Bisphenol-A-free cold draw laminating adhesive

Patent metadata

Field	Value
Publication number	US-10513643-B2
Application number	US-201515526109-A
Country	US
Kind code	B2
Filing date	Nov 10, 2015
Priority date	Nov 12, 2014
Publication date	Dec 24, 2019
Grant date	Dec 24, 2019

Abstract

The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a high molecular weight polyester resin, an epoxy-terminated polyester, an additive, a curing agent, and a solvent, wherein, upon curing under curing conditions, the curable formulation forms at least one interpenetrating polymer network.

First claim

What is claimed is:

1. A curable formulation comprising
a) a high molecular weight polyester resin having an average molecular weight (Mw) of 50,000 to 125,000;
b) an epoxy terminated polyester having the structure

wherein —R 2 — is a divalent organic group,
wherein R′— is selected from the group consisting of

wherein -A- is a divalent alkyl group, —CA- is a divalent cycloalkyl group, j is 0 to 5, —R 2 — is a divalent organic group, —R 21 — is a divalent alkyl group, and —R 22 — is a divalent alkyl group
G- is

c) an additive selected from the group consisting of phosphoric acid and orthophosphoric acid;
d) a curing agent comprising of an isocyanate-based aliphatic compound or an isocyanate-based aromatic compound; and
e) a solvent

wherein, upon curing under curing conditions, the curable formulation forms at least one interpenetrating polymer network,
wherein the formulation is bisphenol-A free.

2. The curable formulation of claim 1 , wherein the curable formulation is cured with the isocyanate curing agent in a mix ratio in the range of from 100:1.0 to 100:8.0.

3. The curable formulation of claim 1 , wherein the high molecular weight polyester resin is prepared from at least one of the group consisting of ethylene glycol, terephthalic acid, and isophthalic acid.

4. The curable formulation of claim 1 , wherein an interpenetrating polymer network is formed between epoxide groups of the epoxy terminated polyester and isocyanate groups of the isocyanate curing agent.

5. The curable formulation of claim 1 , wherein the solvent is selected from the group consisting of ethyl acetate, methyl ethyl ketone, methyl acetate, and combinations thereof.

6. The curable formulation of claim 1 , wherein the high molecular weight polyester resin is present in an amount in the range of from 65 to 98 weight percent, the epoxy terminated polyester is present in an amount in the range of from 2.0 to 35.0 weight percent, the additive is present in an amount in the range of from 0.01 to 0.10 weight percent.

7. The curable formulation of claim 1 , having in the range of from 30 to 45 weight percent solids.

8. A laminating adhesive made from the curable formulation of claim 1 .

9. The laminating adhesive of claim 8 , wherein the laminating adhesive is characterized by having a glass transition temperature in the range of from −5° C. to 30° C. and a bond strength in the range of from 2.0 N/15 mm to 8.0 N/15 mm.

Assignees

• Dow Global Technologies Llc
• Rohm & Haas

Inventors

• Zupancic Joseph J
• Marine Amira A
• Vietti David E
• Vinci Daniele

Classifications

• C08L67/00 Primary

  Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain (of polyester-amides C08L77/12; of polyester-imides C08L79/08); Compositions of derivatives of such polymers · CPC title

• C08L67/025

  containing polyether sequences · CPC title

• C09D167/00 Primary

  Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain (based on polyester-amides C09D177/12; based on polyester-imides C09D179/08); Coating compositions based on derivatives of such polymers · CPC title

• C08K5/29

  Compounds containing {one or more} carbon-to-nitrogen double bonds · CPC title

• C09J11/06

  organic · CPC title