Composite electronic component and board having the same

Patent metadata

Field	Value
Publication number	US-9520244-B2
Application number	US-201414334437-A
Country	US
Kind code	B2
Filing date	Jul 17, 2014
Priority date	Jul 18, 2013
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

A composite electronic component may include: a composite element in which a capacitor and an inductor are spaced apart from each other, the capacitor including a ceramic body, and the inductor including a magnetic body; a first external electrode disposed on a second end surface of the ceramic body, second external electrodes disposed on first and second side surfaces of the ceramic body, a first dummy electrode disposed on a first end surface of the ceramic body; and third and fourth external electrodes disposed on first and second end surfaces of the magnetic body. The composite element may include a first metal frame disposed on a first end surface of the composite element, a second metal frame disposed on a second end surface of the composite element, and third metal frames disposed on one or more of first and second side surfaces of the composite element.

First claim

What is claimed is:

1. A composite electronic component comprising:
a composite element including a capacitor and an inductor spaced apart from each other by a vacant space forming a predetermined distance in a stacking direction, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with each of the dielectric layers interposed therebetween are stacked, the first internal electrodes being exposed to a second end surface of the ceramic body and the second internal electrodes having lead-out portions exposed to first and second side surfaces of the ceramic body, respectively, and the inductor including a magnetic body in which conductive patterns and a plurality of magnetic sheets are stacked;
a first external electrode disposed on the second end surface of the ceramic body and electrically connected to the first internal electrodes, second external electrodes disposed on the first and second side surfaces of the ceramic body and electrically connected to the second internal electrodes, a first dummy electrode disposed on a first end surface of the ceramic body; and
third and fourth external electrodes disposed on first and second end surfaces of the magnetic body, respectively, and connected to the conductive patterns,
wherein the composite element includes a first metal frame disposed on a first end surface of the composite element in order to connect the first dummy electrode and the third external electrode to each other to form an input terminal, a second metal frame disposed on a second end surface of the composite element in order to connect the first external electrode and the fourth external electrode to each other to form an output terminal, and third metal frames disposed on one or more of first and second side surfaces of the composite element in order to form a ground terminal formed of the second external electrodes.

2. The composite electronic component of claim 1 , wherein the inductor and the capacitor are connected to each other in series.

3. The composite electronic component of claim 1 , wherein the inductor is disposed above the capacitor.

4. The composite electronic component of claim 1 , wherein the first to third metal frames include contact portions contacting the composite element and bent portions bent and extended from the contact portions in order to contact electrode pads on a board, respectively.

5. The composite electronic component of claim 4 , wherein the bent portions are spaced apart from a lower surface of the composite element by a predetermined interval.

6. The composite electronic component of claim 1 , wherein the composite element has a marking part disposed on an upper surface of the composite element.

7. A board having a composite electronic component, comprising:
a printed circuit board having three or more electrode pads disposed thereon;
the composite electronic component of claim 1 mounted on the printed circuit board; and
solders connecting the electrode pads and the composite electronic component to each other.

8. The board having a composite electronic component of claim 7 , wherein the electrode pads include a first electrode pad connected to the input terminal through the first metal frame of the composite electronic component, a second electrode pad connected to the output terminal through the second metal frame of the composite electronic component, and a third electrode pad connected to the ground terminal through the third metal frames of the composite electronic component.

9. A composite electronic component comprising:
an input terminal receiving power converted by a power managing unit;
a power stabilizing unit stabilizing the power and including a composite element in which a capacitor and an inductor are spaced apart from each other by a vacant space forming a predetermined distance in a stacking direction, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with each of the dielectric layers interposed therebetween are stacked, the first internal electrodes being exposed to a second end surface of the ceramic body and the second internal electrodes having lead-out portions exposed to first and second side surfaces of the ceramic body, respectively, and the inductor including a magnetic body in which conductive patterns and a plurality of magnetic sheets are stacked;
an output terminal supplying the stabilized power; and
a ground terminal for grounding,
wherein the input terminal is connected to a first metal frame disposed on a first end surface of the composite element, the output terminal is connected to a second metal frame disposed on a second end surface of the composite element, and the ground terminal is connected to third metal frames disposed on one or more of first and second side surfaces of the composite element.

10. The composite electronic component of claim 9 , wherein the input terminal is formed of a first dummy electrode disposed on a first end surface of the ceramic body and a third external electrode disposed on a first end surface of the magnetic body and connected to the conductive patterns,
the output terminal is formed of a first external electrode disposed on a second end surface of the ceramic body and electrically connected to the first internal electrodes and a fourth external electrode disposed on a second end surface of the magnetic body and connected to the conductive patterns, and
the ground terminal is formed of second external electrodes disposed on the first and second side surfaces of the ceramic body and electrically connected to the second internal electrodes.

11. The composite electronic component of claim 9 , wherein the inductor and the capacitor are connected to each other in series.

12. The composite electronic component of claim 9 , wherein the inductor is disposed above the capacitor.

13. The composite electronic component of claim 9 , wherein the first to third metal frames include contact portions contacting the composite element and bent portions extended and bent from the contact portions in order to contact electrode pads on a board, respectively.

14. The composite electronic component of claim 13 , wherein the bent portions are spaced apart from a lower surface of the composite element by a predetermined interval.

15. The composite electronic component of claim 9 , wherein the composite element has a marking part disposed on an upper surface of the composite element.

16. A board having a composite electronic component, comprising:
a printed circuit board having three or more electrode pads disposed thereon;
the composite electronic component of claim 9 mounted on the printed circuit board; and
solders connecting the electrode pads and the composite electronic component to each other.

17. The board having a composite electronic component of claim 16 , wherein the electrode pads include a first electrode pad connected to the input terminal through the first metal frame of the composite electronic component, a second electrode pad connected to the output terminal through the second metal frame of the composite electronic component, and a third electrode pad connected to the ground terminal through the third metal frames of the composite electronic component.

Assignees

• Samsung Electro Mech

Inventors

• Park Min Cheol
• Lee Byoung Hwa
• Park Sang Soo
• Ahn Young Ghyu

Classifications

• H05K1/0233

  Filters, inductors or a magnetic substance · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/1031

  Surface mounted metallic connector elements · CPC title

• H05K2201/10515

  Stacked components · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title