Abatement and strip process chamber in a dual loadlock configuration

Patent metadata

Field	Value
Publication number	US-10453694-B2
Application number	US-201214002087-A
Country	US
Kind code	B2
Filing date	Feb 29, 2012
Priority date	Mar 1, 2011
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.

First claim

What is claimed is:

1. A load lock chamber, comprising:
a chamber body defining a first chamber volume and a second chamber volume isolated from one another, wherein the first chamber volume is selectively connectable to an ambient environment and a vacuum environment through first and second openings configured for substrate transferring, and the second chamber volume is configured for substrate processing in a plasma environment and is selectively connected to the ambient and vacuum environments through third and fourth openings;
a pressure control system operable to control pressures within the first chamber volume and the second chamber volume between ambient and vacuum conditions;
a heated substrate support assembly disposed in the second chamber volume, wherein the heated substrate support assembly is configured to support and heat a substrate thereon during plasma processing within the second chamber volume;
a lift hoop assembly disposed in the second chamber volume surrounding the heated substrate support assembly and configured to lift the substrate, the lift hoop assembly comprising a ring-shaped hoop body, a hoop liner disposed on the hoop body and extending vertically upwards from the hoop body defining a processing region therein, and three or more lifting fingers attached to the hoop body and extending vertically downwards below the hoop body and radially inwards from the hoop body; and
a remote plasma source connected to the second chamber volume configured to supply a plasma to the second chamber volume to ionize a gas mixture comprising an oxygen-containing gas, a hydrogen-containing gas, or an inert gas; and
a showerhead, wherein when in a lowered position, the hoop liner surrounds both the heated substrate support assembly and at least a portion of the showerhead.

2. The load lock chamber of claim 1 , further comprising a thermal insulator disposed within the second chamber volume between the heated substrate support assembly and the chamber body, wherein the heated substrate support assembly does not directly contact the chamber body.

3. The load lock chamber of claim 2 , wherein the chamber body comprises:
a first chamber body having a top wall, sidewalls, and a chamber bottom, wherein the top wall, sidewalls and chamber bottom define the first chamber volume;
a second chamber body stacked on the top wall of the first chamber body, wherein the second chamber body and the top wall of the first chamber body define the second chamber volume.

4. The load lock chamber of claim 3 , wherein the heated substrate support assembly comprises:
an upper heater plate having an upper surface for supporting a substrate thereon;
a lower heater plate attached to a lower surface of the upper heater plate; and
a heater disposed between the upper heater plate and the lower heater plate.

5. The load lock chamber of claim 4 , wherein the heated substrate support assembly further comprises a cantilever tube attached to a center of the lower heater plate.

6. The load lock chamber of claim 4 , wherein the heated substrate support assembly further comprises a chucking mechanism configured to chuck the substrate to the upper surface of the upper heater plate.

7. The load lock chamber of claim 3 , wherein the showerhead is disposed within a central opening defined by the second chamber body, and the showerhead is configured to provide processing gas to the second chamber volume.

8. The load lock chamber of claim 3 , further comprising a lamp assembly disposed above the second chamber body and configured to provide radiant energy towards the second chamber volume.

9. The load lock chamber of claim 3 , wherein a lower vacuum port is formed through the chamber bottom of the first chamber body, and the lower vacuum port provides a pumping channel to the first chamber volume.

10. The load lock chamber of claim 9 , wherein an upper vacuum port is formed through the sidewalls of the first chamber body, the upper vacuum port opens to the second chamber volume.

11. The load lock chamber of claim 1 , wherein the hoop body provides a circular confinement wall around the heated substrate support assembly.

12. The load lock chamber of claim 1 , wherein the the third and fourth openings are configured for substrate transferring.

13. The load lock chamber of claim 1 , further comprising a lid liner, the lid liner comprising an inner lip forming a central opening and configured to support the showerhead, the lid liner having a cavity formed within the lid liner and configured to receive the hoop liner within the cavity.

14. A load lock chamber, comprising:
a chamber body defining a second chamber volume stacked above a first chamber volume and isolated from one another, wherein the first chamber volume is selectively connectable to an ambient environment and a vacuum environment through first and second openings configured for substrate transferring, and the second chamber volume is configured for substrate processing in a plasma environment and is selectively connected to the ambient and vacuum environments through third and fourth openings;
a substrate support assembly disposed in the second chamber volume;
a lift hoop assembly disposed in the second chamber volume surrounding the heated substrate support assembly and configured to lift the substrate, the lift hoop assembly comprising a ring-shaped hoop body, a hoop liner disposed on the hoop body and extending vertically upwards from the hoop body defining a processing region therein; and
a showerhead, wherein when in a lowered position, the hoop liner surrounds both the heated substrate support assembly and the showerhead.

15. The load lock chamber of claim 14 , further comprising a thermal insulator disposed within the second chamber volume between the substrate support assembly and the chamber body, wherein the substrate support assembly does not directly contact the chamber body.

16. The load lock chamber of claim 14 , wherein the substrate support assembly comprises:
an upper heater plate having an upper surface for supporting a substrate thereon;
a lower heater plate attached to a lower surface of the upper heater plate;
a heater disposed between the upper heater plate and the lower heater plate; and
a cantilever tube attached to the center of the lower heater plate.

17. The load lock chamber of claim 14 , wherein the showerhead is disposed within a central opening defined by the second chamber body, and the showerhead is configured to provide processing gas to the second chamber volume.

18. The load lock chamber of claim 14 , further comprising a lamp assembly disposed above the second chamber volume and configured to provide radiant energy towards the second chamber volume.

19. The load lock chamber of claim 14 , wherein the hoop body provides a circular confinement wall around the substrate support assembly.

20. The load lock chamber of claim 14 , wherein the third and fourth openings are configured for substrate transferring.

Assignees

• Lee Jared Ahmad
• Salinas Martin Jeffrey
• Reuter Paul B
• Yousif Imad
• Pal Aniruddha
• Applied Materials Inc

Inventors

• Lee Jared Ahmad
• Salinas Martin Jeffrey
• Reuter Paul B
• Yousif Imad
• Pal Aniruddha

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0421 Primary

  for drying etching · CPC title

• H10P70/273

  the processing being a delineation of conductive layers, e.g. by RIE · CPC title

• H10P50/268

  of silicon-containing layers · CPC title