Spacer profile control using atomic layer deposition in a multiple patterning process

Patent metadata

Field	Value
Publication number	US-10446394-B2
Application number	US-201815881506-A
Country	US
Kind code	B2
Filing date	Jan 26, 2018
Priority date	Jan 26, 2018
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

Methods and apparatuses for spacer profile control using atomic layer deposition (ALD) in multi-patterning processes are described herein. A silicon oxide spacer is deposited over a patterned core material and a target layer of a substrate in a multi-patterning scheme. A first thickness of the silicon oxide spacer is deposited by multiple ALD cycles under a first oxidation condition that includes an oxidation time, a plasma power, and a substrate temperature. A second thickness of the silicon oxide spacer is deposited by multiple ALD cycles under a second oxidation condition, where the second oxidation condition is different than the first oxidation condition by one or more parameters. After etching the patterned core material, a resulting profile of the silicon oxide spacer is dependent at least in part on the first and second oxidation conditions.

First claim

What is claimed is:

1. A method comprising:
depositing, in a plasma chamber, a first thickness of a silicon oxide layer by atomic layer deposition (ALD) on a substrate, wherein the substrate includes a patterned core material and a target layer underlying the patterned core material, wherein depositing the first thickness of the silicon oxide layer by ALD includes exposing the substrate to a first dose of a silicon-containing precursor and exposing the substrate to plasma of an oxidant under a first oxidation condition;
depositing, in the plasma chamber, a second thickness of the silicon oxide layer by ALD on the substrate, wherein depositing the second thickness of the silicon oxide layer by ALD includes exposing the substrate to a second dose of the silicon-containing precursor and exposing the substrate to plasma of the oxidant under a second oxidation condition, the second oxidation condition being different from the first oxidation condition; and
etching, in the plasma chamber, a portion of the silicon oxide layer and the patterned core material to form a plurality of spacers, wherein the plurality of spacers comprise a remaining portion of the silicon oxide layer to serve as a mask for the target layer.

2. The method of claim 1 , wherein the second oxidation condition is different from the first oxidation condition by one or more of the following: (1) an oxidation time, (2) a radio-frequency (RE) power, and (3) a substrate temperature.

3. The method of claim 2 , wherein the oxidation time is between about 0.25 seconds and about 5 seconds for each of the first oxidation condition and the second oxidation condition.

4. The method of claim 2 , wherein the RF power is between about 100 Watts and about 10,000 Watts for each of the first oxidation condition and the second oxidation condition.

5. The method of claim 2 , wherein the substrate temperature is between about 0° C. and about 100° C. for each of the first oxidation condition and the second oxidation condition.

6. The method of claim 1 , wherein the second oxidation condition includes a second oxidation time and a second RF power and the first oxidation condition includes a first oxidation time and a first RF power, the second oxidation time being greater than the first oxidation time and the second RF power being greater than the first RF power.

7. The method of claim 1 , wherein the second oxidation condition includes a second oxidation time and a second RF power and the first oxidation condition includes a first oxidation time and a first RF power, the second oxidation time being less than the first oxidation time and the second RF power being less than the first RF power.

8. The method of claim 1 , wherein the second oxidation condition includes a second substrate temperature and the first oxidation condition includes a first substrate temperature, wherein the second substrate temperature is different from the first substrate temperature.

9. The method of claim 8 , further comprising:
ramping a temperature of a substrate support from the first substrate temperature to the second substrate temperature.

10. The method of claim 1 , wherein operations of depositing the first thickness of the silicon oxide layer, depositing the second thickness of the silicon oxide layer, and etching the portion of the silicon oxide layer and the patterned core material occur in the plasma chamber without introducing a vacuum break in between operations.

11. The method of claim 1 , wherein a pressure in the plasma chamber is between about 1 mTorr and about 100 mTorr.

12. The method of claim 1 , wherein etching the portion of the silicon oxide layer occurs prior to etching the patterned core material.

13. The method of claim 1 , wherein depositing the first thickness of the silicon oxide layer includes applying X number of cycles of: (i) exposing the substrate to the first dose of the silicon-containing precursor, and (ii) exposing the substrate to the plasma of the oxidant under the first oxidation condition, and wherein depositing the second thickness of the silicon oxide layer includes applying Y number of cycles of: (iii) exposing the substrate to the second dose of the silicon-containing precursor, and (iv) exposing the substrate to the plasma of the oxidant under the second oxidation condition, wherein X and Y are integer values different from one another.

14. The method of claim 13 , wherein the first oxidation condition includes a first oxidation time and the second oxidation condition includes a second oxidation time, the first oxidation time gradually changing across the X number of cycles and the second oxidation time gradually changing across the Y number of cycles.

15. The method of claim 13 , wherein the first oxidation condition includes a first RF power and the second oxidation condition includes a second RF power, the first RF power gradually changing across the X number of cycles and the second RF power gradually changing across the Y number of cycles.

16. The method of claim 13 , wherein exposing the substrate to plasma of the oxidant under the first oxidation condition includes converting the first dose of the silicon-containing precursor to form the first thickness of the silicon oxide layer, and wherein exposing the substrate to plasma of the oxidant under the second oxidation condition includes converting the second dose of the silicon-containing precursor to form the second thickness of the silicon oxide layer.

17. The method of claim 1 , wherein the oxidant includes oxygen gas.

18. The method of claim 1 , wherein the patterned core material includes a material selected from the group consisting of spin-on carbon, diamond-like carbon, and gapfill ashable hard mask.

19. The method of claim 1 , wherein an upper portion of each of the plurality of spacers has a slope, wherein the slope is dependent at least in part on the first oxidation condition and the second oxidation condition.

20. An apparatus for controlling a slope of a plurality of silicon oxide spacers, the apparatus comprising:
a plasma chamber;
an RF power supply coupled to the plasma chamber and configured to deliver RF power to the plasma chamber;
a substrate support for supporting a substrate in the plasma chamber, wherein the substrate includes a patterned core material and a target layer under the patterned core material; and
a controller configured to perform the following instructions:
(i) deposit, in the plasma chamber, a first thickness of a silicon oxide layer by atomic layer deposition (ALD) on the substrate, wherein depositing the first thickness of the silicon oxide layer by ALD includes exposing the substrate to a first dose of a silicon-containing precursor and exposing the substrate to plasma of an oxidant under a first oxidation condition;
(ii) deposit, in the plasma chamber, a second thickness of the silicon oxide layer by ALD on the first thickness of the silicon oxide layer, wherein depositing the second thickness of the silicon oxide layer by ALD includes exposing the substrate to a second dose of the silicon-containing precursor and exposing the substrate to plasma of the oxidant under a second oxidation condition, the second oxidation condition being different from the first oxidation condition; and
(iii) etch, in the plasma chamber, a portion of the silicon oxide layer and the patterned core material to form a plurality of spacers, wherein the plurality of spacers comprise a remaining portion of the silicon oxide layer to serve as a mask for the target layer.

Assignees

• Lam Res Corp

Inventors

• Abatchev Mirzafer
• Fu Qian
• Yamaguchi Yoko
• Eppler Aaron

Classifications

• H10P50/283

  by chemical means · CPC title

• H10P14/69215 Primary

  the material being a silicon oxide, e.g. SiO2 · CPC title

• H10P14/6519

  the substance being oxygen · CPC title

• H10P14/6339 Primary

  deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title

• H10P14/6336

  in the presence of a plasma [PECVD] · CPC title