Resin board, method of manufacturing resin board, circuit board, and method of manufacturing circuit board

Patent metadata

Field	Value
Publication number	US-10483195-B2
Application number	US-201715620091-A
Country	US
Kind code	B2
Filing date	Jun 12, 2017
Priority date	Jun 21, 2016
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A resin board includes: a resin layer and a through electrode buried in the resin layer, wherein the through electrode has an electrode surface exposed from a front surface or a back surface of the resin layer and a lateral surface, and the electrode surface and the lateral surface form an obtuse angle.

First claim

What is claimed is:

1. A resin board comprising:
a first resin layer;
a columnar electrode buried in the first resin layer, the columnar electrode including a protruding portion that protrudes from a side surface of the columnar electrode and configured to cause an electric field applied to the columnar electrode to shift to inside of the first resin layer, the protruding portion having an exposed surface exposed from the first resin layer and a non-linear lateral surface connecting the exposed surface and the side surface, such that the exposed surface and the lateral surface form an obtuse angle; and
a second resin layer formed on the first resin layer so as to be in close contact with no gaps and including a plurality of wiring layers electrically connected to the columnar electrode through the exposed surface,
wherein a portion corresponding to a maximum diameter at the lateral surface of the protruding portion is embedded in the first resin layer,
a diameter of the exposed surface is smaller than the maximum diameter, and
the exposed surface has a shape which is recessed in a direction different from a direction of the second resin layer at a surface of the first resin layer.

2. The resin board according to claim 1 , wherein
the protruding portion includes a smooth lateral surface with no corner portion at the portion corresponding to the maximum diameter of the protruding portion, and
the protruding portion is eccentrically located at any one of a from surface side and a back surface side of the first resin layer.

3. The resin board according to claim 1 , wherein the columnar electrode has a uniform diameter region in the lateral surface thereof.

4. The resin board according to claim 3 , wherein the columnar electrode has a minimum diameter portion in the uniform diameter region.

5. The resin board according to claim 3 , wherein, a diameter of the exposed surface is greater than a diameter of the uniform diameter region.

6. The resin board according to claim 3 , wherein
the uniform diameter region includes an exposed surface exposed from an another surface of the first resin layer, the another surface being opposite side of the exposed surface of the protruding portion, and
the resin board further comprises
a second bump protruded from the first resin layer and configured to be formed so that the exposed surface of the uniform diameter region and a part of the another surface are covered, the bump being used for attaching a solder ball.

7. The resin board according to claim 6 , wherein the second bump includes:
a titanium layer formed on the exposed surface of the uniform diameter region,
a copper sputtering layer formed on the titanium layer, and
a copper plating layer formed on the copper sputtering layer.

8. The resin board according to claim 1 , wherein
an angle between a direction from a contour of the exposed surface to a center of the exposed surface and a side surface of the protruding portion forms an obtuse angle.

9. The resin board according to claim 1 , wherein
a material of the columnar electrode is copper (Cu), aluminum (Al) or tungsten (W).

10. The resin board according to claim 1 , wherein the resin board further comprises
a first bump protruded from the second resin layer and electrically connected with the plurality of wiring layers.

11. The resin board according to claim 1 , wherein the bump includes:
a copper plating layer formed on the second resin layer,
a nickel plating layer formed on the copper plating layer, and
a tin-silver (SnAg) alloy plating layer formed on the nickel plating layer.

Assignees

• Fujitsu Ltd

Inventors

• Kobayashi Yasushi
• Nakata Yoshihiro
• Ishizuki Yoshikatsu
• Ishibashi Daijiro
• Sasaki Shinya

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7424

  used as a support during the manufacture of self-supporting substrates · CPC title

• H10P72/743

  used as a support during manufacture of interconnect decals or build up layers · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title