Electronic component guard ring

Patent metadata

Field	Value
Publication number	US-10504859-B2
Application number	US-201615283327-A
Country	US
Kind code	B2
Filing date	Oct 1, 2016
Priority date	Oct 1, 2016
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

Guard ring technology is disclosed. In one example, an electronic component guard ring can include a barrier having a first barrier portion and a second barrier portion oriented end to end to block ion diffusion and crack propagation in an electronic component. The guard ring can also include an opening in the barrier between the first and second barrier portions extending between a first side and a second side of the barrier. Associated systems and methods are also disclosed.

First claim

What is claimed is:

1. An electronic component guard ring, comprising:
a barrier comprising a contiguous material extending through layers of conductive material and layers of insulative material, the barrier having a first portion and a second barrier portion oriented end to end to block ion diffusion and crack propagation in an electronic component; and
an opening in the barrier between the first and second barrier portions extending between a first side and a second side of the barrier, wherein the opening comprises bridges of semiconductor material extending between conductive material on the first side and conductive material on the second side of the barrier.

2. The electronic component guard ring of claim 1 , wherein the first barrier portion and the second barrier portion are separated from one another by a gap to form the opening.

3. The electronic component guard ring of claim 1 , wherein the barrier comprises at least three barrier portions and the opening comprises a plurality of openings in the barrier between adjacent barrier portions.

4. The electronic component guard ring of claim 1 , wherein the barrier comprises a plurality of barriers spaced from one another on at least one of the first side and the second side.

5. The electronic component guard ring of claim 4 , wherein the plurality of barriers comprises at least three barriers.

6. The electronic component guard ring of claim 1 , further comprising a second barrier spaced from the first barrier on the first side or the second side, wherein the second barrier is continuous and devoid of an opening.

7. The electronic component guard ring of claim 6 , wherein the first barrier comprises a plurality of barriers spaced from one another on at least one of the first side and the second side.

8. The electronic component guard ring of claim 6 , wherein the second barrier is an innermost barrier.

9. The electronic component guard ring of claim 1 , wherein the barrier is disposed about a perimeter of the electronic component.

10. The electronic component guard ring of claim 1 , wherein the barrier comprises tungsten.

11. The electronic component guard ring of claim 1 , wherein the layers of conductive material and layers of insulative material are alternating layers of conductive material and insulative material.

12. The electronic component guard ring of claim 11 , wherein the electronic component is a memory component.

13. The electronic component guard ring of claim 12 , wherein the memory component is a NAND memory component.

Assignees

• Intel Corp

Inventors

• Zhu Hongbin
• Lee Minsoo
• Haller Gordon A
• Ireland Philip J

Classifications

• H10P50/242

  of Group IV materials · CPC title

• H10P14/412

  Deposition of metallic or metal-silicide materials · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W20/4451

  Semiconductor materials, e.g. polysilicon · CPC title

• H10W42/00 Primary

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title