Sidewall passivation for plasma etching
US-12334354-B2 · Jun 17, 2025 · US
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Eppler Aaron patents
Eppler Aaron is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Eppler Aaron |
| Total patents | 16 |
| First publication | Mar 26, 2015 |
| Latest publication | Jun 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Reducing aspect ratio dependent etch with direct current bias pulsing
US-12237149-B2 · Feb 25, 2025 · US
Reducing aspect ratio dependent etch with direct current bias pulsing
US-2024162007-A1 · May 16, 2024 · US
Sidewall passivation for plasma etching
US-2023245895-A1 · Aug 3, 2023 · US
System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US-10763142-B2 · Sep 1, 2020 · US
Spacer profile control using atomic layer deposition in a multiple patterning process
US-10446394-B2 · Oct 15, 2019 · US
Spacer profile control using atomic layer deposition in a multiple patterning process
US-2019237330-A1 · Aug 1, 2019 · US
High aspect ratio etch of oxide metal oxide metal stack
US-10242883-B2 · Mar 26, 2019 · US
High aspect ratio etch of oxide metal oxide metal stack
US-2018374712-A1 · Dec 27, 2018 · US
System, method and apparatus for ion milling in a plasma etch chamber
US-9899227-B2 · Feb 20, 2018 · US
Recent patents
Latest publications not already listed above.
High aspect ratio etch with combination mask
US-9659783-B2 · May 23, 2017 · US
Systems and Methods for Separately Applying Charged Plasma Constituents and Ultraviolet Light in a Mixed Mode Processing Operation
US-2017040170-A1 · Feb 9, 2017 · US
System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US-2016370796-A1 · Dec 22, 2016 · US
High aspect ratio etch with combination mask
US-2015200106-A1 · Jul 16, 2015 · US
High aspect ratio etch with combination mask
US-9018103-B2 · Apr 28, 2015 · US
High aspect ratio etch with combination mask
US-2015087154-A1 · Mar 26, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 12 |
| Applied Materials Inc | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/73 | 8 |
| H10P50/283 | 6 |
| H10P50/695 | 6 |
| H10P50/692 | 6 |
| H10P50/642 | 6 |