Substrate transfer mechanisms

US10453733B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10453733-B2
Application numberUS-201815905400-A
CountryUS
Kind codeB2
Filing dateFeb 26, 2018
Priority dateJan 9, 2015
Publication dateOct 22, 2019
Grant dateOct 22, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In one embodiment, a substrate support assembly includes a susceptor for supporting a substrate, and a supporting transfer mechanism coupled to the susceptor, the supporting transfer mechanism having a surface for supporting a peripheral edge of the substrate, the supporting transfer mechanism being movable relative to an upper surface of the susceptor.

First claim

Opening claim text (preview).

The invention claimed is: 1. A substrate support assembly, comprising: a susceptor for supporting a substrate, the susceptor having a recessed surface with one or more ridges extending therefrom; a supporting transfer mechanism coupled to the susceptor, the supporting transfer mechanism having a surface for supporting a peripheral edge of the substrate, the supporting transfer mechanism being movable relative to an upper surface of the susceptor; a plurality of lift pins for supporting the susceptor; and a plurality of support pins positioned radially outward of the plurality of lift pins. 2. The substrate support assembly of claim 1 , wherein the supporting transfer mechanism comprises a ring. 3. The substrate support assembly of claim 2 , wherein the ring has a first gap. 4. The substrate support assembly of claim 3 , wherein the ring has a second gap opposing the first gap. 5. The substrate support assembly of claim 3 , wherein the recessed surface is sized to receive the ring. 6. The substrate support assembly of claim 1 , wherein the supporting transfer mechanism comprises a plurality of ring segments. 7. The substrate support assembly of claim 6 , wherein the susceptor comprises a recessed portion sized to receive the ring segments. 8. The substrate support assembly of claim 1 , wherein each of the plurality of lift pins are independently movable relative to the plurality of support pins. 9. The substrate support assembly of claim 8 , wherein each of the support pins comprises a flared head disposed on a shaft. 10. The substrate support assembly of claim 9 , wherein the flared head comprises a sloped surface. 11. A substrate support assembly, comprising: a susceptor having a recessed surface with one or more ridges extending therefrom; a supporting transfer mechanism having a surface for supporting a substrate, the supporting transfer mechanism being movable relative to an upper surface of the susceptor and adapted to nest within the recessed surface of the susceptor; a plurality of lift pins for supporting the susceptor; and a plurality of support pins positioned radially outward of the plurality of lift pins. 12. The substrate support assembly of claim 11 , wherein the supporting transfer mechanism comprises a detachable support plate. 13. The substrate support assembly of claim 11 , wherein each of the one or more ridges comprise indexing features that interface with the supporting transfer mechanism. 14. The substrate support assembly of claim 11 , wherein the supporting transfer mechanism comprises a ring. 15. The substrate support assembly of claim 14 , wherein the ring has a first gap. 16. The substrate support assembly of claim 15 , wherein the ring has a second gap opposing the first gap. 17. The substrate support assembly of claim 11 , wherein the supporting transfer mechanism comprises a plurality of ring segments. 18. A substrate support assembly, comprising: a susceptor having a recessed surface with one or more ridges extending therefrom; a ring having a surface for supporting a substrate and sized to nest within the recessed surface, the ring being movable relative to an upper surface of the susceptor; a plurality of lift pins for supporting the susceptor; and a plurality of support pins positioned radially outward of the plurality of lift pins. 19. The substrate support assembly of claim 18 , wherein the ring has a first gap. 20. The substrate support assembly of claim 19 , wherein the ring has a second gap opposing the first gap.

Assignees

Inventors

Classifications

  • characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

  • characterised by edge profile or support profile · CPC title

  • the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

  • Horizontal transfer of a single workpiece · CPC title

  • mainly by radiation · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10453733B2 cover?
In one embodiment, a substrate support assembly includes a susceptor for supporting a substrate, and a supporting transfer mechanism coupled to the susceptor, the supporting transfer mechanism having a surface for supporting a peripheral edge of the substrate, the supporting transfer mechanism being movable relative to an upper surface of the susceptor.
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/7602. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).