Light emitter device packages, components, and methods for improved chemical resistance and related methods

Patent metadata

Field	Value
Publication number	US-10490712-B2
Application number	US-201213554769-A
Country	US
Kind code	B2
Filing date	Jul 20, 2012
Priority date	Jul 21, 2011
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

Light emitter packages, components, and related methods for providing improved chemical resistance are provided herein. In one aspect, a component of a light emitter package is provided. The component can include a base material, a silver (Ag) containing material at least partially disposed over the base material, and a portion of phenyl containing silicone encapsulant at least partially disposed over the Ag portion. The component can be incorporated within a surface mount device (SMD) type light emitter package.

First claim

What is claimed is:

1. A component of a light emitter package, the component comprising:
a base material configured to support a light emitter chip;
a silver (Ag) containing material at least partially disposed over the base material, wherein the Ag containing material comprises an upper surface;
the light emitter chip disposed over a portion of the upper surface of the Ag containing material, the light emitter chip comprising an attach surface that opposes the upper surface of the Ag containing material; and
a protective layer at least partially disposed between portions of the upper surface of the Ag containing material and the attach surface of the light emitter chip, the protective layer disposed over portions of the light emitter chip and electrical connectors extending from the light emitter chip, the protective layer at least partially comprising a metallic, dielectric, or organic material for increasing chemical resistance of the Ag containing material, wherein the protective layer comprises a Si containing layer of material encapsulating the Ag containing material, light emitter chip and electrical connectors extending from the light emitter chip;
wherein a portion of the Ag containing material having the protective layer is encapsulated in a volume of phenyl containing silicone, wherein the upper surface of the Ag containing material and the volume of phenyl containing silicone encapsulant are disposed on opposing and at least partially parallel sides of the protective layer, wherein the volume of phenyl containing silicone comprises a cured hardness ranging from approximately A30 to approximately A80.

2. The component of claim 1 , wherein the volume of phenyl containing silicone is curable between approximately 100° C. and approximately 200° C.

3. The component of claim 1 , wherein the volume of phenyl containing silicone is curable at approximately 150° C.

4. The component of claim 1 , wherein the volume of phenyl containing silicone comprises a cured hardness ranging from approximately A40 to approximately A70.

5. The component of claim 1 , wherein the volume of phenyl containing silicone comprises a cured hardness ranging from approximately A20 to approximately D60.

6. The component of claim 1 , wherein the light emitter chip is wirebonded to a portion of the Ag containing material.

7. The component of claim 1 , wherein the phenyl containing silicone encapsulant comprises at least one phosphor disposed therein.

8. The component of claim 1 , wherein the base material comprises copper (Cu).

9. The component of claim 1 , wherein the component is incorporated within a surface mount device (SMD) type light emitter package.

10. A light emitting package comprising:
a silver (Ag) containing component;
one or more light emitting diode (LED) chips disposed over the Ag containing component;
a first protective layer at least partially disposed over the Ag containing component, the first protective layer at least partially comprising a metallic, dielectric, or organic material for increasing chemical resistance of the Ag containing component, wherein the first protective layer comprises a Si containing layer of material;
a second protective layer at least partially disposed over the first protective layer, the second protective layer at least partially comprising a metallic, dielectric, or organic material for further increasing chemical resistance of the Ag containing component;
wherein a portion of the first protective layer is disposed over portions of the one or more LED chips and electrical connectors extending from the one or more LED chips;
wherein the first protective layer is disposed between portions of a molded body of the LED package; and
a layer of silicone that encapsulates portions of the Ag containing component having the first and second protective layers, the one or more LED chips, and electrical connectors extending from the one or more LED chips.

11. The package of claim 10 , wherein the first protective layer comprises a compound derived from an organosilicone, a reactive silicone, or a reactive silane.

12. The package of claim 10 , wherein the Ag containing component comprises multiple components formed from a leadframe.

13. The package of claim 10 , further comprising a reflector cavity.

14. The package of claim 13 , wherein the first protective layer is disposed over sidewalls of the reflector cavity.

15. The package of claim 13 , wherein the layer of silicone comprises a phenyl containing silicone encapsulant material that is disposed in the reflector cavity.

16. The package of claim 15 , wherein the phenyl containing silicone encapsulant material is curable at approximately 150° C.

17. The package of claim 15 , wherein the phenyl containing silicone encapsulant material comprises a cured hardness ranging from approximately A30 to approximately A80.

18. The package of claim 15 , wherein the phenyl containing silicone encapsulant material comprises a cured hardness ranging from approximately A40 to approximately A70.

19. The package of claim 15 , wherein the phenyl containing silicone encapsulant material comprises a cured hardness ranging from approximately A20 to approximately D60.

Assignees

• Lin Shaow B
• Hussell Christopher P
• Cree Inc

Inventors

• Lin Shaow B
• Hussell Christopher P

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H01L33/60

  Electricity · mapped topic

• H01L2924/181

  Electricity · mapped topic