Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction

Patent metadata

Field	Value
Publication number	US-9496466-B2
Application number	US-201113312508-A
Country	US
Kind code	B2
Filing date	Dec 6, 2011
Priority date	Dec 6, 2011
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.

First claim

What is claimed is:

1. A light emitter device comprising:
a submount comprising a first surface, with a first electrical element and a second electrical element disposed on the first surface;
at least one light emitting chip disposed over the first surface of the submount and electrically connected to each of the first and second electrical elements, wherein the at least one light emitting chip comprises a planar upper surface and an opposing planar lower surface that faces the first surface of the submount; and
a lens disposed on and encapsulating the at least one light emitting chip, the first electrical element, and the second electrical element, wherein the lens comprises a lens base having substantially the same geometry as a geometry of the submount wherein the lens extends flush with outermost edges of the submount such that at least one corner of the submount and a corner of the first or the second electrical element is disposed below a non-planar and curved surface of the lens; and
wherein portions of the lens extending to outermost edges of the lens base, outermost edges of the submount, and over outermost edges of the first and second electrical elements are devoid of one or more horizontal surfaces, and wherein the portions of the lens that are devoid of one or more horizontal surfaces extend both above and below a the planar lower surface of the light emitting chip.

2. The light emitter device according to claim 1 , wherein the geometry of the lens base and the submount is non-circular.

3. The light emitter device according to claim 1 , wherein the geometry of the lens base and the submount is circular.

4. The light emitter device according to claim 1 , wherein the geometry of the lens base and the submount is square.

5. The light emitter device according to claim 1 , wherein the lens comprises a first portion disposed above the planar upper surface of light emitting chip and a second portion disposed below the planar upper surface of light emitting chip.

6. The light emitter device according to claim 5 , wherein the first portion and the second portion are disposed along by a continuous straight, curved, or angled edge of the lens.

7. The light emitter device according to claim 1 , wherein the at least one light emitting chip is wirebonded to the first or the second electrical element disposed on the submount.

8. The light emitter device according to claim 1 , wherein the planar lower surface of the at least one light emitting chip is directly attached to each of the first and second electrical elements disposed on the submount.

9. The light emitter device according to claim 1 , wherein the at least one light emitting chip comprises at least one beveled surface.

10. The light emitter device according to claim 9 , wherein the at least one beveled surface faces a corner of the submount.

11. The light emitter device according to claim 9 , wherein the at least one beveled surface is offset at an angle with respect to a side of the submount.

12. The light emitter device according to claim 11 , wherein the angle comprises approximately 45°.

13. The light emitter device according to claim 1 , wherein the submount comprises a square geometry where each side is approximately 2.5 mm or less.

14. The light emitter device according to claim 13 , wherein the submount comprises a square geometry where each side is approximately 2.0 mm or less.

15. The light emitter device according to claim 13 , wherein the submount comprises a square geometry where each side is approximately 1.0 mm or less.

16. The light emitter device according to claim 1 , wherein the submount comprises a ceramic material.

17. A light emitter device comprising:
a submount comprising a first electrical element and a second electrical element disposed on the submount;
at least one light emitting chip disposed over the submount and electrically connected to the first and second electrical elements, wherein the at least one light emitting chip comprises a planar upper surface and an opposing planar lower surface that faces the submount; and
a lens disposed on and encapsulating the at least one light emitting chip, wherein the lens comprises a first portion disposed above the planar upper surface of the at least one light emitting chip and a second portion disposed below the planar lower surface of the at least one light emitting chip wherein the lens extends flush with outermost edges of the submount such that at least one corner of the submount and a corner of the first or the second electrical element is disposed below a non-planar and inclined surface of the lens; and
wherein the first portion and the second portion are disposed along a continuous non-planar edge of the lens.

18. The light emitter device according to claim 17 , wherein the lens comprises a lens base having substantially the same geometry as a geometry of the submount.

19. The light emitter device according to claim 18 , wherein the geometry of the lens base and the submount is non-circular.

20. The light emitter device according to claim 18 , wherein the geometry of the lens base and the submount is circular.

21. The light emitter device according to claim 18 , wherein the geometry of the lens base and the submount is square.

22. The light emitter device according to claim 17 , wherein the at least one light emitting chip is wirebonded to the first or the second electrical element disposed on the submount.

23. The light emitter device according to claim 17 , wherein the planar lower surface of the at least one light emitting chip is directly attached to each of the first and second electrical elements disposed on the submount.

24. The light emitter device according to claim 17 , wherein the at least one light emitting chip comprises at least one beveled surface.

25. The light emitter device according to claim 24 , wherein the at least one beveled surface faces a corner of the submount.

26. The light emitter device according to claim 24 , wherein the at least one beveled surface is offset at an angle with respect to a side of the submount.

27. The light emitter device according to claim 26 , wherein the angle comprises approximately 45°.

28. The light emitter device according to claim 17 , wherein the submount comprises a square geometry where each side is approximately 2.5 mm or less.

29. The light emitter device according to claim 28 , wherein the submount comprises the square geometry where each side is approximately 2.0 mm or less.

30. The light emitter device according to claim 28 , wherein the submount comprises the square geometry where each side is approximately 1.0 mm or less.

31. The light emitter device according to claim 17 , wherein the submount comprises a ceramic material.

32. A light emitter device comprising:
a submount comprising a first electrical element and a second electrical element disposed on the submount;
at least one light emitting chip disposed over the submount and electrically connected to each of the first and second electrical elements, wherein the at least one light emitting chip comprises a planar upper surface and an opposing planar lower surface that faces the submount; and
a lens disposed on the at least one light emitting chip, wherein the lens extends flush with outermost edges of the submount such that

Assignees

• Hussell Christopher P
• Lydon Justin
• Rosado Raymond
• Britt Jeffrey C
• Cree Inc

Inventors

• Hussell Christopher P
• Lydon Justin
• Rosado Raymond
• Britt Jeffrey C

Classifications

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W76/10

  Containers or parts thereof · CPC title

• H10H20/85

  Packages · CPC title

• H10H20/80

  Constructional details · CPC title

• H10H20/855 Primary

  Optical field-shaping means, e.g. lenses · CPC title