Low permeability electrical feed-through

Patent metadata

Field	Value
Publication number	US-9736940-B2
Application number	US-201615228983-A
Country	US
Kind code	B2
Filing date	Aug 4, 2016
Priority date	Sep 18, 2015
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A low permeability electrical feed-through involves a laminated structure having a conductor layer sandwiched between adjacent insulator layers, which are sandwiched between adjacent diffusion control layers, where the laminated structure provides a relatively narrow and long, high aspect ratio diffusion channel to inhibit the leakage of gas from within a sealed device to the external environment. The electrical feed-through may comprise lower and upper electrical connection pads that are positioned within different regions of the feed-through but still electrically connected by way of a first via positioned in a sealed region, the conductor layer, and a second via positioned in an external environment region.

First claim

What is claimed is:

1. An electrical feed-through configured to interface between a hermetically-sealed environment and an external environment, the feed-through comprising:
a first diffusion control layer extending uninterrupted from an attachment region a distance along an external environment region;
a first insulator layer on top of said first diffusion control layer, said first insulator layer extending from a first via positioned within a sealed region to a second via positioned within said external environment region outside of said sealed region;
a conductor layer on top of said first insulator layer, said conductor layer electrically connecting said first via and said second via;
a second insulator layer on top of said conductor layer; and
a second diffusion control layer on top of said second insulator layer, said second diffusion control layer extending uninterrupted across a majority of a length of said electrical feed-through almost to said second via,
wherein said first diffusion control layer, said first insulator layer, said second insulator layer, and said second diffusion control layer form a high aspect ratio diffusion channel between said sealed region and said external environment region.

2. The electrical feed-through of claim 1 ,
wherein said diffusion channel has an aspect ratio characterized by a ratio of the width of said diffusion channel over the sum of the heights of said first and said second insulator layers; and
wherein, for a target leak rate for a gas within said sealed environment, said aspect ratio of said diffusion channel is greater than the product of (a) a constant representing the permeability of said gas, (b) a channel perimeter length of said diffusion channel, and (c) a ratio of a pressure drop of said gas along said width of said diffusion channel over said target leak rate.

3. The electrical feed-through of claim 1 , wherein said first via comprises a via hole, and wherein said via hole is positioned entirely within said sealed region.

4. The electrical feed-through of claim 1 , wherein said second via comprises a via hole, and wherein said via hole is positioned entirely within said external environment region.

5. The electrical feed-through of claim 1 , further comprising:
at least one pair of electrical connection pads comprising a lower electrical connection pad located within said sealed region and an upper electrical connection pad located within said external environment region.

6. The electrical feed-through of claim 5 , wherein said lower and upper electrical connection pads are electrically connected by way of said first via, said conductor layer, and said second via.

7. The electrical feed-through of claim 1 , wherein said first and second diffusion control layers are composed of a metal.

8. The electrical feed-through of claim 1 , wherein at least one of said first and second diffusion control layers is composed of a low permeability dielectric material.

9. The electrical feed-through of claim 1 , wherein at least one of said first and second diffusion control layers is composed of glass.

10. The electrical feed-through of claim 1 , further comprising:
a third via positioned within said sealed region and electrically connecting a high-frequency signal transmission line between a lower electrical connection pad and an upper electrical connection pad, wherein said third via is positioned such that said high-frequency signal transmission line is not routed between said first and second diffusion control layers.

11. The electrical feed-through of claim 1 , further comprising:
a glass layer positioned over at least a portion of said second diffusion control layer.

12. A method of sealing an electrical feed-through configured to interface between a hermetically-sealed environment and an external environment, the method comprising:
providing a first diffusion control layer extending uninterrupted from an attachment region of said electrical feed-through a distance along an external environment region of said electrical feed-through;
providing a first insulator layer on top of said first diffusion control layer, wherein said first insulator layer extends from a first via positioned within a sealed region of said electrical feed-through to a second via positioned within said external environment region outside of said sealed region;
providing a conductor layer on top of said first insulator layer, wherein said conductor layer electrically connects said first via and said second via;
providing a second insulator layer on top of said conductor layer; and
providing a second diffusion control layer on top of said second insulator layer, wherein said second diffusion control layer extends uninterrupted across a majority of a length of said electrical feed-through almost to said second via;
wherein said first diffusion control layer, said first insulator layer, said second insulator layer, and said second diffusion control layer form a high aspect ratio diffusion channel between said hermetically-sealed environment and said external environment.

13. The method of claim 12 ,
wherein said diffusion channel has an aspect ratio characterized by a ratio of the width of said diffusion channel over the sum of the heights of said first and said second insulator layers;
wherein, for a target leak rate for a gas within said hermetically-sealed environment, said aspect ratio of said diffusion channel is greater than the product of (a) a constant representing the permeability of said gas, (b) a channel perimeter length of said diffusion channel, and (c) a ratio of a pressure drop of said gas along said width of said diffusion channel over said target leak rate.

14. The method of claim 12 , further comprising:
providing at least one pair of electrical connection pads comprising a lower electrical connection pad located within said sealed region and an upper electrical connection pad located within said external environment region, wherein said lower and upper electrical connection pads are electrically connected by way of said first via, said conductor layer and said second via.

15. The method of claim 12 , further comprising:
providing a third via positioned within said sealed region and electrically connecting a high-frequency signal transmission line between a lower electrical connection pad and an upper electrical connection pad, wherein said third via is positioned such that said high-frequency signal transmission line is not routed between said first and second diffusion control layers.

16. The method of claim 12 , wherein providing said first diffusion control layer and providing said second diffusion control layer include providing said first and second diffusion control layers composed of a metal.

17. The method of claim 12 , wherein providing said first diffusion control layer and providing said second diffusion control layer include providing at least one of said first and second diffusion control layers composed of a low permeability dielectric material.

18. The method of claim 12 , wherein providing said first diffusion control layer and providing said second diffusion control layer include providing at least one of said first and second diffusion control layers composed of glass.

19. The method of claim 12 , further comprising:
providing a glass layer positioned over at least a portion of said second diffusion control layer.

Assignees

• HGST Netherlands BV
• Western Digital Tech Inc

Inventors

• Albrecht Thomas R
• Amin-Shahidi Darya
• Ayanoor-Vitikkate Vipin
• Hirano Toshiki

Classifications

• H05K3/40

  Forming printed elements for providing electric connections to or between printed circuits · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/113

  Via provided in pad; Pad over filled via · CPC title

• H01R13/52

  Dustproof, splashproof, drip-proof, waterproof, or flameproof cases · CPC title

• G11B33/148

  Reducing friction, adhesion, drag · CPC title