Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package

Patent metadata

Field	Value
Publication number	US-10461001-B2
Application number	US-201515527779-A
Country	US
Kind code	B2
Filing date	Nov 17, 2015
Priority date	Dec 11, 2014
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

This method for manufacturing a hermetic sealing lid member (1, 201, 301) includes forming a Ni plated metal plate (70, 170) by forming a Ni plated layer (11, 12, 41) on a surface of a metal plate (40) having a corrosion resistance and forming the hermetic sealing lid member by punching the Ni plated metal plate.

First claim

The invention claimed is:

1. A method for manufacturing a hermetic sealing lid member used for an electronic component housing package in which an electronic component is housed, comprising:
forming a Ni plated metal plate by forming a Ni plated layer on a surface of a metal plate made of an alloy having a corrosion resistance comprising Fe and 1 mass % or more of Cr; and
forming the hermetic sealing lid member by punching the Ni plated metal plate.

2. The method for manufacturing the hermetic sealing lid member according to claim 1 , further comprising slitting in which the metal plate or the Ni plated metal plate is cut into a plurality of the metal plates or a plurality of the Ni plated metal plates.

3. The method for manufacturing the hermetic sealing lid member according to claim 2 , wherein
the slitting includes slitting the metal plate or the Ni plated metal plate such that the metal plate or the Ni plated metal plate on which the slitting has been performed has a width larger by a machining allowance of at least twice a thickness of the hermetic sealing lid member than a width of the hermetic sealing lid member.

4. The method for manufacturing the hermetic sealing lid member according to claim 1 , wherein
the forming of the Ni plated metal plate includes forming the Ni plated layer on the surface of the metal plate by electrolytic Ni plating processing.

5. The method for manufacturing the hermetic sealing lid member according to claim 1 , wherein
the forming of the Ni plated metal plate includes forming the Ni plated layer on both or one of an upper surface -and a lower surface -of the metal plate having the corrosion resistance, and
the forming of the hermetic sealing lid member by the punching includes forming, by the punching of the Ni plated metal plate, the hermetic sealing lid member in which the Ni plated layer is not formed on a side surface -of the hermetic sealing lid member but is formed on both or one of an upper surface and a lower surface of the hermetic sealing lid member.

6. The method for manufacturing the hermetic sealing lid member according to claim 1 , wherein
the forming of the Ni plated metal plate includes continuously forming the Ni plated layer on the surface of the metal plate that is belt-like.

7. The method for manufacturing the hermetic sealing lid member according to claim 1 , wherein
the forming of the Ni plated metal plate includes setting a thickness of the Ni plated layer to 1% or more and 12.5% or less of a thickness of the metal plate.

8. The method for manufacturing the hermetic sealing lid member according to claim 7 , wherein
the forming of the Ni plated metal plate includes setting the thickness of the Ni plated layer to 2.5% or more and 7.5% or less of the thickness of the metal plate.

9. The method for manufacturing the hermetic sealing lid member according to claim 2 , wherein
the slitting is performed after the forming of the Ni plated metal plate and before the forming of the hermetic sealing lid member by the punching.

10. The method for manufacturing the hermetic sealing lid member according to claim 2 , wherein
the slitting is performed before the forming of the Ni plated metal plate.

11. A method for manufacturing an electronic component housing package, comprising:
forming a Ni plated metal plate by forming a Ni plated layer on a surface of a metal plate having a corrosion resistance;
forming a hermetic sealing lid member by punching the Ni plated metal plate; and
welding the hermetic sealing lid member to an electronic component housing member-in which an electronic component is housed by melting the Ni plated layer of the hermetic sealing lid member.

Assignees

• Hitachi Metals Ltd

Inventors

• Yokota Masayuki
• Yamamoto Masaharu

Classifications

• H03H9/02

  Details · CPC title

• H03H3/02

  for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W76/17

  characterised by their materials · CPC title