Apparatus for and method of performing inspection and metrology process
US-10732129-B2 · Aug 4, 2020 · US
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Jeon Byeonghwan patents
Jeon Byeonghwan is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jeon Byeonghwan |
| Total patents | 9 |
| First publication | Oct 29, 2015 |
| Latest publication | Aug 4, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Inspection apparatus, semiconductor device manufacturing system including the same, and method of manufacturing a semiconductor device using the same
US-10489902-B2 · Nov 26, 2019 · US
Inspection device for inspecting wafer and method of inspecting wafer using the same
US-10474133-B2 · Nov 12, 2019 · US
Substrate inspection system
US-2018164227-A1 · Jun 14, 2018 · US
Inspection device for inspecting wafer and method of inspecting wafer using the same
US-2018150057-A1 · May 31, 2018 · US
Optical inspection apparatus, a method of inspecting a substrate, and a method of treating a substrate
US-9915623-B2 · Mar 13, 2018 · US
Inspection apparatus, semiconductor device manufacturing system including the same, and method of manufacturing a semiconductor device using the same
US-2017116727-A1 · Apr 27, 2017 · US
Optical inspection apparatus, a method of inspecting a substrate, and a method of treating a substrate
US-2017082552-A1 · Mar 23, 2017 · US
Surface light source using arrayed point light sources
US-2015308654-A1 · Oct 29, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 9 |
| Samasung Electronics Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01N21/9501 | 7 |
| H10P74/203 | 6 |
| G01N21/95623 | 4 |
| G02B13/0095 | 4 |
| G02B27/0988 | 4 |