Composite electronic component

Patent metadata

Field	Value
Publication number	US-2016372265-A1
Application number	US-201615176564-A
Country	US
Kind code	A1
Filing date	Jun 8, 2016
Priority date	Jun 16, 2015
Publication date	Dec 22, 2016
Grant date	—

Abstract

A composite electronic component includes a first and second electronic elements, and a joint material. The first electronic element includes a base member, and an upper surface conductor on an upper surface of the base member. The second electronic element includes an element body with a lower surface facing the upper surface of the base member, and a terminal conductor disposed on the lower surface of the element body. The joint material joins the upper surface conductor and the terminal conductor. The upper surface conductor includes a conductive layer in which a metal that is maximum in weight ratio is Ag. The lateral surface of the conductive layer is covered with conductive layers defining a protective metal film, and the metal that is maximum in weight ratio contained in the conductive layers defining a protective metal film is a metal other than Ag and Cu.

First claim

What is claimed is:

1 . A composite electronic component comprising:
a first electronic element; a second electronic element mounted on the first electronic element in a height direction; and a joint material joining the first electronic element and the second electronic element; wherein the first electronic element includes an insulating base member including an upper surface intersecting with the height direction, and an upper surface conductor disposed on the upper surface of the base member; the second electronic element includes an element body including a lower surface facing the upper surface of the base member in the height direction, and a terminal conductor disposed on at least a portion of the lower surface of the element body; the joint material joins at least a portion of the upper surface conductor and at least a portion of the terminal conductor; the upper surface conductor includes a conductive layer containing Ag or Cu as a metal component that is maximum in weight ratio; at least a portion of the lateral surface of the conductive layer is covered with a protective metal film; the metal component that is maximum in weight ratio contained in the protective metal film is a metal other than Ag and Cu.

2 . The composite electronic component according to claim 1 , wherein the metal component that is maximum in weight ratio contained in the protective metal film is any one of Sn, Ni, Au and Pb.

3 . The composite electronic component according to claim 1 , wherein the protective metal film is a covering conductive layer that covers the upper surface and the lateral surfaces of the conductive layer contained in the upper surface conductor.

4 . The composite electronic component according to claim 3 , wherein the protective metal film is a plating layer.

5 . The composite electronic component according to claim 1 , wherein the protective metal film is part of the joint material.

6 . The composite electronic component according to claim 1 , wherein the upper surface conductor is smaller than the terminal conductor in any directions orthogonal to the height direction.

7 . The composite electronic component according to claim 1 , wherein a thickness of the upper surface conductor is greater than or equal to about 5 μm.

8 . The composite electronic component according to claim 1 , wherein
the upper surface conductor includes a first upper surface conductor and a second upper surface conductor that are separated from each other in a length direction orthogonal to the height direction, and a third upper surface conductor located between the first upper surface conductor and the second upper surface conductor; the terminal conductor includes a first terminal conductor and a second terminal conductor that are separated from each other in the length direction; the first terminal conductor is joined with the first upper surface conductor by the joint material; and the second terminal conductor is joined with the second upper surface conductor by the joint material.

9 . The composite electronic component according to claim 8 , wherein
the first upper surface conductor is located between each end of the first terminal conductor in a width direction orthogonal to the height direction and the length direction; the second upper surface conductor is located between each end of the second terminal conductor in the width direction; of the lateral surfaces of the first upper surface conductor, the lateral surface orthogonal to the width direction is covered with the protective metal film; and of the lateral surfaces of the second upper surface conductor, the lateral surface orthogonal to the width direction is covered with the protective metal film.

10 . The composite electronic component according to claim 9 , wherein a dimension in the width direction of the base member is larger than a dimension in the width direction of the second electronic element.

11 . The composite electronic component according to claim 8 , wherein
the first upper surface conductor is located between an outer end of the first terminal conductor and an outer end of the second terminal conductor in the length direction; the second upper surface conductor is located between the outer end of the first terminal conductor and the outer end of the second terminal conductor in the length direction; of the lateral surfaces of the first upper surface conductor, the lateral surface orthogonal to the length direction is covered with the protective metal film; and of the lateral surfaces of the second upper surface conductor, the lateral surface orthogonal to the length direction is covered with the protective metal film.

12 . The composite electronic component according to claim 11 , wherein a dimension in the length direction of the base member is larger than a dimension in the length direction of the second electronic element.

13 . The composite electronic component according to claim 8 , wherein
the element body includes a plurality of dielectric layers and a plurality of conductive layers that are laminated; and the first electronic element includes a resistor that is disposed on the upper surface of the base member and connected with the third upper surface conductor.

14 . The composite electronic component according to claim 13 , wherein
the upper surface conductor includes a fourth upper surface conductor located between the first upper surface conductor and the second upper surface conductor; and the resistor is connected with the fourth upper surface conductor.

15 . The composite electronic component according to claim 1 , wherein
the upper surface conductor includes a first upper surface conductor and a second upper surface conductor that are separated from each other in a length direction orthogonal to the height direction; the terminal conductor includes a first terminal conductor and a second terminal conductor that are separated from each other in the length direction; the first terminal conductor is joined with the first upper surface conductor by the joint material; the second terminal conductor is joined with the second upper surface conductor by the joint material; the first electronic element includes a lower surface conductor disposed on the lower surface thereof opposite to the upper surface of the base member; the lower surface conductor includes a first lower surface conductor and a second lower surface conductor that are separated from each other in the length direction, and a third lower surface conductor located between the first lower surface conductor and the second lower surface conductor; the element body includes a plurality of dielectric layers and a plurality of conductive layers that are laminated; and the first electronic element includes inductor wiring that is disposed inside the base member and is electrically connected with the third lower surface conductor.

16 . The composite electronic component according to claim 15 , wherein
the lower surface conductor includes a fourth lower surface conductor located between the first lower surface conductor and the second lower surface conductor; and the inductor wiring is electrically connected with the fourth lower surface conductor.

Assignees

• Murata Manufacturing Co

Inventors

• Hattori Kazuo
• Fujimoto Isamu
• Kuroiwa Shinichiro

Classifications

• H01G4/40 Primary

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title