Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support

Patent metadata

Field	Value
Publication number	US-10468569-B2
Application number	US-201615574385-A
Country	US
Kind code	B2
Filing date	Apr 19, 2016
Priority date	May 15, 2015
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

First claim

The invention claimed is:

1. A method of producing at least one connection carrier, comprising:
A) providing a carrier plate with a planar top face,
C) applying at least one electrically conductive conductor strip to an adhesive surface of an insulation strip and cohesively connecting the insulation strip and the conductor strip, and
B) applying at least one electrically insulating insulation strip to the planar top face and cohesively connecting the carrier plate and the insulation strip,
wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip, and the insulation strip and the conductor strip are applied jointly to the carrier plate.

2. The method according to claim 1 , wherein the cohesive connection in step B) and/or the cohesive connection in step C) is performed using a laminating process and/or an adhesive bond.

3. The method according to claim 1 , wherein step A) and step C) and, optionally, step B) are performed using a reel-to-reel process.

4. The method according to claim 1 , wherein
prior to step B) a multiplicity of recesses is introduced into the carrier plate, and
the application in step C) proceeds such that the conductor strip covers over at least one of the recesses at least in places in a covered-over region of the recess.

5. The method according to claim 1 , wherein, after step C), in a further step D), a region of the conductor strip and a region of the insulation strip are folded over in the covered-over region of the recess,
the folded-over region of the conductor strip and the folded-over region of the insulation strip are then arranged on a side, remote from the carrier plate, of the non-folded-over region of the conductor strip, and
after folding-over, the conductor strip is covered up at the covered-over region of the recess by the folded-over region of the insulation strip.

6. A connection carrier for electronic components, comprising:
a carrier plate with a planar top face,
at least one electrically insulating insulation strip applied to the top face, and
at least one electrically conductive conductor strip applied to an adhesive surface, remote from the top face, of the insulation strip, wherein
the carrier plate and the insulation strip and the insulation strip and the conductor strip are in each case cohesively connected,
the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip,
the carrier plate is of multilayer configuration and comprises a base plate, a dielectric multilayer system and, optionally, a metallic reflective layer, and
the top face of the carrier plate has a reflectivity of at least 80% and at a wavelength of at least 430 nm and at most 700 nm.

7. The connection carrier according to claim 6 , wherein the connection carrier is not connectable using surface mounting (SMT).

8. The connection carrier according to claim 6 , wherein
the insulation strip covers the entire top face, and
the insulation strip is transparent.

9. The connection carrier according to claim 6 , wherein
the carrier plate is of multilayer configuration and comprises the base plate and a transparent coating, which is electrically insulating, and
an outer face, remote from the base plate, of the transparent coating forms the top face of the carrier plate.

10. The connection carrier according to claim 6 , wherein a region of the conductor strip and a region of the insulation strip is folded over in the region of the pockets,
the folded-over region of the conductor strip and the folded-over region of the insulation strip are arranged on a side, remote from the carrier plate, of the non-folded-over region of the conductor strip, and
the non-folded-over region of the conductor strip is covered in the region of the pockets by the folded-over region of the insulation strip.

11. The connection carrier according to claim 6 , wherein
an insulation strip is associated one-to-one with each conductor strip, and
the top face is of simply connected configuration.

12. The connection carrier according to claim 6 , wherein the at least one conductor strip has a length (L) and a width (B),
the width of the conductor strip amounts to at most 20% of the length of the conductor strip, and
along its length, the conductor strip covers at least 90% of the carrier plate and over its width at least 5% and at most 20% of the carrier plate.

13. The connection carrier according to claim 12 , wherein
the at least one insulation strip has a length and a width,
the length of the insulation strip amounts to at least the length of the conductor strip, and
the width of the insulation strip amounts to at least 100 m more than the width of the conductor strip and/or the width of the insulation strip corresponds to at least 1.25 times the width of the conductor strip.

14. The connection carrier according to claim 6 , wherein side faces of the carrier plate comprise a multiplicity of pockets formed by notches in the carrier plate and at least one of the pockets is covered over at least in part by the conductor strip.

15. The connection carrier according to claim 14 , wherein the side faces of the carrier plate are covered at least in the region of the pockets at least in part with an insulation layer.

16. An optoelectronic semiconductor component comprising:
the connection carrier according to claim 6 , and
at least one optoelectronic semiconductor chip with connection points, wherein
the at least one semiconductor chip is applied to a mounting surface of the carrier plate in a mounting region of the connection carrier, and
at least one connection point electrically conductively connects with the at least one conductor strip.

17. The optoelectronic semiconductor component according to claim 16 , wherein
the connection carrier comprises at least two conductor strips electrically insulated from the carrier plate by the at least one insulation strip, and
each connection point electrically conductively connects with at least one conductor strip.

18. A connection carrier for electronic components, comprising:
a carrier plate with a planar top face,
at least one electrically insulating insulation strip applied to the top face, and
at least one electrically conductive conductor strip applied to an adhesive surface, remote from the top face, of the insulation strip, wherein
the carrier plate and the insulation strip and the insulation strip and the conductor strip are in each case cohesively connected,
the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip, and
the connection carrier is not connectable using surface mounting (SMT).

Assignees

• Osram Gmbh
• Alanod Gmbh & Co Kg
• Heraeus Deutschland Gmbh & Co Kg
• Osram Opto Semiconductors Gmbh

Inventors

• Sorg Jörg Erich
• Ziegler Stefan
• Austgen Michael
• Peetsch Alexander
• Ditzel Eckhard
• Benedikt Michael

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/00

  Package configurations · CPC title

• B32B2307/20

  having particular electrical or magnetic properties, e.g. piezoelectric · CPC title