Inspection apparatus, semiconductor device manufacturing system including the same, and method of manufacturing a semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-10489902-B2
Application number	US-201615247537-A
Country	US
Kind code	B2
Filing date	Aug 25, 2016
Priority date	Oct 21, 2015
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

An inspection apparatus includes a light source device providing incident light to a substrate, an objective lens receiving reflection light reflected from the substrate, a light splitting device disposed over the objective lens, first and second optical sensors disposed at both sides of the light splitting device, respectively, and first and second spatial filters disposed between the first optical sensor and the substrate and between the second optical sensor and the substrate, respectively. The first and second spatial filters transmit the reflection light in different forms from each other.

First claim

What is claimed is:

1. An inspection apparatus comprising:
a light source device for providing incident light to a substrate;
an objective lens for transmitting reflection light reflected from the substrate;
a light splitting device disposed over the objective lens for receiving the reflection light transmitted from the objective lens, the light splitting device for splitting the received reflection light into a first split light and a second split light;
a tube lens disposed between the objective lens and the light splitting device;
a first optical sensor disposed at one side of the light splitting device for detecting the first split light;
a second optical sensor disposed at a second other side of the light splitting device for detecting the second split light;
a first spatial filtering device disposed between the first optical sensor and the light splitting device, the first spatial filter device comprising a first spatial filter; and
a second spatial filtering device disposed between the second optical sensor and the light splitting device, the second spatial filtering device comprising a second spatial filter,
wherein the first and second spatial filters have shapes that differ from one another,
wherein the first split light travels in a first direction towards the first optical sensor and the second split light travels in a second direction opposing the first direction towards the second optical sensor,
wherein the light splitting device comprises:
a first dividing mirror reflecting the reflection light received from the tube lens toward the first optical sensor; and
a second dividing mirror reflecting the reflection light received from the tube lens toward the second optical sensor,
wherein the first and second dividing mirrors intersect in an X-shape and have an intersecting point, and
wherein the intersecting point is disposed in an optical axis of the tube lens and a focus point of the tube lens.

2. The inspection apparatus of claim 1 , wherein the first spatial filter includes a first mask having a first aperture for transmitting the first split light,
wherein the second spatial filter includes a second mask having a second aperture for transmitting the second split light,
wherein the first and second apertures have shapes different from each other.

3. The inspection apparatus of claim 2 , wherein the first aperture has a circular shape, and
wherein the second aperture has a ring shape of which an outer diameter is equal to a diameter of the first aperture.

4. The inspection apparatus of claim 2 , wherein the first aperture has a circular shape,
wherein the second aperture has a circular shape having a center block, and
wherein a diameter of the second aperture is equal to a diameter of the first aperture.

5. The inspection apparatus of claim 1 , wherein the light source device comprises:
a light source generating the incident light;
a beam splitter disposed between the light source and the objective lens; and
a third spatial filter disposed between the beam splitter and the light source.

6. The inspection apparatus of claim 5 , wherein the third spatial filter has a third aperture for controlling a beam size of the incident light.

7. The inspection apparatus of claim 5 , wherein the light source device further comprises illumination lenses disposed between the light source and the third spatial filter.

8. The inspection apparatus of claim 1 , wherein the first spatial filtering device further comprises a first relay lens disposed between the first optical sensor and the first spatial filter and a second relay lens disposed between the first spatial filter and the light splitting device, and
wherein the second spatial filtering device further comprises a third relay lens disposed between the second optical sensor and the second spatial filter and a fourth relay lens disposed between the second spatial filter and the light splitting device.

9. A system for manufacturing a semiconductor device, the system comprising:
a manufacturing apparatus for performing a manufacturing process on a substrate to generate a semiconductor device; and
an inspection apparatus spaced apart from the manufacturing apparatus, the inspection apparatus for inspecting the substrate,
wherein the inspection apparatus comprises:
a light source device for providing incident light to the substrate;
an objective lens for transmitting reflection light reflected from the substrate;
a light splitting device disposed over the objective lens and for receiving the reflection light transmitted from the objective lens, the light splitting device for splitting the received reflection light into a first split light and a second split light;
a tube lens disposed between the objective lens and the light splitting device:

a first optical sensor disposed at one side of the light splitting device for detecting the first split light;
a second optical sensor disposed at a second other side of the light splitting device for detecting the second split light;
a first spatial filtering device disposed between the first optical sensor and the light splitting device, the first spatial filtering device comprising a first spatial filter; and
a second spatial filtering device disposed between the second optical sensor and the light splitting device, the second spatial filtering device comprising a second spatial filter,
wherein the first and second spatial filters have shapes that differ from one another, and
wherein the first split light travels in a first direction towards the first optical sensor and the second split light travels in a second direction opposing the first direction towards the second optical sensor,
wherein the light splitting device comprises:
a first dividing mirror reflecting the reflection light received from the tube lens toward the first optical sensor; and
a second dividing mirror reflecting the reflection light received from the tube lens toward the second optical sensor,
wherein the first and second dividing mirrors intersect in an X-shape and have an intersecting point, and

wherein the intersecting point is disposed in an optical axis of the tube lens and a focus point of the tube lens.

10. The system of claim 9 , wherein the inspection apparatus further comprises a controller for comparing a first image detected by the first optical sensor with a second image detected by the second optical sensor to obtain a defect pattern image.

11. The system of claim 10 , wherein the first image includes a first normal pattern image and a first defect pattern image,
wherein the second image includes a second normal pattern image and a second defect pattern image, and
wherein the controller obtains the defect pattern image from a difference between the first defect pattern image and the second defect pattern image.

12. The system of claim 11 , wherein the first defect pattern image includes a first disk shaped image of a first brightness,
wherein the second defect pattern image includes a second disk shaped image of a second brightness, and
wherein the defect pattern image obtained by the controller is a third disk shaped image corresponding to a brightness difference between the first brightness and the second brightness.

13. The system of claim 11 , wherein the first defect pattern image includes a first disk shaped image,
wherein the second defect pattern image includes a circular image, and
wherein the defect pattern image obtained by the controller is a second disk shaped image smaller than the first disk shaped image.

14. An inspection apparatus comprising:
a light source device for pro

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Kwang Soo
• Park Sangbong
• Jeon Byeonghwan
• Kim Youngduk

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0612

  Production flow monitoring, e.g. for increasing throughput · CPC title

• H04N23/90

  Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums · CPC title

• G01N21/95623

  using a spatial filtering method (per se G02B) · CPC title

• G06T2207/20224

  Image subtraction · CPC title