Substrate processing apparatus, substrate processing method, and computer-readable recording medium having stored thereon substrate processing program

Patent metadata

Field	Value
Publication number	US-10475638-B2
Application number	US-201515307427-A
Country	US
Kind code	B2
Filing date	May 1, 2015
Priority date	May 1, 2014
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

A substrate processing apparatus includes a substrate rotating unit 11 configured to hold and rotate a substrate 3; a processing liquid supplying unit 13 configured to supply a processing liquid to the substrate; and a replacement liquid supplying unit 14 configured to supply, to the substrate, a replacement liquid with which the processing liquid supplied from the processing liquid supplying unit is replaced. While the replacement liquid supplying unit 14 supplies the replacement liquid to the substrate, the processing liquid supplying unit 13 supplies the processing liquid to a position on the substrate positioned at an outer peripheral side thereof than a supply position of the replacement liquid to form a liquid film of the processing liquid. It is possible to maintain a state in which the entire surface of the substrate is covered with the liquid film without increasing consumption amount of the replacement liquid.

First claim

We claim:

1. A substrate processing method, comprising:
a processing liquid main-supplying process of supplying a first processing liquid to a substrate which is being rotated;
a replacement liquid supplying process of supplying a replacement liquid to the substrate and forming a liquid film of the replacement liquid on the substrate by replacing the first processing liquid supplied to the substrate in the processing liquid main-supplying process; and
a processing liquid auxiliary-supplying process of forming a liquid film of a second processing liquid on the substrate by supplying the second processing liquid to a position on the substrate positioned at an outer peripheral side thereof than a supply position of the replacement liquid on the substrate while the replacement liquid is supplied to the substrate,
wherein a supply flow rate of the second processing liquid supplied in the processing liquid auxiliary-supplying process is set to be smaller than a supply flow rate of the first processing liquid supplied in the processing liquid main-supplying process.

2. The substrate processing method of claim 1 ,
wherein a liquid film of the first processing liquid is formed on an entire surface of the substrate in the processing liquid main-supplying process, and
in the processing liquid auxiliary-supplying process, the liquid film of the second processing liquid is formed on a region on the surface of the substrate positioned at the outer peripheral side thereof than a region on the surface of the substrate covered with the replacement liquid.

3. The substrate processing method of claim 1 ,
wherein the replacement liquid is supplied toward a central portion of the substrate in the replacement liquid supplying process, and
in the processing liquid auxiliary-supplying process, the second processing liquid is supplied while moving a supply position of the second processing liquid toward the outer peripheral side of the substrate.

4. The substrate processing method of claim 1 ,
wherein the supply of the second processing liquid in the processing liquid auxiliary-supplying process is begun before the supply of the replacement liquid on the substrate in the replacement liquid supplying process.

5. A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, controls a substrate processing apparatus comprising a substrate rotating unit configured to hold and rotate a substrate; a processing liquid supplying unit configured to supply a first processing liquid to the substrate; a replacement liquid supplying unit configured to supply to the substrate a replacement liquid with which the first processing liquid supplied from the processing liquid supplying unit is replaced; and a processing liquid auxiliary-supplying unit configured to supply a second processing liquid to the substrate,
wherein the computer-executable instructions cause the substrate processing apparatus to:
rotate the substrate by the substrate rotating unit;
supply the first processing liquid at a pre-determined supply flow rate to the substrate by the processing liquid supplying unit;
form a liquid film of the replacement liquid by supplying the replacement liquid to the substrate by the replacement liquid supplying unit; and
form a liquid film of the second processing liquid by supplying the second processing liquid from the processing liquid auxiliary-supplying unit to a position on the substrate positioned at an outer peripheral side thereof than a supply position of the replacement liquid on the substrate while the replacement liquid is supplied to the substrate,
wherein the second processing liquid is supplied at a flow rate which is smaller than the pre-determined supply flow rate of the first processing liquid.

Assignees

• Tokyo Electron Ltd

Inventors

• Shinohara Kazuyoshi
• Yoshida Yuki

Classifications

• F26B15/04

  in a horizontal plane · CPC title

• B08B3/024 Primary

  Cleaning by means of spray elements moving over the surface to be cleaned · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title