Method and system using x-ray pinhole camera for in-situ monitoring of electron beam manufacturing process

Patent metadata

Field	Value
Publication number	US-10502701-B2
Application number	US-201815941245-A
Country	US
Kind code	B2
Filing date	Mar 30, 2018
Priority date	Mar 30, 2018
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

An additive manufacturing system includes a cabinet, an electron beam system, at least one imaging device, and a computing device. The cabinet is configured to enclose a component and defines a pinhole extending therethrough. The electron beam system is configured to generate an electron beam directed toward the component. Interactions between the component and the electron beam generate x-ray radiation. The at least one imaging device is configured to detect the x-ray radiation through the pinhole. The computing device is configured to image the component based on the x-ray radiation detected by the at least one imaging device.

First claim

What is claimed is:

1. An additive manufacturing system comprising:
a cabinet configured to enclose a component, said cabinet including a pinhole extending therethrough;
an electron beam system configured to generate an electron beam directed toward the component, wherein interactions between the component and the electron beam generate x-ray radiation;
at least one imaging device configured to detect the x-ray radiation through the pinhole; and
a computing device configured to image the component based on the x-ray radiation detected by said at least one imaging device, wherein said at least one imaging device is configured to detect at least one of an air pocket defined within the component, a void defined within the component, and a crack defined within the component.

2. The additive manufacturing system in accordance with claim 1 , wherein said at least one imaging device is positioned a first distance above the pinhole.

3. The additive manufacturing system in accordance with claim 2 , wherein the pinhole is positioned a second distance above the component.

4. An additive manufacturing system comprising:
a cabinet configured to enclose a component, said cabinet comprising a top side having a top surface, said top side defining at least one pinhole extending therethrough and an electron beam port extending therethrough;
an electron beam system configured to generate an electron beam directed through the electron beam hole toward the component, said electron beam system positioned above said top surface and outside said cabinet, wherein interactions between the component and the electron beam generate x-ray radiation; and
at least one imaging device configured to detect the x-ray radiation, said at least one imaging device positioned above said top surface and outside said cabinet, wherein the x-ray radiation is directed through the at least one pinhole toward said at least one imaging device, wherein said at least one imaging device is configured to detect at least one of an air pocket defined within the component, a void defined within the component, and a crack defined within the component.

5. The additive manufacturing system in accordance with claim 4 , wherein said at least one imaging device comprises a single imaging device.

6. The additive manufacturing system in accordance with claim 5 , wherein the at least one pinhole is a single pinhole.

7. The additive manufacturing system in accordance with claim 5 , wherein said at least one imaging device is positioned a first distance above the pinhole.

8. The additive manufacturing system in accordance with claim 7 , wherein said single imaging device and the at least one pinhole are configured to image multiple spots on the component.

9. The additive manufacturing system in accordance with claim 5 , wherein the at least one pinhole is positioned a second distance above the component.

10. The additive manufacturing system in accordance with claim 9 , wherein said single imaging device and the at least one pinhole are configured to image multiple spots on the component.

11. The additive manufacturing system in accordance with claim 4 , wherein said at least one imaging device comprises a plurality of imaging devices.

12. The additive manufacturing system in accordance with claim 11 , wherein said plurality of imaging devices are positioned a first distance above the pinhole.

13. The additive manufacturing system in accordance with claim 12 , wherein said plurality of imaging devices and the at least one pinhole are configured to image multiple regions of the component.

14. A method of monitoring a component manufactured in an additive manufacturing system, said method comprising:
directing an electron beam towards a build layer of the component positioned within a powder bed of the additive manufacturing system;
detecting by at least one detector the x-ray radiation generated by interactions between the component and the electron beam; and
determining at least one of a size and a depth of at least one of an air pocket defined within the component, a void defined within the component, and a crack defined within the component.

15. The method in accordance with claim 14 further comprising scanning the electron beam over at least one of the air pocket defined within the component, the void defined within the component, and the crack defined within the component.

16. The method in accordance with claim 14 further comprising modifying at least one of the air pocket defined within the component, the void defined within the component, and the crack defined within the component.

17. The method in accordance with claim 14 further comprising automated scanning of the electron beam on the component in a defined pattern.

18. The method in accordance with claim 14 further comprising comparing, in real time, at least one of the air pocket defined within the component, the void defined within the component, and the crack defined within the component with a CAD model of the component.

19. The method in accordance with claim 14 further comprising repairing at least one of the air pocket defined within the component, the void defined within the component, and the crack defined within the component.

Assignees

• Gen Electric

Inventors

• Lobastov Vladimir Anatolievich
• Ivan Adrian
• Bogdan Jr David Charles

Classifications

• B22F12/90

  Means for process control, e.g. cameras or sensors · CPC title

• B22F12/41

  characterised by the type, e.g. laser or electron beam · CPC title

• B22F12/38

  Housings, e.g. machine housings · CPC title

• B22F10/38

  to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures · CPC title

• B22F10/31

  Calibration of process steps or apparatus settings, e.g. before or during manufacturing · CPC title