Light emitter devices having improved light output and related methods

Patent metadata

Field	Value
Publication number	US-9343441-B2
Application number	US-201213444399-A
Country	US
Kind code	B2
Filing date	Apr 11, 2012
Priority date	Feb 13, 2012
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

Light emitter devices having improved light output and related methods are disclosed. In one embodiment, light emitter devices can include a light emission area including one or more light emitting chips. The emitter device can further include a filling material at least partially disposed over the one or more light emitting chips. The filling material can include a first discrete layer of phosphor containing material and a second discrete layer of optically clear material. The device can optionally include more than one discrete layer of optically clear material. Each of the discrete layers of material can be separately dispensed within the light emission area such that the filling material is dispensed to a level that is substantially flush with an upper surface of the emitter device.

First claim

What is claimed is:

1. A light emitter device comprising:
a light emission area comprising one or more light emitting chips; and
a filling material at least partially disposed over the one or more light emitting chips, wherein the filling material comprises:
a first discrete layer of phosphor containing material; and
second and third discrete layers of optically clear material; and
wherein the first discrete layer of phosphor containing material is disposed between and contacts each of the second and third discrete layers of optically clear material, wherein the second discrete layer of optically clear material contacts the one or more light emitter chips, and wherein each of the first, second, and third discrete layers of material are approximately a same thickness.

2. The device of claim 1 , wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

3. The device of claim 1 , wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

4. The device of claim 1 , wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a medium refractive index (RI) silicone encapsulant having a RI of approximately 1.4 to 1.5.

5. The device of claim 1 , wherein the second and third discrete layers of optically clear material comprise a silicone, epoxy, or glass material.

6. The device of claim 5 , wherein the silicone material comprises a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

7. The device of claim 5 , wherein the silicone material comprises a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

8. The device of claim 5 , wherein the silicone material comprises a medium refractive index (RI) silicone encapsulant having a RI of approximately 1.4 to 1.5.

9. The device of claim 1 , wherein each of the second and third discrete layers of optically clear material increases a distance between the one or more light emitting chips and an air interface by approximately 0.2 and 0.5 mm.

10. The device of claim 1 , wherein a distance between the one or more light emitting chips and an air interface can be increased to approximately 2 mm by increasing one or more walls of the light emission area by approximately 0.2 mm to 1.5 MM.

11. The device of claim 1 , wherein a retention material is disposed about the light emission area.

12. The device of claim 11 , wherein a distance between the one or more light emitting chips and an air interface is increased by a secondary dam dispensed about the retention material.

13. The device of claim 12 , wherein the secondary dam is taller than the retention material.

14. The device of claim 5 , wherein the third discrete layer of optically material comprises glass.

15. The device of claim 1 , wherein each of the discrete layers of material is approximately 0.2 millimeters (mm) to 0.4 mm thick.

16. The device of claim 1 , further comprising a fourth discrete layer of phosphor containing material.

17. The device of claim 1 , wherein the light emission area comprises a cavity with the one or more light emitting chips disposed therein.

18. The device of claim 17 , wherein the cavity comprises a cavity volume and approximately 50% of the cavity volume is filled with the first discrete layer of material, approximately 25% of the cavity volume is filled with the second discrete layer of material, and approximately 25% of the cavity volume is filled with the third discrete layer of material.

19. The device of claim 17 , wherein the cavity comprises a cavity volume and approximately 40% of the cavity volume is filled with the first discrete layer of material, approximately 30% of the cavity volume is filled with the second discrete layer of material, and approximately 30% of the cavity volume is filled with the third discrete layer of material.

20. The device of claim 1 , wherein the device comprises a light output of approximately 1160 to 1190 lumens (lm) at 270 mA.

21. A light emitter device comprising:
a light emission area comprising a cavity with one or more light emitting chips disposed therein; and
a filling material at least partially disposed over the one or more light emitting chips, wherein the filling material comprises:
a first discrete layer of phosphor containing material; and
a plurality of discrete layers of optically clear material, wherein each of the plurality of layers comprises a same refractive index (RI) value of between approximately 1.4 and 2.0;
wherein the cavity comprises a cavity volume and at least approximately 25% of the cavity volume is filled with the first discrete layer of material and at least approximately 25% of the cavity volume is filled with the plurality of discrete layers of optically clear material.

22. The device of claim 21 , wherein approximately 50% of the cavity volume is filled with the first discrete layer of material and approximately 50% of the cavity volume is filled with the plurality of discrete layers of optically clear material.

23. The device of claim 21 , wherein approximately 25% of the cavity volume is filled with the first discrete layer of material and approximately 75% of the cavity volume is filled with the plurality of discrete layers of optically clear material.

24. The device of claim 21 , wherein approximately 75% of the cavity volume is filled with the first discrete layer of material and approximately 25% of the cavity volume is filled with the plurality of discrete layers of optically clear material.

25. The device of claim 21 , further comprising a plurality of discrete layers of phosphor containing material.

26. The device of claim 25 , wherein the plurality of discrete layers of phosphor containing material alternate with the plurality of discrete layers of optically clear material within the cavity.

27. A light emitter device comprising:
a light emission area comprising one or more light emitting chips; and
a filling material at least partially disposed over the one or more light emitting chips, wherein the filling material comprises:
a first discrete layer of phosphor containing material contacting the one or more light emitter chips; and
a second discrete layer of optically clear material;
wherein the second discrete layer of optically clear material is disposed directly over an upper surface of the first discrete layer of phosphor containing material; and
wherein the first and second discrete layers of material are approximately a same thickness.

28. The device of claim 27 , wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

29. The device of claim 27 , wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

30. The device of claim 27 , wherein the first discrete layer of phosphor containing material comprises one or more p

Assignees

• Reiherzer Jesse Colin
• Cree Inc

Inventors

• Reiherzer Jesse Colin

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title