Method and device for severing a microchip from a wafer and arranging the microchip on a substrate

Patent metadata

Field	Value
Publication number	US-10497589-B2
Application number	US-201715558859-A
Country	US
Kind code	B2
Filing date	Jan 23, 2017
Priority date	Jan 29, 2016
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

Method and device for severing a microchip from a wafer and arranging the microchip on a substrate, wherein the microchip is contact-bonded to the free end of a tip during severing and accordingly adheres to the tip through adhesive force while the substrate is transported. A coordinate measuring machine can advantageously be used as device.

First claim

What is claimed is:

1. Method for severing a microchip from a carrier body of a wafer and arranging the microchip on a substrate, wherein the microchip is connected to the carrier body inside a cutout of the carrier body by a plurality of retaining tabs, comprising the following method steps: arranging the wafer on a rigid base; arranging a tip of a handling device above the microchip; moving the tip downward towards the microchip, wherein shear forces and/or bending forces act on the retaining tabs while the tip contacts the microchip and these retaining tabs are broken so that the microchip is severed from the carrier body, wherein a contact bonding process is initiated when the tip contacts the microchip so that the microchip which is severed from the carrier body is held at the tip by an adhesive force, and is transported to the substrate and deposited thereon.

2. Method for severing a microchip from a carrier body of a wafer and arranging the microchip on a substrate according to claim 1 , further comprising applying voltage to the tip so that electrostatic forces reinforcing the contact bonding process are generated.

3. Method for severing a microchip from a carrier body of a wafer and arranging the microchip on a substrate according to claim 1 , further comprising initiating an additional contact bonding process when the microchip contacts the substrate, wherein the adhesive force which is brought about between the substrate and the microchip is greater than the adhesive force between the tip and the microchip so that the microchip adheres to the substrate by adhesive force after the tip is lifted from the substrate.

4. Method for severing a microchip from a carrier body of a wafer and arranging the microchip on a substrate according to claim 3 , wherein said voltage is applied to the substrate so that electrostatic forces reinforcing the contact bonding process are generated.

5. Method for severing a microchip from a carrier body of a wafer and arranging the microchip on a substrate according to claim 1 , wherein the microchip contacts the tip starting from its center point as the tip moves into full contact with the microchip.

6. Method for severing a microchip from a carrier body of a wafer and arranging the microchip on a substrate according to claim 3 , further comprising generating laser-induced metal deposition, which forms a metal bead at an edge of the microchip adhering to the substrate so that the microchip is permanently connected to the substrate.

Assignees

• Jenoptik Optical Sys Gmbh

Inventors

• Panitz Meik

Classifications

• B65G47/92

  incorporating electrostatic or magnetic grippers · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title