Feedthrough connector for hermetically sealed electronic devices
US-2015257293-A1 · Sep 10, 2015 · US
US9558790B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9558790-B1 |
| Application number | US-201615080487-A |
| Country | US |
| Kind code | B1 |
| Filing date | Mar 24, 2016 |
| Priority date | Mar 24, 2016 |
| Publication date | Jan 31, 2017 |
| Grant date | Jan 31, 2017 |
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Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
Opening claim text (preview).
What is claimed is: 1. A hermetic electrical connector, comprising: an external connector; an internal connector; and a barrier structure disposed between the external connector and the internal connector, wherein the barrier structure comprises: a dielectric material having a first surface and a second surface opposite the first surface; one or more layers embedded in the dielectric material, wherein the one or more layers each includes a plurality of openings; and a plurality of conductors embedded in the dielectric material, wherein each conductor extends through a corresponding opening of the plurality of openings of each layer. 2. The hermetic electrical connector of claim 1 , wherein the barrier structure is centrally-located within the hermetic electrical connector. 3. The hermetic electrical connector of claim 1 , wherein a layer of the one or more layers comprises aluminum, copper, ceramic, quartz, borosilicate glass, aluminosilicate glass, neoprene, butyl rubber, or nitrile rubber (Buna-N). 4. The hermetic electrical connector of claim 1 , wherein the one or more layers comprise two layers. 5. The hermetic electrical connector of claim 1 , wherein the one or more layers comprise one layer. 6. The hermetic electrical connector of claim 1 , wherein a conductor of the plurality of conductors is concentric with a corresponding opening of the plurality of openings, and the conductor is spaced apart from a layer of the one or more layers. 7. The hermetic electrical connector of claim 6 , wherein the conductor is spaced apart from the layer by about at least 150 microns. 8. The hermetic electrical connector of claim 6 , wherein the conductor is spaced apart from the layer by about 150 microns to about 500 microns. 9. The hermetic electrical connector of claim 1 , wherein an opening of the plurality of openings has a diameter of about at least 600 microns. 10. The hermetic electrical connector of claim 1 , wherein an opening of the plurality of openings has a diameter equal to a diameter of a conductor of the plurality of conductors plus at least 300 microns. 11. A hermetic electrical connector, comprising: an external connector; an internal connector; and a barrier structure disposed between the external connector and the internal connector, wherein the barrier structure comprises: a dielectric material having a first surface and a second surface opposite the first surface; a first plurality of connecting pads disposed on the first surface; a second plurality of connecting pads disposed on the second surface; a plurality of conductors embedded in the dielectric material, wherein each conductor has a first end adjacent a corresponding connecting pad of the first plurality of connecting pads and a second end adjacent a corresponding connecting pad of the second plurality of connecting pads; a first ground layer embedded in the dielectric material, wherein the first ground layer is coplanar with the first end of each conductor; a second ground layer embedded in the dielectric material, wherein the second ground layer is coplanar with the second end of each conductor; and one or more layers embedded in the dielectric material, wherein the one or more layers are located between the first and second ground layers. 12. The hermetic electrical connector of claim 11 , wherein a layer of the one or more layers comprises aluminum, copper, ceramic, quartz, borosilicate glass, aluminosilicate glass, neoprene, butyl rubber, or nitrile rubber (Buna-N). 13. The hermetic electrical connector of claim 11 , wherein the one or more layers each includes a plurality of openings. 14. The hermetic electrical connector of claim 13 , wherein a conductor of the plurality of conductors is concentric with a corresponding opening of the plurality of openings, and the conductor is spaced apart from a layer of the one or more layers. 15. The hermetic electrical connector of claim 14 , wherein the conductor is spaced apart from the layer by about at least 150 microns. 16. The hermetic electrical connector of claim 14 , wherein the conductor is spaced apart from the layer by about 150 microns to about 500 microns. 17. A hard disk drive, comprising: one or more magnetic media; one or more sliders; one or more magnetic head assemblies; and a hermetic electrical connector, comprising: an external connector; an internal connector; and a barrier structure disposed between the external connector and the internal connector, wherein the barrier structure comprises: a dielectric material having a first surface and a second surface opposite the first surface; one or more layers embedded in the dielectric material, wherein the one or more layers each includes a plurality of openings; and a plurality of conductors embedded in the dielectric material, wherein each conductor extends through a corresponding opening of the plurality of openings of each layer. 18. The hard disk drive of claim 17 , wherein a layer of the one or more layers comprises aluminum, copper, ceramic, quartz, borosilicate glass, aluminosilicate glass, neoprene, butyl rubber, or nitrile rubber (Buna-N). 19. The hard disk drive of claim 17 , wherein an opening of the plurality of openings has a diameter equal to a diameter of a conductor of the plurality of conductors plus at least 300 microns. 20. The hard disk drive of claim 17 , wherein an opening of the plurality of openings has a diameter equal to a diameter of a conductor of the plurality of conductors plus about 300 microns to about 1000 microns.
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