feed-through leak rate.

First claim

What is claimed is:

1. A method of manufacturing an electrical feed-through component, the method comprising:
forming a first layer of conductive material over a first side of a copper clad laminate first insulator material and a second layer of conductive material over a second opposing side of said first insulator material;
etching away a circular portion of said second layer of conductive material;
forming a pre-impregnated glass-epoxy resin second insulator material over said second layer of conductive material and said second side of said first insulator material exposed through said circular portion of said second layer of conductive material;
forming a third layer of conductive material over said second insulator material;
forming a through-hole through each of said first layer of conductive material, said first insulator material, said second insulator material, and said third layer of conductive material;
forming a fourth conductive material covering an inside of said through-hole;
filling with a resin said through-hole inside of said fourth conductive material;
forming a first electrical pad conductive material over said first layer of conductive material and a second electrical pad conductive material over said third layer of conductive material; and
etching away a portion of said first electrical pad conductive material and said first layer of conductive material to form a first electrical connector pad and a portion of said second electrical pad conductive material and said third layer of conductive material and to form a second electrical connector pad;
wherein said first electrical connector pad and said second electrical connector pad are electrically connected via said fourth conductive material.

2. The method of claim 1 , wherein:
said forming second insulator material includes forming a second insulator material having an anisotropic gas leak rate and positioned within said electrical feed-through such that said leak rate is lesser in a vertical direction than in a horizontal direction.

3. The method of claim 2 , wherein:
said forming said second insulator material includes forming said second insulator material with a thickness that is less than a thickness of said first insulator material, thereby configuring a longer horizontal diffusion path through said second insulator material in the horizontal direction than in the vertical direction.

4. The method of claim 1 , wherein:
said forming said second insulator material includes forming a diffusion path in a vertical direction through said second insulator material and through said first insulator material that is limited by a radial distance between said second layer of conductive material and said fourth conductive material.

5. The method of claim 1 , wherein:
said etching away said circular portion of said second layer of conductive material and said etching away said portions of said third layer of conductive material and said second electrical pad conductive material include forming a capacitance area in which said second layer of conductive material partially overlaps with said third layer of conductive material and a ratio of said capacitance area to a thickness of said second insulator material is less than 10, to moderate a capacitive effect of said capacitance area.

6. A system for sealing an interface between a hermetically-sealed environment of an electronic component and an external environment, the system comprising:
means for limiting a diffusion path in a horizontal direction through an insulator layer of an electrical feed-through positioned at said interface.

7. The system of claim 6 , further comprising:
means for limiting a diffusion path in a vertical direction through multiple insulator layers of said feed-through.

8. The system of claim 6 , further comprising:
means for moderating a capacitive effect on high frequency electrical signals that transmit through a capacitance area within said feed-through.

Assignees

• Western Digital Tech Inc

Inventors

• Sudo Kimihiko
• Choe Seong-Hun
• Nagaoka Kazuhiro

Classifications

• G11B33/148 Primary

  Reducing friction, adhesion, drag · CPC title

• G11B25/043

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• G11B33/1406

  Reducing the influence of the temperature · CPC title

• G11B5/4846 Primary

  Constructional details of the electrical connection between arm and support · CPC title

• H02G3/22

  Installations of cables or lines through walls, floors or ceilings, e.g. into buildings · CPC title